83896 ⎘
Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
#2MEMS COMPONENT COMPRISING A MEMS ELEMENT HAVING A CAVITY AND COMPRISING AN ASIC COMPONENT
#3MEMS Sensor Module
#4SEMICONDUCTOR DEVICE AND OPERATING METHOD THEREOF
#5PACKAGED MEMS DEVICE HAVING A HUMIDITY SENSOR
#6Gamepad Microphone
#7COMPONENT WITH IMPROVED ADHESIVE BLEED-OUT CLEARANCE
#8MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
#9INTEGRATED MEMS MICROPHONE PERFORMANCE ENHANCEMENT WITH A MEMBRANE
#10Monolithic Microelectromechanical Systems Based Spatial Light Modulators Including Ribbon-Type Modulators
#11Monolithic Microelectromechanical Systems Based Spatial Light Modulators with Two-dimensional Modulators
#12DROP RESISTANT MEMS ACTUATOR-IMAGER ASSEMBLY PACKAGE
#13DIRECTIONAL MICROPHONE
#14BYPASS STRUCTURE
#15SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#16USE OF MEMS PACKAGES AS ANTENNA SUBSTRATE
#17OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME
#18FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
#19INTEGRATED MEMS OPTICAL SWITCH WITH PIEZOELECTRIC MEMS ACTUATORS
#20FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE
#21MEMS Microphone
#22SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
#23OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME
#24MICROMECHANICAL COMPONENT AND SCANNING DEVICE
#25DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#26DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#27CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
#28MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
#29Bottom electrode via structures for micromachined ultrasonic transducer devices
#30Reduced light reflection package
#31DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFORMANCES AND MANUFACTURING PROCESS THEREOF
#32HIGH ACCURACY TEMPERATURE-COMPENSATED PIEZORESISTIVE POSITION SENSING SYSTEM
#33MEMS PRESSURE SENSOR
#34MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
#35MEMS MICROPHONE PACKAGE
#36Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate
#37MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE
#38MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE AND NOISE CANCELLATION METHOD
#39Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#40MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD
#41ACCELEROMETER-BASED ACOUSTIC BEAMFORMER VECTOR SENSOR WITH COLLOCATED MEMS MICROPHONE
#42MEMS DEVICE WITH INTEGRATED CMOS CIRCUIT
#43MEMS MICROPHONE
#44PHOTOSENSITIVE TRANSISTOR, METHOD FOR MANUFACTURING A PHOTOSENSITIVE TRANSISTOR, AND MICROFLUIDIC CHIP
#45COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROPERTIES
#46Attachment of Stress Sensitive Integrated Circuit Dies
#47INERTIAL MEASUREMENT UNIT
#48Electronic acoustic devices, MEMS microphones, and equalization methods
#49WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
#50Signal processing method and device of mems microphone and mems microphone
#51Semiconductor structure and formation thereof
#52ENHANCED MEMS SENSOR EMBEDDED HEATER
#53Bottom electrode via structures for micromachined ultrasonic transducer devices
#54Micro-electro-mechanical-system structures and applications thereof
#55MEMS phase shifter including a substrate with a coplanar waveguide signal structure formed thereon and electrically insulated from a metal film bridge
#56Device for protecting FEOL element and BEOL element
#57MEMS microphone and MEMS accelerometer on a single substrate
#58Micro-electro mechanical system and manufacturing method thereof
#59Integrated digital force sensors and related methods of manufacture
#60CMOS-MEMS humidity sensor
#61Reduced light reflection package
#62Low stress integrated device package
#63Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#64Electronic device and corresponding method
#65Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#66Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragm
#67Bypass structure
#68Active matrix programmable mirror
#69Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#70INTERCONNECTION FOR MONOLITHICALLY INTEGRATED STACKED DEVICES AND METHODS OF FORMING THEREOF
#71Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#72Sensor package and method of producing the sensor package
#73MEMS capacitor microphone
#74Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS
#75SEMICONDUCTOR CHIP
#76MEMS pressure sensor
#77Optical electronics device
#78CMOS ultrasonic transducers and related apparatus and methods
#79Method of making ohmic contact on low doped bulk silicon for optical alignment
#80Method of making ohmic contact on low doped bulk silicon for optical alignment
#81Fabrication method for a MEMS device
#82Integrated structure of mems microphone and air pressure sensor and fabrication method thereof
#83Microelectromechanical device with signal routing through a protective cap
#84Attachment of stress sensitive integrated circuit dies
#85Bottom electrode via structures for micromachined ultrasonic transducer devices
#86Nano-electromechanical system (NEMS) device structure and method for forming the same
#87Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
#88MULTI-CAVITY PACKAGE FOR ULTRASONIC TRANSDUCER ACOUSTIC MODE CONTROL
#89MEMS microphone
#90Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#91Microelectromechanical component and method for producing same
#92Bypass structure
#93MEMS pressure sensor
#94Fence structure to prevent stiction in a MEMS motion sensor
#95Device for protecting FEOL element and BEOL element
#96Bypass structure
#97Method of making ohmic contact on low doped bulk silicon for optical alignment
#98MEMS TRANSDUCER PACKAGE AND A MEMS DEVICE INCLUDING THE SAME
#99Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#100MEMS device
#101LIQUID PROOF PRESSURE SENSOR
