83793 ⎘
Microstructural systems; Auxiliary parts of microstructural devices or systems; Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
MEMS COMPONENT COMPRISING A MEMS ELEMENT HAVING A CAVITY AND COMPRISING AN ASIC COMPONENT
#2SEGMENTED GETTER OPENINGS FOR MICROMACHINED ULTRASOUND TRANSDUCERDEVICES
#3High-Vacuum Micro-Vacuum Cells
#4Transducer
#5DEVICE ENCAPSULATION USING PHYSICAL VAPOR DEPOSITION
#6Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature
#7METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#8ENCAPSULATED MEMS DEVICES
#9OVERMOULDED PRESSURE SENSOR WITH ENCAPSULATING GEL AND METAL COVER ON SUBSTRATE
#10SUBSTRATE COMPRISING A BASE AND AN INTEGRATED GETTER FILM FOR MANUFACTURING MICROELECTRONIC DEVICES
#11PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE WITH A REDUCED CROSS-TALK AND CORRESPONDING COMBINED MICROELECTROMECHANICAL DEVICE
#12METHOD FOR MANUFACTURING A PACKAGING STRUCTURE
#13OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME
#14METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#15MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTECTED AGAINST HUMIDITY AND MANUFACTURING PROCESS THEREOF
#16MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
#17MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)
#18METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#19COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
#20SEMICONDUCTOR DEVICE AND METHOD OF MAKING
#21RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
#22OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME
#23PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
#24EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CAVITY PRESSURE CONTROL
#25ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#26Systems of Getters for Microelectronics and Methods for Production Thereof
#27BONDED STRUCTURES
#28PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
#29MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
#30BONDED STRUCTURES
#31Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#32MEMS STRUCTURE
#333D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FOOTPRINT
#34SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
#35INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INERTIAL MEASUREMENT UNIT
#36Micro-electromechanical system and method for producing same
#37PROTECTIVE COVER MEMBER AND MEMBER SUPPLYING SHEET
#38Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Embedded ePTFE Filter And Process Of Making
#39Wafer level package for device
#40METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#41Method and system for fabricating a MEMS device
#42Method and system for fabricating a MEMS device
#43Bonded structures
#44Systems and methods for providing getters in microelectromechanical systems
#45SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
#46Thin film getter structure having miniature heater and manufacturing method thereof
#47Protective cover member and member supplying sheet including the same
#48LIQUID-RESISTANT AIR INLET PASSIVE DEVICE AND METHODS OF MAKING SAME
#49BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE
#50Enclosures for Microphone Assemblies Including a Fluoropolymer Insulating Layer
#51PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#52Detachable MEMS package top cover
#53WAFER LEVEL VACUUM PACKAGING (WLVP) OF THERMAL IMAGING SENSOR
#54Electronic device and corresponding method
#55Hermetic housing comprising a getter, optoelectronic component or MEMS device incorporating such a hermetic housing and associated production method
#56Method to form a rough crystalline surface
#57Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#58MEMS HERMETIC SEAL APPARATUS AND METHODS
#59Sensor with chamber
#60A MEMS Package
#61Micro-opto-mechanical system sensor, arrangement and manufacturing method
#62Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
#63Micromechanical device with perforated membrane
#64HERMETIC PACKAGE COMPRISING A GETTER, PART COMPRISING SUCH A HERMETIC PACKAGE, AND ASSOCIATED MANUFACTURING PROCESS
#65Method for producing a micromechanical device having a damper structure
#66Resonator and resonance device including same
#67Resonance device and manufacturing method of resonance device
#68MEMs using outgassing material to adjust the pressure level in a cavity
#69Piezoelectric microelectromechanical resonator device and corresponding manufacturing process
#70MEMS device having a connection portion formed of a eutectic alloy
#71Hermetically sealed optically transparent wafer-level packages and methods for making the same
#72Miniature optical particulate matter sensor module
#73Capping plate for panel scale packaging of MEMS products
#74Thin film getter and manufacturing method therefor
#75SEGMENTED GETTER OPENINGS FOR MICROMACHINED ULTRASOUND TRANSDUCER DEVICES
#76Resonance device and method for producing resonance device
