ClassID:

83785

B81B7/0012 - CPC Classification

Classification description:

Microstructural systems; Auxiliary parts of microstructural devices or systems; Structural features, others than packages, for protecting a device against environmental influences Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment

Recent Application in this class:
#1
20200172392
2020-06-04

Method for checking a sensor value of a MEMS sensor

#2
20180299589
2018-10-18

Method for protecting a MEMS unit against infrared investigations and MEMS unit

#3
20180297837
2018-10-18

Method for protecting a MEMS unit against infrared investigations and MEMS unit

#4
20180297835
2018-10-18

Method for protecting a MEMS unit against infrared investigations and MEMS unit

#5
20180294981
2018-10-11

Adjustable physical unclonable function

#6
20180197828
2018-07-12

Vanishing via for hardware IP protection from reverse engineering

#7
20140367809
2014-12-18

Varistor in base for MEMS microphones

#8
20140185127
2014-07-03

Preventing glass particle injection during the oil fill process

#9
20120219760
2012-08-30

APPARATUS AND METHOD FOR PROVIDING ISOLATION BETWEEN COMPONENTS IN MICROFABRICATED DEVICES

#10
20120112294
2012-05-10

IC manufacturing method, IC and apparatus

#11
20110068421
2011-03-24

Integrated MEMS and ESD protection devices

#12
20100207216
2010-08-19

Corrosion-resistant MEMS component and method for the production thereof

#13
20100192689
2010-08-05

Sensor device

#14
20100187076
2010-07-29

Micro-electro-mechanical switch beam construction with minimized beam distortion and method for constructing

#15
20100165314
2010-07-01

MEMS device with controlled gas space chemistry

#16
20100005877
2010-01-14

Semiconductor sensor having heater on insulation film and manufacturing method of the same

#17
20090219605
2009-09-03

Optical interference display panel and manufacturing method thereof

#18
20090126183
2009-05-21

METHOD OF FABRICATING A POLYMER-BASED CAPACITIVE ULTRASONIC TRANSDUCER

#19
20090014819
2009-01-15

Micromechanical component, method for fabrication and use

#20
20080303383
2008-12-11

Shock resistant and mode mixing resistant torsional hinged device

#21
20080268620
2008-10-30

Method and device for protecting interferometric modulators from electrostatic discharge

#22
20080230857
2008-09-25

SENSOR CHIP AND SUBSTRATE ASSEMBLY FOR MEMS DEVICE

#23
20080073163
2008-03-27

Micro-electromechanical device

#24
20070199191
2007-08-30

Method for fabricating a three-dimensional acceleration sensor

#25
20070160247
2007-07-12

Heat-resistant electret condenser microphone

#26
20070017289
2007-01-25

Method for fabricating a three-dimensional acceleration sensor

#27
20070013266
2007-01-18

Method of fabricating a polymer-based capacitive ultrasonic transducer

#28
20060289415
2006-12-28

Micromechanical device having integrated heating

#29
20060216847
2006-09-28

Process for fabricating micromachine

#30
20060130580
2006-06-22

Acceleration sensor manufacturable by simplified method

#31
20060107743
2006-05-25

Micromechanical component

#32
20060077504
2006-04-13

Method and device for protecting interferometric modulators from electrostatic discharge

#33
20060054021
2006-03-16

Particle filter for microelectromechanical systems

#34
20060051883
2006-03-09

Apparatus and system for suspending a chip-scale device and related methods

#35
20060027904
2006-02-09

Micro device having micro system structure and method for method for manufacturing the same

#36
20050194662
2005-09-08

Semiconductor component and micromechanical structure

#37
20050067633
2005-03-31

Microelectromechanical system and method for fabricating the same

#38
20050062121
2005-03-24

Sensor device having thin membrane and method of manufacturing the same

#39
20050042117
2005-02-24

Optical interference display panel and manufacturing method thereof

#40
20050034526
2005-02-17

Semiconductor sensor and method of plating semiconductor devices

#41
20050026312
2005-02-03

Method for producing and testing a corrosion-resistant channel in a silicon device