83787 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Structural features, others than packages, for protecting a device against environmental influences Protection against thermal alteration or destruction
MEMS Sensor Module
#2ASYMMETRIC FILLER AS TEMPERATURE TRANSIENT FIX
#3CANTILEVER BEAM BASED PRESSURE SENSOR SYSTEMS AND DEVICES MEHTHODS OF USE THEREOF
#4SENSING ELEMENT AND RELATED METHODS
#5MEMS ACTUATORS HAVING A VISCOUS LIQUID OR GEL LOCATED BETWEEN A MOVABLE MIRROR AND A SUBSTRATE
#6METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
#7ACCELEROMETER WITH THERMAL EXPANSION STRAIN PROTECTION
#8OVER-THE-SINK DRYING ELEMENT
#9Apparatus and method for dissipating heat with microelectromechanical system
#10SENSING ELEMENT AND RELATED METHODS
#11PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM DIFFERENT MATERIAL THICKNESSES
#12Systems and methods for operating a mems device based on sensed temperature gradients
#13PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MORE COMPENSATION LAYERS
#14MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
#15Microelectronics H-frame device
#16Apparatus and method for dissipating heat with microelectromechanical system
#17Systems and methods for operating a MEMS device based on sensed temperature gradients
#18Apparatus and method for dissipating heat with microelectromechanical system
#19Pressure relief device for microphone protection in an electronic device and corresponding methods
#20Capacitive sensors having temperature stable output
#21Systems and methods for operating a MEMS device based on sensed temperature gradients
#22Microphone package
#23Hydrogen sensor on medium or low temperature solid micro heating platform
#24MEMS device with optimized geometry for reducing the offset due to the radiometric effect
#25Silicon carbide microelectromechanical structure, device, and method
#26High temperature capacitive MEMS pressure sensor
#27Proof mass and polysilicon electrode integrated thereon
#28Microphone package
#29Microelectromechanical resonator with improved electrical features
#30Planar processing of suspended microelectromechanical systems (MEMS) devices
#31Integrated micro-channel heatsink in DMD substrate for enhanced cooling capacity
#32GLASS-SENSOR STRUCTURES
#33Silicon carbide microelectromechanical structure, device, and method
#34Capacitive RF MEMS intended for high-power applications
#35Internal temperature measurement device
#36System and method for an ovenized silicon platform using Si/SiOhybrid supports
#37Embedded structures for high glass strength and robust packaging
#38Infrared sensor design using an epoxy film as an infrared absorption layer
#39Systems and methods for nuclear event circumvention in an inertial device
#40Monolithic fabrication of thermally isolated microelectromechanical system (MEMS) devices
#41Embedded structures for high glass strength and robust packaging
#42Stress isolation platform for MEMS devices
#43Semiconductor Structure with Multiple Active Layers in an SOI Wafer
#44MEMS pressure sensor with thermal compensation
#45Mems having a cutout section on concave portion of a substrate
#46Aluminum nitride (AlN) devices with infrared absorption structural layer
#47Thermally shorted bolometer
#48Micromechanical component and corresponding test method for a micromechanical component
#49Semiconductor sensing device to minimize thermal noise
#50Infrared sensor design using an epoxy film as an infrared absorption layer
#51Sensor device packaging
#52MEMS device connected to a substrate by flexible support structures