#102CMOS ultrasonic transducers and related apparatus and methods
#103Integrated digital force sensors and related methods of manufacture
#104Sensor package and method of producing the sensor package
#105Overmolded lead frame assembly for pressure sensing applications
#106Method for fabricating MEMS device integrated with a semiconductor integrated circuit
#107Sound producing device
#108Sound producing device
#109CMOS ultrasonic transducers and related apparatus and methods
#110Method of fabricating semiconductor structure
#111Monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS and method for producing the same
#112Synthetic resin molded article and method for producing the same
#113Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#114MEMS method and structure
#115Biocompatible monolithically integrated sensor, in particular for an active implantable medical device
#116Device for protecting FEOL element and BEOL element
#117Monolithic integration of PMUT on CMOS
#118Micro-device having a metal-semiconductor compound layer protected against HF etching and method for making the same
#119Fence structure to prevent stiction in a MEMS motion sensor
#120MEMS device package and method for manufacturing the same
#121Method for manufacturing semiconductor device
#122Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus
#123Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#124Microelectromechanical system structure and method for fabricating the same
#125MEMS devices and processes
#126MEMS devices and processes
#127ELECTROSTATIC ACOUSTIC TRANSDUCER
#128Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#129Nano-electromechanical system (NEMS) device structure and method for forming the same
#130Device arrangement
#131Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS process
#132Transducer apparatus and methods
#133Optical electronics device
#134Semiconductor element and methods for manufacturing the same
#135MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof
#136INERTIA SENSOR
#137Monolithic integrated device
#138CMOS ultrasonic transducers and related apparatus and methods
#139MEMS sensor package systems and methods
#140MEMS structure with bilayer stopper and method for forming the same
#141Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#142Integrating MEMS structures with interconnects and vias
#143Two-port SRAM connection structure
#144MEMS transducer package
#145MEMS transducer package
#146MEMS structure and method of fabricating the same
#147Support pillar
#148Vertical system integration
#149Microelectromechanical system structure including thermal stability layer whose material has higher growth temperature, and method for fabricating the same
#150Dry scribing methods, devices and systems
#151Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
#152Support pillar
#153Support pillar
#154Microelectromechanical device with signal routing through a protective cap
#155Semiconductor structure and manufacturing method thereof
#156PACKAGING FOR MEMS TRANSDUCERS
#157Pinched doped well for a junction field effect transistor (JFET) isolated from the substrate
#158Method of manufacturing semiconductor devices with transistor cells and semiconductor device
#159Structure for device with integrated microelectromechanical systems
#160INTEGRATED MEMS TRANSDUCER AND CIRCUITRY
#161Integrated capacitive humidity sensor
#162Micromechanical structure
#163CMOS ultrasonic transducers and related apparatus and methods
#164Integrated MEMS transducers
#165Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object
#166Nano-electromechanical system (NEMS) device structure and method for forming the same
#167MEMS resonator
#168MEMS device structure with a capping structure
#169Electrical tuning of resonant scanning
#170INTEGRATED MEMS-CMOS DEVICES AND INTEGRATED CIRCUITS WITH MEMS DEVICES AND CMOS DEVICES
#171Display device, method of manufacturing the same, display method, and wearable device
#172Pressure sensor and method for producing the pressure sensor
#173Microphone having increased rear volume, and method for production thereof
#174Refractory seed metal for electroplated MEMS structures
#175MEMS CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#176CMOS ultrasonic transducers and related apparatus and methods
#177Silicon microphone with suspended diaphragm and system with the same
#178Double-side process silicon MOS and passive devices for RF front-end modules
#179Optical electronic device and method of fabrication
#180MEMS component including a sound-pressure-sensitive diaphragm element
#181Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#182Semiconductor device and method including an intertial mass element
#183Microstructure plating systems
#184MEMS microphone
#185Integrated circuit with a pressure sensor
#186Two-port SRAM connection structure
#187Integration of active devices with passive components and MEMS devices
#188MEMS chip package
#189Semiconductor sensing structure and manufacturing method thereof
#190Semiconductor device and method for manufacturing the same
#191Chip structure
#192Pressure sensor package with stress isolation features
#193Support pillar
#194MEMS method and structure
#195Internally generated DFT stepped hysteresis sweep for electrostatic MEMS
#196Integration of active devices with passive components and MEMS devices
#197Semiconductor pressure sensor and method of fabricating same
#198MEMS device and fabrication method
#199CMOS ultrasonic transducers and related apparatus and methods
#200Semiconductor element and methods for manufacturing the same
#201MEMS microphone and method for forming the same
#202MEMS pressure sensor and method for forming the same
#203MEMS PRESSURE SENSOR AND METHOD FOR FORMING THE SAME
