Patents-Review.com
ClassID:

83911 ⎘

B81B2207/098 - CPC Classification

Classification description:

Microstructural systems or auxiliary parts thereof; Packages; Arrangements for connecting external electrical signals to mechanical structures inside the package Arrangements not provided for in groups  - 

Recent Application in this class:
#1
20260053035
2026-02-19

SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCUITS AND FABRIC CARRIERS

 #2
20250343119
2025-11-06

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN

 #3
20250321414
2025-10-16

SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD

 #4
20250289711
2025-09-18

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

 #5
20250268575
2025-08-28

INTEGRATED ULTRASONIC TRANSDUCERS

 #6
20250007455
2025-01-02

Ovenized MEMS

 #7
20250002330
2025-01-02

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CONTROLLER DEVICE

 #8
20240109768
2024-04-04

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #9
20240083740
2024-03-14

MEMS Element and Vibration-Driven Energy Harvesting Device

 #10
20230389897
2023-12-07

Integrated ultrasonic transducers

 #11
20230375822
2023-11-23

FLIP CHIP MICROMIRROR TECHNOLOGY

 #12
20230249962
2023-08-10

Method of manufacturing a sensor device and moulding support structure

 #13
20230046645
2023-02-16

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED IN LAMINATED SUBSTRATE BELOW THE INTEGRATED CIRCUIT DIE

 #14
20220396474
2022-12-15

Semiconductor package with metal column mold barrier

 #15
20220373783
2022-11-24

SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD

 #16
20220360218
2022-11-10

Ovenized MEMS

 #17
20220315413
2022-10-06

Sensing device and method for manufacturing sensing device

 #18
20220289560
2022-09-15

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #19
20220285249
2022-09-08

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN

 #20
20220068868
2022-03-03

Semiconductor package and method for manufacturing the same

 #21
20220033253
2022-02-03

MEMS package with shock and vibration protection

 #22
20220033252
2022-02-03

Reducing delamination in sensor package

 #23
20220009766
2022-01-13

Sensor and package assembly thereof

 #24
20210403318
2021-12-30

Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling

 #25
20210348976
2021-11-11

Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

 #26
20210329386
2021-10-21

Sound producing package structure and method for packaging sound producing package structure

 #27
20210323816
2021-10-21

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

 #28
20210246015
2021-08-12

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #29
20210238028
2021-08-05

Packaged die and assembling method

 #30
20210233840
2021-07-29

SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCUITS AND FABRIC CARRIERS

 #31
20210206628
2021-07-08

Semiconductor package structures and methods of manufacturing the same

 #32
20210188624
2021-06-24

Microelectronics package with vertically stacked MEMS device and controller device

 #33
20210183808
2021-06-17

Sensor systems and methods for providing sensor systems

 #34
20210147219
2021-05-20

Semiconductor package structure and method for manufacturing the same

 #35
20210137497
2021-05-13

Integrated ultrasonic transducers

 #36
20210130165
2021-05-06

Semiconductor device packages and methods of manufacturing the same

 #37
20210130163
2021-05-06

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

 #38
20210070612
2021-03-11

Method of making ohmic contact on low doped bulk silicon for optical alignment

 #39
20210070611
2021-03-11

Method of making ohmic contact on low doped bulk silicon for optical alignment

 #40
20210017018
2021-01-21

Semiconductor package structure and method for manufacturing the same

 #41
20200399118
2020-12-24

ELECTRONIC DEVICE

 #42
20200399117
2020-12-24

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #43
20200371130
2020-11-26

INERTIAL SENSOR

 #44
20200339412
2020-10-29

MEMS devices including MEMS dies and connectors thereto

 #45
20200239297
2020-07-30

Optical scanner module and method for fabricating optical scanner module

 #46
20200231432
2020-07-23

Method of manufacturing a sensor device and moulding support structure

 #47
20200198966
2020-06-25

Micromechanical device and method for manufacturing a micromechanical device

 #48
20200189908
2020-06-18

Molded lead frame sensor package

 #49
20200186084
2020-06-11

Ovenized MEMS

 #50
20200140261
2020-05-07

Bonding pad layer system, gas sensor and method for manufacturing a gas sensor

 #51
20200131030
2020-04-30

Shielded semiconductor device and lead frame therefor

 #52
20200131026
2020-04-30

Sensor device with flip-chip die and interposer

 #53
20200115220
2020-04-16

Wafer-level fan-out package with enhanced performance

 #54
20200111761
2020-04-09

Semiconductor package and method for manufacturing the same

 #55
20200095119
2020-03-26

Method of making ohmic contact on low doped bulk silicon for optical alignment

 #56
20200053483
2020-02-13

SENSOR DEVICES AND METHODS FOR MANUFACTURING THE SAME

 #57
20200045478
2020-02-06

Terminal assembly structure of MEMS microphone

 #58
20200031661
2020-01-30

LIQUID PROOF PRESSURE SENSOR

 #59
20200024129
2020-01-23

MEMS devices including MEMS dies and connectors thereto

 #60
20200020616
2020-01-16

Bottom package exposed die MEMS pressure sensor integrated circuit package design

 #61
20190382262
2019-12-19

Through-substrate conductor support

 #62
20190375627
2019-12-12

Wafer level package for a mems sensor device and corresponding manufacturing process

