Patents-Review.com
ClassID:

83807 ⎘

B81B7/0083 - CPC Classification

Classification description:

Microstructural systems; Auxiliary parts of microstructural devices or systems Temperature control

Sub-classes:
Recent Application in this class:
#1
20260138864
2026-05-21

AIRFLOW GENERATING DEVICE AND ITS APPLICATIONS

 #2
20260070779
2026-03-12

Electronic Structure, Inertial Measurement Unit, Electronic Apparatus, And Moving Object

 #3
20250320116
2025-10-16

Stacked-die MEMS resonator

 #4
20250268104
2025-08-21

A SEMICONDUCTOR STRUCTURE AND A MICROFLUIDIC SYSTEM THEREOF

 #5
20250019229
2025-01-16

STACKED-DIE MEMS RESONATOR

 #6
20230391611
2023-12-07

MEMS resonator system

 #7
20230331546
2023-10-19

MEMS STRUCTURE

 #8
20220356059
2022-11-10

Stacked-die MEMS resonator

 #9
20220111645
2022-04-14

FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK

 #10
20210179421
2021-06-17

Stacked-die MEMS resonator

 #11
20200385261
2020-12-10

Manufacturing of integrated circuit resonator

 #12
20200305241
2020-09-24

Fluidic chip

 #13
20200209175
2020-07-02

Microelectromechanical system apparatus with heater

 #14
20190292043
2019-09-26

Package structure for micromechanical resonator

 #15
20180319655
2018-11-08

Fluid propelling apparatus including a heat sink

 #16
20180155186
2018-06-07

Low-profile stacked-die MEMS resonator system

 #17
20180035490
2018-02-01

Digital PCR device

 #18
20180029036
2018-02-01

Fluidic chip

 #19
20170029269
2017-02-02

Stacked-die MEMS resonator system

 #20
20150274513
2015-10-01

Semiconductor arrangement with thermal insulation configuration

 #21
20150253568
2015-09-10

Projector, Oscillating Mirror Element Unit and Headup Display

 #22
20150210532
2015-07-30

MEMS GAS SENSING DEVICE

 #23
20150123220
2015-05-07

Low-profile stacked-die MEMS resonator system

 #24
20110227175
2011-09-22

Stacked die package for MEMS resonator system

 #25
20070290364
2007-12-20

Stacked die package for MEMS resonator system