#77Micromechanical sensor device with improved liquid tightness protection
#78Semiconductor structure and manufacturing method thereof
#79Package moisture control and leak mitigation for high vacuum sealed devices
#80Selective gettering through phase segregation and temperature dependent storage and release structure for lubricant
#81Getter technology for micromachined ultrasonic transducer cavities
#82CMOS-MEMS structure and method of forming the same
#83Waterproof microphone and associated packing techniques
#84MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE
#85Liquid-resistant packaging for electro-acoustic transducers and electronic devices
#86MEMS cryocooler systems and methods
#87High efficiency getter design in vacuum MEMS device
#88Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
#89Directional microphone and associated packing techniques
#90Method for producing a microelectromechanical component and wafer system
#91Sensor package
#92Method for producing a system including a first microelectromechanical element and a second microelectromechanical element, and a system
#93CMOS-MEMS integrated device without standoff in MEMS
#94Acoustic assembly having an acoustically permeable membrane
#95Systems and methods for providing getters in microelectromechanical systems
#96Apparatus having a cavity structure and method for producing same
#97Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#98Top port multi-part surface mount silicon condenser microphone
#99Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates
#100Bonded structures
#101Miniature optical particulate matter sensor module
#102Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#103Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof
#104MEMS device with viewer window and manufacturing method thereof
#105Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film
#106METHOD FOR MANUFACTURING MEMS DEVICES USING MULTIPLE PHOTOACID GENERATORS IN A COMPOSITE PHOTOIMAGEABLE DRY FILM
#107Directional microphone and associated packing techniques
#108Proof mass and polysilicon electrode integrated thereon
#109Micromechanical device having a first cavity and a second cavity
#110Sensor element having laser-activated getter material
#111CMOS-MEMS structure and method of forming the same
#112MEMS component having two different internal pressures
#113Device including micromechanical components in cavities having different pressures and method for its manufacture
#114Method for manufacturing a micromechanical inertial sensor
#115Systems and methods for providing getters in microelectromechanical systems
#116Apparatus having a cavity structure and method for producing same
#117PRESSURE SENSOR, PRESSURE SENSOR MODULE, ELECTRONIC APPARATUS, AND VEHICLE
#118Micro-device having a plurality of mobile elements arranged in a plurality of embedded cavities
#119PRESSURE SENSOR, PRESSURE SENSOR MODULE, ELECTRONIC APPARATUS, AND VEHICLE
#120Top port multi-part surface mount MEMS microphone
#121Wafer level package solder barrier used as vacuum getter
#122Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter
#123Integrated particle filter for MEMS device
#124Vapor cell comprising electro-optic function for chip-scale atomic clock, and method for manufacturing sealed container for chip-scale instrument
#125Gasses for increasing yield and reliability of MEMS devices
#126Hermetically sealed MEMS device and its fabrication
#127System and methods of concentrating airborne particles
#128Micromechanical component
#129GLASS-SENSOR STRUCTURES
#130Integrated multi-sensing systems
#131Micro-mechanical component
#132Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices
#133MEMS device with multi pressure
#134Anti-getter: expandable polymer microspheres for MEMS devices
#135Cavity type pressure sensor device
#136Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device
#137PACKAGING FOR MEMS TRANSDUCERS
#138Methods for fabricating electronic devices including substantially hermetically sealed cavities and getter films
#139Electro-optic device, electronic apparatus, and method of manufacturing electro-optic device
#140PRESSURE SENSOR, PRODUCTION METHOD FOR PRESSURE SENSOR, ALTIMETER, ELECTRONIC APPARATUS, AND MOVING OBJECT
#141Top port multi-part surface mount silicon condenser microphone
#142Integrated circuit package with sensor and method of making
#143Micro-electro-mechanical pressure device and methods of forming same
#144MEMS DEVICE WITH A STABILIZED MINIMUM CAPACITANCE
#145Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices
#146Selective nitride outgassing process for MEMS cavity pressure control
#147Method for manufacturing a micromechanical component
#148CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
#149Method of making a closed cavity comprising a flap protecting the cavity when it is closed
