83789 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Structural features, others than packages, for protecting a device against environmental influences Protection against chemical alteration
MEMS DEVICE AND METHOD FOR FABRICATING A MEMS DEVICE
#2PLASMA SHIELDING FOR AN ELECTROSTATIC MEMS DEVICE
#3CHEMICAL STOP STRUCTURES FOR MEMS DEVICES
#4MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
#5MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVING PROTECTION WALL
#6OVER-THE-SINK DRYING ELEMENT
#7WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
#8CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
#9A MICROFLUIDIC SENSOR
#10Microfluidic passage with protective layer
#11Micromechanical component for a sensor device or microphone device
#12Actuator layer patterning with polysilicon and etch stop layer
#13BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
#14Microphone device with ingress protection
#15Gas sensor and manufacturing method thereof
#16Micro-electromechanical system and method for fabricating MEMS having protection wall
#17Corrosion tolerant micro-electromechanical fluid ejection device
#18Substrate assembly and method of bonding substrates
#19Method for producing a microelectromechanical sensor and microelectromechanical sensor
#20SEMICONDUCTOR CHIP
#21Wearable device with combined sensing capabilities
#22Planarization layers over silicon dies
#23Microphone package
#24Microelectromechanical component and method for producing same
#25High performance sealed-gap capacitive microphone
#26Sensor package
#27Environmentally protected sensing device
#28Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#29Insulated sensors
#30Hybrid diamond-polymer thin film sensors and fabrication method
#31Semiconductor sensor device and method for fabricating the same
#32Reflective device
#33Substrate assembly and method of bonding substrates
#34AMORPHOUS THIN METAL FILM
#35Wearable device with combined sensing capabilities
#36Microphone package
#37Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#38High performance sealed-gap capacitive microphone
#39GLASS-SENSOR STRUCTURES
#40Wafer-level package with enhanced performance
#41Structure for device with integrated microelectromechanical systems
#42Electromechanical device including connector formed of dielectric material
#43MICROMECHANICAL LAYER SYSTEM
#44CMOS-MEMS integrated device with selective bond pad protection
#45Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#46Wearable device with combined sensing capabilities
#47Sensor with protective layer
#48Method of improving getter efficiency by increasing superficial area
#49Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#50VHF etch barrier for semiconductor integrated microsystem
#51Method of improving getter efficiency by increasing superficial area
#52MEMS-microphone with reduced parasitic capacitance
#53Sensor package
#54Reflective device to scan light to project an image on a display surface
#55Sensor device manufacturing method and sensor device
#56METHOD AND DEVICE FOR PREVENTING CORROSION ON SENSORS
#57Sensor element for capacitively measuring differential pressure
#58Three-dimensional nanodevices including nanostructures
#59Sensor package
#60Circuit device