B81B2207/093 - CPC Classification Index

#1

20260036454

2026-02-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

#2

20230357002

2023-11-09

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

#3

20230319971

2023-10-05

METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE

#4

20230314197

2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

#5

20230314193

2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

#6

20230313376

2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

#7

20230062556

2023-03-02

MEMS device with perimeter barometric relief pierce

#8

20230050181

2023-02-16

Wafer level package for device

#9

20220017363

2022-01-20

Packaging method and associated packaging structure

#10

20210403316

2021-12-30

Resonance device and resonance device manufacturing method

#11

20210371273

2021-12-02

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

#12

20210292158

2021-09-23

Microelectromechanical microphone with reduced overall size

#13

20210082788

2021-03-18

Semiconductor package and method for manufacturing the same

#14

20200385263

2020-12-10

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPHONE PACKAGE AND PACKAGING METHOD THEREOF

#15

20200385260

2020-12-10

Microelectromechanical device with signal routing through a protective cap

#16

20190295926

2019-09-26

Semiconductor package and method for manufacturing the same

#17

20190100431

2019-04-04

Packaging method and associated packaging structure

#18

20190010046

2019-01-10

PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP

#19

20180312393

2018-11-01

Trench-based microelectromechanical transducer and method for manufacturing the microelectromechanical transducer

#20

20170361963

2017-12-21

Low temperature self-sealing vacuum packaging

#21

20170297906

2017-10-19

Microelectromechanical device with signal routing through a protective cap

#22

20170225947

2017-08-10

Packaging method and associated packaging structure

#23

20170084557

2017-03-23

Bonding pad structure, bonding ring structure, and MEMS device packaging method

#24

20170044007

2017-02-16

Assembly and packaging of MEMS device

#25

20160145096

2016-05-26

Microelectromechanical device with signal routing through a protective cap

#26

20160130134

2016-05-12

Pre-molded MEMS device package having conductive column coupled to leadframe and cover

#27

20150353348

2015-12-10

Glass wafer assembly

#28

20150311175

2015-10-29

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

#29

20150028432

2015-01-29

Assembly and packaging of MEMS device

#30

20140230546

2014-08-21

Microelectromechanical device with signal routing through a protective cap

#31

20140225203

2014-08-14

Packages and methods for packaging MEMS microphone devices

#32

20140131819

2014-05-15

Process for manufacturing a lid for an electronic device package, and lid for an electronic device package

#33

20140117469

2014-05-01

TSV-MEMS COMBINATION

#34

20130214405

2013-08-22

Component and method for producing a component

#35

20130193528

2013-08-01

Systems and methods for conductive pillars

#36

20130020713

2013-01-24

Wafer level package and a method of forming a wafer level package

#37

20120193754

2012-08-02

MEMS device with integral packaging

#38

20120153771

2012-06-21

Microelectromechanical transducer and corresponding assembly process

#39

20110198714

2011-08-18

Packages and methods for packaging MEMS microphone devices

#40

20110169107

2011-07-14

Method for manufacturing a component, method for manufacturing a component system, component, and component system

#41

20110155548

2011-06-30

Dual substrate MEMS plate switch and method of manufacture

#42

20110115036

2011-05-19

DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

#43

20110018075

2011-01-27

Structure and fabrication method of a sensing device

#44

20100206602

2010-08-19

Bump Structure With Multiple Layers And Method Of Manufacture

#45

20100105168

2010-04-29

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

#46

20100087024

2010-04-08

DEVICE CAVITY ORGANIC PACKAGE STRUCTURES AND METHODS OF MANUFACTURING SAME

#47

20090186447

2009-07-23

Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby

#48

20090091018

2009-04-09

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

#49

20080290479

2008-11-27

Wafer level device package with sealing line having electroconductive pattern and method of packaging the same

#50

20080283988

2008-11-20

Package and packaging assembly of microelectromechanical system microphone

#51

20080283942

2008-11-20

Package and packaging assembly of microelectromechanical system microphone

#52

20080272867

2008-11-06

MEMS device with integral packaging

#53

20080029878

2008-02-07

Firm, insulating and electrically conducting connection of processed semiconductor wafers

#54

20070284681

2007-12-13

APPARATUS AND METHOD FOR PROTECTIVE COVERING OF MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES

#55

20060267178

2006-11-30

Electrical component and production thereof

#56

20060076692

2006-04-13

Semiconductor package using flip-chip mounting technique

#57

20050170609

2005-08-04

Conductive bond for through-wafer interconnect

#58

20050168306

2005-08-04

MEMS device with integral packaging

#59

14751316

2016-10-25

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

#60

14326406

2015-10-13

Method and device using silicon substrate to glass substrate anodic bonding