B81B7/0035 - CPC Classification Index

ClassID:

83792 ⎘

B81B7/0035 - CPC Classification

Classification description:

Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS

Sub-classes:

B81B7/0038 » {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} 282
B81B7/0041 » {maintaining a controlled atmosphere with techniques not provided for in } 189

Recent Application in this class:

20250368501

2025-12-04

BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

20250026630

2025-01-23

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

20240002218

2024-01-04

MICROMECHANICAL STRUCTURE WITH BONDED COVER

20230382718

2023-11-30

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

20220411260

2022-12-29

Semiconductor structure and method for manufacturing thereof

20220298010

2022-09-22

Semi-finished product of electronic device and electronic device

20220169498

2022-06-02

Semiconductor device and method for manufacturing a semiconductor device

20220128411

2022-04-28

WAFER LEVEL VACUUM PACKAGING (WLVP) OF THERMAL IMAGING SENSOR

20210221678

2021-07-22

Microelectromechanical structure with bonded cover

#10

20210188627

2021-06-24

Particle filter for MEMS device

#11

20210147218

2021-05-20

Integrated MEMS cavity seal

#12

20210035799

2021-02-04

Semiconductor device and method for manufacturing the same

#13

20200095118

2020-03-26

Device for suppressing stray radiation

#14

20200079646

2020-03-12

Encapsulated microelectromechanical structure

#15

20200048075

2020-02-13

Over-under sensor packaging with sensor spaced apart from control chip

#16

20190055121

2019-02-21

Encapsulated microelectromechanical structure

#17

20190035905

2019-01-31

Proof mass and polysilicon electrode integrated thereon

#18

20190023561

2019-01-24

Over-under sensor packaging with sensor spaced apart from control chip

#19

20180297836

2018-10-18

MEMS DEVICE PACKAGE AND METHOD FOR PACKAGING MEMS DEVICE

#20

20180194615

2018-07-12

Microelectromechanical system microphone

#21

20180097172

2018-04-05

MEMS component and method for encapsulating MEMS components

#22

20180044176

2018-02-15

Encapsulated microelectromechanical structure

#23

20170365723

2017-12-21

Vacuum package, electronic device, and vehicle

#24

20170283246

2017-10-05

Transducer package with integrated sealing

#25

20170197821

2017-07-13

Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer

#26

20170190570

2017-07-06

Methods for mounting a MEMS sensor for in-stream measurements

#27

20170167946

2017-06-15

Dual-sealed MEMS package with cavity pressure monitoring

#28

20170158495

2017-06-08

LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS

#29

20170113919

2017-04-27

Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser

#30

20170101310

2017-04-13

Encapsulated microelectromechanical structure

#31

20160304338

2016-10-20

Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

#32

20160130135

2016-05-12

Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body

#33

20160075553

2016-03-17

Sensor protective coating

#34

20150360934

2015-12-17

Microelectromechanical system and method for manufacturing a microelectromechanical system

#35

20150321905

2015-11-12

Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling

#36

20150232330

2015-08-20

Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

#37

20150115376

2015-04-30

MEMs device with outgassing shield

#38

20150097215

2015-04-09

Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate

#39

20150001648

2015-01-01

MEMS microphone

#40

20140284729

2014-09-25

Electrical component and method of manufacturing the same

#41

20140268300

2014-09-18

Package implemented with PCB and transparent substrate to contain and protect a MEMS device

#42

20140246740

2014-09-04

Implantation of gaseous chemicals into cavities formed in intermediate dielectrics layers for subsequent thermal diffusion release

#43

20140231934

2014-08-21

Electrical component and method of manufacturing the same

#44

20130038876

2013-02-14

Variable wavelength interference filter, optical module, optical analysis device, and method for manufacturing variable wavelength interference filter

#45