#204MEMS components and method of wafer-level manufacturing thereof
#205System and method for an integrated transducer and temperature sensor
#206SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
#207Device and method for protecting FEOL element and BEOL element
#208Substrate structure, semiconductor structure and method for fabricating the same
#209SYSTEMS AND METHODS FOR HORIZONTAL INTEGRATION OF ACCELERATION SENSOR STRUCTURES
#210Microelectromechanical systems devices with improved reliability
#211MEMS sensor and a semiconductor package
#212Microelectromechanical device with signal routing through a protective cap
#213CAVITY PACKAGE DESIGN
#214MEMS device with a capping substrate
#215PIEZOELECTRIC MICROPHONE WITH INTEGRATED CMOS
#216Methods for stiction reduction in MEMS sensors
#217Glass wafer assembly
#218Cavity structures for MEMS devices
#219Smart sensor for always-on operation
#220System on a chip using integrated MEMS and CMOS devices
#221MEMS device and method of manufacturing the same
#222Method for producing a microelectromechanical device and microelectromechanical device
#223MEMS device and method for manufacturing the same
#224Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices
#225Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit
#226Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices
#227Stress-controlled formation of TiN hard mask
#228Semiconductor device and method of manufacturing
#229Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration
#230Thin-film transistors incorporated into three dimensional MEMS structures
#231Cup-like getter scheme
#232Technique for forming a MEMS device
#233Flexible high-voltage thin film transistors
#234Micromechanical acceleration sensor having conductor tracks and cavities
#235MEMS device with a capping substrate
#236Cavity structures for MEMS devices
#237Transducer, and manufacturing method of the transducer
#238CMOS compatible silicon differential condenser microphone and method for manufacturing the same
#239Microelectromechanical device with signal routing through a protective cap
#240CMOS ultrasonic transducers and related apparatus and methods
#241Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit
#242Hermetic wafer level packaging
#243Packaging system and process for inertial sensor modules using moving-gate transducers
#244MEMS sensor package systems and methods
#245MEMS packaging scheme using dielectric fence
#246Substrate with multiple encapsulated devices
#247MEMS microphone and method for packaging the same
#248Integrated circuit with pressure sensor having a pair of electrodes
#249Method for fabricating MEMS device with protection rings
#250MEMS pressure sensor device and manufacturing method thereof
#251INTEGRATED MEMS DEVICE
#252Micro-electro-mechanical system (MEMS) structures and design structures
#253Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch
#254Method for producing a microelectromechanical device and microelectromechanical device
#255Bond pad structure and fabricating method thereof
#256Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration
#257MICROELECTRONIC COMPONENT
#258Package interconnects
#259HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS
#260CMOS compatible MEMS microphone and method for manufacturing the same
#261Dynamic quantity sensor device and manufacturing method of the same
#262Nano-electro-mechanical system (NEMS) structures with actuatable semiconductor fin on bulk substrates
#263MEMS component and a semiconductor component in a common housing having at least one access opening
#264MEMS device etch stop
#265High-voltage MEMS apparatus and method
#266Electrical bypass structure for MEMS device
#267CAVITY STRUCTURES FOR MEMS DEVICES
#268MEMS and protection structure thereof
#269Method of fabricating sensors having functionalized resonating beams
#270Method for manufacturing a microelectromechanical component; and a microelectromechanical component
#271IC manufacturing method, IC and apparatus
#272Hermetic wafer level packaging
#273Pressure sensor package systems and methods
#274Wireless self-powered monolithic integrated capacitive sensor and method of manufacture
#275MEMS integrated chip with cross-area interconnection
#276Method for fabricating MEMS device
#277MEMS integrated chip with cross-area interconnection
#278Integrated battery and IC
#279Integrated system on chip using multiple MEMS and CMOS devices
#280Method for fabricating through substrate microchannels
#281Integrated circuit and fabricating method thereof
#282Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same
#283Method for fabricating MEMS device
#284Thin film wafer level package
#285Method for Manufacturing Microelectronic Devices and Devices According to Such Methods
#286Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device
#287Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component
#288Method of wafer-level fabrication of MEMS devices
#289CMOS-MEMS cantilever structure
#290Configurable power supply using MEMS switch
#291METHOD OF FABRICATING SINGLE CHIP FOR INTEGRATING FIELD-EFFECT TRANSISTOR INTO MEMS STRUCTURE
#292General strength and sensitivity enhancement method for micromachined device
#293Low temperature ceramic microelectromechanical structures
#294Method for fabricating micro-electro-mechanical system (MEMS) device
#295Electronic device and method for manufacturing thereof
#296Semiconductor structure, pad structure and protection structure
#297MEMS DEVICE WITH A COMPOSITE BACK PLATE ELECTRODE AND METHOD OF MAKING THE SAME
#298APPARATUS AND METHOD OF FORMING A MEMS ACOUSTIC TRANSDUCER WITH LAYER TRANSFER PROCESSES
#299Integrated MEMS and ESD protection devices
#300MEMS device with protection rings