83904 ⎘
Microstructural systems or auxiliary parts thereof; Packages Arrangements for connecting external electrical signals to mechanical structures inside the package
Sub-classes:MICRO-DIFFERENTIAL PRESSURE SENSOR, PACKAGING STRUCTURE, TESTING METHOD AND ELECTRONIC DEVICE
#2METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
#3ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
#4MEMS Spacer Assembly
#5Rotatable micromirror with improved shock and vibration performance
#6Microelectronics H-frame device
#7MEMS-Sensor
#8Micromirror with improved shock and vibration performance having differing hinge portions
#9MEMS-sensor
#10PRESSURE SENSOR STRUCTURE CONFIGURED FOR WAFER-LEVEL CALIBRATION
#11Micro-mirror array having pillars which form portions of electrical paths between mirror electrodes and mirrors
#12Fluid ejection device
#13Semiconductor package with a through port for sensor applications
#14Package for MEMS device and process
#15Fluid ejection device
#16Microelectromechanical systems sensor control interface
#17MEMS device
#18Micro electro mechanical system and layered hinge for use in MEMS micromirror having first and second serpentine shapes