ClassID:

83984

B81C1/00547 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Etching material Etching processes not provided for in groups  - 

Recent Application in this class:
#1
20240187770
2024-06-06

MONOLITHIC SOUND TRANSDUCER AND ENVIRONMENTAL BARRIER

#2
20220308705
2022-09-29

Copper-alloy capping layers for metallization in touch-panel displays

#3
20220259038
2022-08-18

HIGH-VOLUME MILLIMETER SCALE MANUFACTURING

#4
20210278433
2021-09-09

Method for manufacturing three-dimensionally structured member, method for manufacturing acceleration pickup, acceleration pickup, and acceleration sensor

#5
20210269304
2021-09-02

Method for ablating or roughening wafer surfaces

#6
20210214216
2021-07-15

Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layer

#7
20210208738
2021-07-08

Copper-alloy capping layers for metallization in touch-panel displays

#8
20210139321
2021-05-13

Laser-assisted material phase-change and expulsion micro-machining process

#9
20200371130
2020-11-26

INERTIAL SENSOR

#10
20200249195
2020-08-06

Fabrication of a nanochannel for DNA sequencing using electrical plating to achieve electrode gap

#11
20200131033
2020-04-30

Actuator layer patterning with topography

#12
20200131031
2020-04-30

Actuator layer patterning with topography

#13
20190256353
2019-08-22

High-volume millimeter scale manufacturing

#14
20180299335
2018-10-18

MEMS strain gauge sensor and manufacturing method

#15
20180217083
2018-08-02

Fabrication of a nanochannel for DNA sequencing using electrical plating to achieve tunneling electrode gap

#16
20180175075
2018-06-21

Thin-film transistor and method of forming an electrode of a thin-film transistor

#17
20180005906
2018-01-04

Device manufacturing method and device manufacturing apparatus

#18
20170080460
2017-03-23

CMUT device and manufacturing method

#19
20170068215
2017-03-09

Method for manufacturing a micromechanical timepiece part and said micromechanical timepiece part

#20
20170036906
2017-02-09

Stress relief MEMS structure and package

#21
20160273916
2016-09-22

Inertial sensor with nested seismic masses and method for manufacturing such a sensor

#22
20160229688
2016-08-11

Stress relief MEMS structure and package

#23
20160161957
2016-06-09

Integration of pressure sensors into integrated circuit fabrication and packaging

#24
20150185247
2015-07-02

Magnet placement for integrated sensor packages

#25
20150183635
2015-07-02

Integration of pressure or inertial sensors into integrated circuit fabrication and packaging

#26
20140362307
2014-12-11

Copper-alloy capping layers for metallization in touch-panel displays

#27
20140326702
2014-11-06

METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY

#28
20140166618
2014-06-19

ULTRA-HIGH SPEED ANISOTROPIC REACTIVE ION ETCHING

#29
20130309445
2013-11-21

METHOD OF MANUFACTURING BASE BODY HAVING MICROSCOPIC HOLE, AND BASE BODY

#30
20130195723
2013-08-01

Methods, systems and devices for forming nanochannels

#31
20130098865
2013-04-25

Angle control of multi-cavity molded components for MEMS and NEMS group assembly

#32
20130043486
2013-02-21

System and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same

#33
20120049200
2012-03-01

Systems and methods for preparing freestanding films using laser-assisted chemical etch, and freestanding films formed using same

#34
20120032304
2012-02-09

Semiconductor device and manufacturing method thereof

#35
20110115042
2011-05-19

STRUCTURE FOR DECREASING MINIMUM FEATURE SIZE IN AN INTEGRATED CIRCUIT

#36
20080254570
2008-10-16

ANGLE CONTROL OF MULTI-CAVITY MOLDED COMPONENTS FOR MEMS AND NEMS GROUP ASSEMBLY

#37
20080230510
2008-09-25

Method of processing substrates

#38
20080142475
2008-06-19

METHOD OF CREATING SOLID OBJECT FROM A MATERIAL AND APPARATUS THEREOF

#39
20070259471
2007-11-08

MEMS device including a laterally movable portion with piezo-resistive sensing elements and electrostatic actuating elements on trench side walls, and methods for producing the same

#40
20070128824
2007-06-07

Double-sided etching method using embedded alignment mark

#41
20070122918
2007-05-31

METHOD FOR FABRICATING MICROSTRUCTURE AND A MICROSTRUCTURE FORMED USING THE METHOD

#42
20070093045
2007-04-26

Semiconductor device and manufacturing method thereof

#43
20070052059
2007-03-08

Structure for decreasing minimum feature size in an integrated circuit

#44
20070020794
2007-01-25

Method of strengthening a microscale chamber formed over a sacrificial layer

#45
20060256438
2006-11-16

Micro corner cube array, method of making the micro corner cube array, and display device

#46
20060203319
2006-09-14

Method of making comb-teeth electrode pair

#47
20060191637
2006-08-31

Etching Apparatus and Process with Thickness and Uniformity Control

#48
20060177987
2006-08-10

METHODS FOR FORMING THIN OXIDE LAYERS ON SEMICONDUCTOR WAFERS

#49
20060160262
2006-07-20

Microelectromechanical devices and their fabrication

#50
20060068107
2006-03-30

Surface and composition enhancements to high aspect ratio C-MEMS

#51
20060057761
2006-03-16

Method for fabricating microstructure and microstructure

#52
20050215063
2005-09-29

System and methods for etching a silicon wafer using HF and ozone

#53
20050133479
2005-06-23

Equipment and process for creating a custom sloped etch in a substrate

#54
20050130409
2005-06-16

Controlled dry etch of a film

#55
20050106892
2005-05-19

Etching method

#56
20050059184
2005-03-17

Method for making a microstructure by surface micromachining

#57
20050045276
2005-03-03

Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants

#58
20050023631
2005-02-03

Controlled dry etch of a film

#59
20050001282
2005-01-06

Etching process for micromachining crystalline materials and devices fabricated thereby