47999 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
Sub-classes:BOULES WITH BOULE-HANDLING CARRIER PROCESSING METHODS
#2DIVIDING METHOD OF WORKPIECE
#3WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
#4Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
#5Dividing device for wafer
#6Apparatus for dividing workpiece
#7Method for dividing substrate along division lines using abrasive member having projection for cutting substrate
#8METHOD OF PROCESSING WORKPIECE
#9Method of processing a wafer and wafer processing system
#10Wafer divider and wafer division method
#11Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
#12Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
#13DEVICE FOR SEPARATION OF A STACKED STRUCTURE AND ASSOCIATED METHOD
#14WORKING METHOD FOR SAPPHIRE SUBSTRATE
#15Device and method for cutting off substrate of fragile material
#16Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension
#17Sheet separation through fluid impact
#18Processing method of wafer
#19Scribing system with particle remover
#20Apparatus and method for the low-contamination, automatic crushing of silicon fragments