#150Getter device for a micromechanical component
#151LASER RESEAL HAVING SPECIAL DIAPHRAGM STRUCTURE
#152Composite material for the protection of HO sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
#153Hermetically sealed MEMS device and its fabrication
#154Waterproof microphone and associated packing techniques
#155Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter
#156Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity
#157PACKAGING FOR MEMS TRANSDUCERS
#158Semiconductor sensing structure
#159Method of forming a protective coating for a packaged semiconductor device
#160Cavity pressure modification using local heating with a laser
#161MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#162COATED MOLECULAR SIEVE
#163Mechanisms for forming micro-electro mechanical system device
#164Wafer level package solder barrier used as vacuum getter
#165Apparatus and Method For Protecting a Micro-Electro-Mechanical System
#166Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof
#167Electronic devices including substantially hermetically sealed cavities and getter films with Kelvin measurement arrangement for evaluating the getter films and methods for fabricating the same
#168Integrated circuit package with sensor and method of making
#169Cavity pressure modification using local heating with a laser
#170MEMS PACKAGING
#171Integrated MEMS device
#172Top port multi-part surface mount silicon condenser microphone
#173Semiconductor device, related manufacturing method, and related electronic device
#174Getter, MEMS device and method of forming the same
#175Micro-Electromechanical System (MEMS) Devices and Methods for Packaging the Same
#176SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
#177Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure
#178Method for hermetically sealing with reduced stress
#179DISPLAY INCLUDING SENSORS
#180Package structure including a cavity coupled to an injection gas channel composed of a permeable material
#181Environmental sensor structure
#182MEMS device with getter layer
#183Method of improving getter efficiency by increasing superficial area
#184Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
#185Integrated CMOS and MEMS devices with air dieletrics
#186DISPLAY APPARATUS INCORPORATING EDGE SEALS FOR REDUCING MOISTURE INGRESS
#187DISPLAY APPARATUS INCORPORATING EDGE SEALS FOR REDUCING MOISTURE INGRESS
#188Microelectromechanical systems device package and method for producing the microelectromechanical systems device package
#189Semiconductor device, related manufacturing method, and related electronic device
#190Semiconductor device and method of manufacturing the same
#191Pressure sensor with geter embedded in membrane
#192Microelectromechanical component and manufacturing method for microelectromechanical components
#193MEMS package structure and method for fabricating the same
#194Micromechanical component and method for manufacturing same
#195Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
#196ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
#197MEMS device and method of forming the same
#198Hermetic plastic molded MEMS device package and method of fabrication
#199MEMS device having a getter structure and method of forming the same
#200Hermetic encapsulation for microelectromechanical systems (MEMS) devices
#201Wafer level package solder barrier used as vacuum getter
#202Semiconductor arrangement with thermal insulation configuration
#203MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
#204Method of limiting capillary action of gel material during assembly of pressure sensor
#205MEMS Chip and Manufacturing Method Thereof
#206Integrated heater for gettering or outgassing activation
#207MEMS device with sealed cavity and method for fabricating same
#208Encapsulation structure comprising trenches partially filled with getter material
#209MEMS devices, packaged MEMS devices, and methods of manufacture thereof
#210Structures and formation methods of micro-electro mechanical system device
#211Layer arrangement and a wafer level package comprising the layer arrangement
#212CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
#213Micromechanical sensor device with a getter in an enclosed cavity
#214Sealed MEMS devices with multiple chamber pressures
#215Side vented pressure sensor device
#216Cup-like getter scheme
#217Method and apparatus for fabricating electrostatic capacitance-type acceleration sensor and electrostatic capacitance-type acceleration sensor
#218Encapsulation structure including a mechanically reinforced cap and with a getter effect
#219Wafer level package solder barrier used as vacuum getter
#220Electrical device including a functional element in a cavity
#221Thin film capping
#222Multi-axis integrated MEMS inertial sensing device on single packaged chip
#223MEMS sensor packaging and method thereof