 #63
20190359480
2019-11-28

Reducing crosstalk in a mixed-signal multi-chip MEMS device package

 #64
20190345029
2019-11-14

Method for fabricating MEMS device integrated with a semiconductor integrated circuit

 #65
20190302140
2019-10-03

Device with terminal-containing sensor

 #66
20190290243
2019-09-26

Integrated ultrasonic transducers

 #67
20190177159
2019-06-13

EMC PROTECTION OF A SEMICONDUCTOR COMPONENT

 #68
20190119103
2019-04-25

Pressure sensor assembly mounted to a ceramic substrate

 #69
20190047845
2019-02-14

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #70
20180290881
2018-10-11

Optical scanner module and optical scanner control apparatus

 #71
20180194613
2018-07-12

MEMS devices including MEMS dies and connectors thereto

 #72
20180186629
2018-07-05

Through-substrate conductor support

 #73
20180162725
2018-06-14

MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof

 #74
20180044170
2018-02-15

Wafer level package for a MEMS sensor device and corresponding manufacturing process

 #75
20180016133
2018-01-18

Bottom package exposed die MEMS pressure sensor integrated circuit package design

 #76
20170369307
2017-12-28

Reconstructed wafer based devices with embedded environmental sensors and process for making same

 #77
20170334714
2017-11-23

Integrated package containing MEMS acoustic sensor and pressure sensor

 #78
20170272855
2017-09-21

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

 #79
20170253476
2017-09-07

Integrated circuit package with sensor and method of making

 #80
20170247250
2017-08-31

Semiconductor pressure sensor for harsh media application

 #81
20170088412
2017-03-30

Microelectronic component arrangement and production method for a microelectronic component arrangement

 #82
20170015548
2017-01-19

Open cavity package using chip-embedding technology

 #83
20160368762
2016-12-22

MEMS devices including MEMS dies and connectors thereto

 #84
20160347607
2016-12-01

Integrated circuit package with sensor and method of making

 #85
20160200564
2016-07-14

Sensor package

 #86
20160185593
2016-06-30

Wafer level package for a MEMS sensor device and corresponding manufacturing process

 #87
20160148880
2016-05-26

Electronic device with stacked chips

 #88
20160107881
2016-04-21

Microelectromechanical system device with internal direct electric coupling

 #89
20150336792
2015-11-26

Internal electrical contact for enclosed MEMS devices

 #90
20150307344
2015-10-29

Sensor apparatus and method for producing a sensor apparatus

 #91
20150203349
2015-07-23

Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit

 #92
20150197419
2015-07-16

MEMS devices and methods for forming same

 #93
20150162264
2015-06-11

Package structure and fabrication method thereof

 #94
20150022872
2015-01-22

Method of manufacturing a MEMS micro-mirror assembly

 #95
20150009549
2015-01-08

MEMS micro-mirror assembly

 #96
20140332910
2014-11-13

Microelectromechanical device and a method of manufacturing

 #97
20140191385
2014-07-10

Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit

 #98
20140113412
2014-04-24

Fabrication method for a chip package

 #99
20140103462
2014-04-17

MEMS devices

 #100
20140073089
2014-03-13

Chip package and manufacturing method thereof

 #101
20130320463
2013-12-05

PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

 #102
20130140650
2013-06-06

Methods for forming MEMS devices

 #103
20130075888
2013-03-28

Semiconductor package and method of fabricating the same

 #104
20130050226
2013-02-28

DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

 #105
20120292722
2012-11-22

Package structure having MEMS elements and fabrication method thereof

 #106
20120159778
2012-06-28

Method for connecting a plurality of unpackaged substrates

 #107
20120031662
2012-02-09

Sensor module having an electromagnetically shielded electrical component

 #108
20110290016
2011-12-01

Device and method for producing a device

 #109
20110229375
2011-09-22

Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system

 #110
20110180926
2011-07-28

Microelectromechanical systems embedded in a substrate

 #111
20110127670
2011-06-02

Chip package and manufacturing method thereof

 #112
20110127666
2011-06-02

Chip package and fabrication method thereof

 #113
20110115038
2011-05-19

PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PHYSICAL QUANTITY SENSOR

 #114
20110113616
2011-05-19

System and method of manufacturing an electromechanical device by printing raised conductive contours

 #115
20100193923
2010-08-05

Semiconductor device and manufacturing method therefor

 #116
20100112758
2010-05-06

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

 #117
20100109168
2010-05-06

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

 #118
20100105168
2010-04-29

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

 #119
20100072562
2010-03-25

Functional element package and fabrication method therefor

 #120
20100038732
2010-02-18

Micro movable device

 #121
20090190319
2009-07-30

THREE-DIMENSIONAL MODULE

 #122
20090085205
2009-04-02

Method for manufacturing an electronic component package and electronic component package

 #123
20080258313
2008-10-23

Connecting microsized devices using ablative films

 #124
20080105988
2008-05-08

Electrical component having external contacting

 #125
20080093689
2008-04-24

Flip-chip assembly of protected micromechanical devices

 #126
20080014680
2008-01-17

Method of fabricating a semiconductor chip package

 #127
20070048899
2007-03-01

Wafer level package and method for making the same

 #128
20070018314
2007-01-25

Semiconductor chip package

 #129
20060286707
2006-12-21

Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level

 #130
20060286706
2006-12-21

Method of making a substrate contact for a capped MEMS at the package level

 #131
16363013
2020-06-23

Back chamber volume enlargement microphone package