48015 ⎘
Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
Sub-classes:Processing apparatus
#2Semiconductor sawing method and system
#3Chuck table and processing apparatus including the same
#4CUTTING BLADE DETECTING MECHANISM FOR CUTTING APPARATUS
#5Cutting system and method for a cutting system
#6Workpiece support jig
#7CUTTING APPARATUS
#8Singulation apparatus and method
#9METHOD OF CUTTING A MOTHER SUBSTRATE [as amended]
#10Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor
#11Apparatus for manufacturing seeds for polycrystalline silicon manufacture
#12Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut thereby
#13Methods for separating electronic components utilizing a manipulator to transport the electronic components between first and second cutting tools
#14DRIVING MECHANISM AND CUTTING APPARATUS HAVING THE DRIVING MECHANISM
#15Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
#16Sawing Apparatus and a Control Method for Manufacturing Processes of Semiconductor Package
#17Dicing apparatus and dicing method
#18Group encapsulated dicing chuck
#19Group encapsulated dicing chuck
#20Cutting machine
#21Group encapsulated dicing chuck
#22Dicing saw with variable indexing capability
#23Group encapsulated dicing chuck
#24Cutting machine for plate-shaped material