#224Electrical component and method of manufacturing the same
#225Micro-electro mechanical system (MEMS) structures and methods of forming the same
#226Method and apparatus for a semiconductor structure
#227SOI wafer, manufacturing method therefor, and MEMS device
#228Gas-diffusion barriers for MEMS encapsulation
#229Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture
#230MEMS devices, packaged MEMS devices, and methods of manufacture thereof
#231Micromechanical device and method for manufacturing a micromechanical device
#232SYSTEMS AND METHODS FOR PARTICLE CONTAMINANT ENTRAPMENT
#233Integrated getter area for wafer level encapsulated microelectromechanical systems
#234SOI wafer, manufacturing method therefor, and MEMS device
#235Moisture-resistant package
#236Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same
#237Electrical device including a functional element in a cavity
#238Getter structure with optimized pumping capacity
#239STRUCTURE MADE OF GETTER MATERIAL HERMETICALLY PROTECTED DURING MANUFACTURING
#240Getter structure including a gas-permeable material description
#241MEMS-based getter microdevice
#242Systems and methods for a three-layer chip-scale MEMS device
#243Packaging structure of a micro-device including a getter material
#244Surface mount silicon condenser microphone package
#245Environment-resistant module, micropackage and methods of manufacturing same
#246COMPOSITE MATERIAL FOR THE PROTECTION OF H2O SENSITIVE DEVICES BASED ON SURFACE FUNCTIONALIZED NANOZEOLITES DISPERSED IN A POLYMERIC MATRIX
#247METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
#248Method for forming a micro-surface structure and for producing a micro-electromechanical component
#249LITHIUM OR BARIUM BASED FILM GETTERS
#250Surface mount silicon condenser microphone package
#251Integrated getter area for wafer level encapsulated microelectromechanical systems
#252Packaged device and method of manufacturing the same
#253Getter having two activation temperatures and structure comprising this getter
#254Cavity structure comprising an adhesion interface composed of getter material
#255Structure comprising a getter layer and an adjusting sublayer and fabrication process
#256Structure comprising a getter layer and an adjusting sublayer and fabrication process
#257System and method for display device with reinforcing substance
#258MEMS SENSOR PACKAGE
#259SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP
#260COATED MOLECULAR SIEVE
#261Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof
#262Suspended getter material-based structure
#263Getter on die in an upper sense plate designed system
#264Method and system for packaging MEMS devices with glass seal
#265Electrical device including a functional element in a cavity
#266Environment-resistant module, micropackage and methods of manufacturing same
#267Thin film getter devices
#268Semiconductor device, structure of mounting the same, and method of removing foreign matter from the same
#269Indented lid for encapsulated devices and method of manufacture
#270MEMS device formed inside hermetic chamber having getter film
#271Packaged device and method of manufacturing the same
#272Airtight package comprising a pressure adjustment unit
#273Functional device, semiconductor device, and electronic device
#274Desiccant in a MEMS device
#275Indented structure for encapsulated devices and method of manufacture
#276Encapsulation for particle entrapment
#277Silicon condenser microphone and manufacturing method
#278Silicon condenser microphone and manufacturing method
#279Micromechanical Getter Anchor
#280Integrated getter area for wafer level encapsulated microelectromechanical systems
#281Modifying the electro-mechanical behavior of devices
#282Getter deposition for vacuum packaging
#283Electronic device sealed under vacuum containing a getter and method of operation
#284Micromechanical getter anchor
#285Micromechanical component and method
#286Injection-molded package for MEMS inertial sensor
#287System and method for display device with integrated desiccant
#288Method and system for packaging MEMS devices with incorporated getter
#289Methods and apparatus for particle reduction in MEMS devices
#290System and method for display device with reinforcing substance
#291Hermetically sealed microdevice with getter shield
#292Encapsulation for particle entrapment
#293Integrated circuit with impurity barrier
#294Getter deposition for vacuum packaging
#295Modifying the electro-mechanical behavior of devices
#296Microelectromechanical devices with lubricants and getters formed thereon
#297Methods and apparatus for attaching getters to MEMS device housings
#298Integrated getter area for wafer level encapsulated microelectromechanical systems
#299Method for the production of a microstructure comprising a vacuum cavity and a microstructure
#300Method of manufacturing a microphone