Patents-Review.com
ClassID:

83810 ⎘

B81B7/0093 - CPC Classification

Classification description:

Microstructural systems; Auxiliary parts of microstructural devices or systems; Temperature control; Maintaining a constant temperature by heating or cooling by cooling

Recent Application in this class:
#1
20250291176
2025-09-18

MIRROR ARRANGEMENT WITH COOLED MIRROR ELEMENTS AND LITHOGRAPHY SYSTEM

 #2
20250268106
2025-08-21

ACTUATOR DESIGNS FOR MEMS-BASED ACTIVE COOLING

 #3
20250263292
2025-08-21

TILES HAVING MULTIPLE COOLING CELLS FOR MEMS-BASED COOLING

 #4
20250031350
2025-01-23

CENTRALLY ANCHORED MEMS-BASED ACTIVE COOLING SYSTEMS

 #5
20230331545
2023-10-19

Apparatus and method for dissipating heat with microelectromechanical system

 #6
20230034707
2023-02-02

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES

 #7
20230012794
2023-01-19

DRIVING OF PIEZOELECTRICS FOR MEMS-BASED COOLING SYSTEMS

 #8
20220354021
2022-11-03

Centrally anchored MEMS-based active cooling systems

 #9
20220259036
2022-08-18

Apparatus and method for dissipating heat with microelectromechanical system

 #10
20220081284
2022-03-17

Tiles having multiple cooling cells for MEMS-based cooling

 #11
20220077014
2022-03-10

Packaged device with die wrapped by a substrate

 #12
20210397010
2021-12-23

Wearable display device

 #13
20210392788
2021-12-16

Centrally anchored MEMS-based active cooling systems

 #14
20210323811
2021-10-21

Apparatus and method for dissipating heat with microelectromechanical system

 #15
20210176894
2021-06-10

Centrally anchored MEMS-based active cooling systems

 #16
20210013116
2021-01-14

Packaged device with die wrapped by a substrate

 #17
20200275178
2020-08-27

Method for operating an integrated MEMS microphone device and integrated MEMS microphone device

 #18
20200239299
2020-07-30

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES

 #19
20200102216
2020-04-02

MEMS cryocooler systems and methods

 #20
20190039883
2019-02-07

Monolithic phase change heat sink

 #21
20180151468
2018-05-31

DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS

 #22
20160343637
2016-11-24

DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS

 #23
20160329266
2016-11-10

Electronic power device with improved cooling

 #24
20150061455
2015-03-05

Vibration device including support portion

 #25
20150060756
2015-03-05

Optical-microwave-quantum transducer

 #26
20150021410
2015-01-22

System and method for miniaturization of synthetic jets

 #27
20150021409
2015-01-22

System and method for miniaturization of synthetic jets

 #28
20130230934
2013-09-05

System and method for miniaturization of synthetic jets

 #29
20130082376
2013-04-04

3D integrated electronic device structure including increased thermal dissipation capabilities

 #30
20120187519
2012-07-26

Method of forming a cooling device for an integrated circuit

 #31
20110156245
2011-06-30

Method and apparatus for cooling an integrated circuit

 #32
20100053891
2010-03-04

System and method for miniaturization of synthetic jets

 #33
20100052112
2010-03-04

Printable, flexible and stretchable diamond for thermal management

 #34
20080290489
2008-11-27

Package structure and electronic device using the same

 #35
20080088010
2008-04-17

Electronic device with integrated micromechanical contacts and cooling system

 #36
20070278663
2007-12-06

Integrated circuit cooling device

 #37
20050045974
2005-03-03

Die carrier with fluid chamber

 #38
17473818
2025-05-27

Actuator designs for MEMS-based active cooling