48002 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
Semiconductor chip manufacturing device and method of manufacturing semiconductor chips
#2Planarization process, apparatus and method of manufacturing an article
#3Processing apparatus including a water collection pan
#4SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBSTRATES
#5Material sheet handling system and processing methods
#6Automated dicing tool for semiconductor substrate materials