83990 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity Control etch selectivity
MEMS AND NEMS STRUCTURES
#2LASER MICROMACHINING OF MEMS RESONATORS FROM BULK OPTICALLY TRANSPARENT MATERIAL
#3MEMS AND NEMS STRUCTURES
#4SEALED FORCE SENSOR WITH ETCH STOP LAYER
#5PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE, AND MEMS DEVICE
#6ENGINEERED SUBSTRATES, FREE-STANDING SEMICONDUCTOR MICROSTRUCTURES, AND RELATED SYSTEMS AND METHODS
#7Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
#8Sealed force sensor with etch stop layer
#9Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
#10Method for processing a layer structure and microelectromechanical component
#11Process for manufacturing a micro-electro-mechanical device, and MEMS device
#12Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragm
#13Device having a membrane and method of manufacture
#14Sealed force sensor with etch stop layer
#15Optical electronics device
#16Polarizer peeling apparatus and peeling method thereof
#17MEMS and NEMS structures
#18Method of anisotropically etching adjacent lines with multi-color selectivity
#19Method for processing a layer structure and microelectromechanical component
#20Method of manufacturing semiconductor device
#21Selective cyclic dry etching process of dielectric materials using plasma modification
#22Touch sensing panel and manufacturing method thereof
#23Method for producing optical components using functional elements
#24Micro-device having a metal-semiconductor compound layer protected against HF etching and method for making the same
#25Method for processing a layer structure and microelectromechanical component
#26Spectrally and temporally engineered processing using photoelectrochemistry
#27Optical electronics device
#28Process for manufacturing a microelectronic device having a black surface, and microelectronic device
#29Selectivity in a xenon difluoride etch process
#30Structure to reduce backside silicon damage
#31Method for fabricating a micro-well of a biosensor
#32Optical electronic device and method of fabrication
#33MEMS structure with an etch stop layer buried within inter-dielectric layer
#34Manufacturing method of a multi-level micromechanical structure on a single layer of homogenous material
#35Process for manufacturing a microelectromechanical interaction system for a storage medium
#36Structure to reduce backside silicon damage
#37CHIP FOR BIOLOGICAL ANALYSES PROVIDED WITH WELLS HAVING AN IMPROVED SHAPE, CARTRIDGE INCLUDING THE CHIP AND METHOD FOR MANUFACTURING THE CHIP
#38Hinged MEMS diaphragm
#39Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#40Spectrally and temporally engineered processing using photoelectrochemistry
#41Methods for dry hard mask removal on a microelectronic substrate
#42Reducing MEMS stiction by deposition of nanoclusters
#43Optical electronic device and method of fabrication
#44LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT
#45MEMS Chip and Manufacturing Method Thereof
#46MEMS device with a bonding layer embedded in the cap
#47Method for creating a resonator
#48Process for fabricating MEMS device
#49Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#50Method for the prevention of suspended silicon structure etching during reactive ion etching
#51Production process for a micromechanical component and micromechanical component
#52Vapour etch of silicon dioxide with improved selectivity
#53Single crystal silicon membrane with a suspension layer, method for fabricating the same, and a micro-heater
#54STRUCTURE FOR MICROELECTRONICS AND MICROSYSTEM AND MANUFACTURING PROCESS
#55Selectivity in a xenon difluoride etch process
#56Method for creating a micromechanical membrane structure and MEMS component
#57Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
#58METHODS FOR GRAPHENE-ASSISTED FABRICATION OF MICRO-AND NANOSCALE STRUCTURES AND DEVICES FEATURING THE SAME
#59Device formed using a hard mask and etch stop layer
#60Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device Fabrication
#61Selective etching of semiconductor substrate(s) that preserves underlying dielectric layers
#62Method for manufacturing a micromechanical component, and micromechanical component
#63Method for etching a layer on a silicon semiconductor substrate
#64Etching method and system
#65Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures
#66Support structure for MEMS device and methods therefor
#67Support structure for MEMS device and methods therefor
#68Method of manufacturing MEMS sensor and MEMS sensor
#69Heterogeneous substrate including a sacrificial layer, and a method of fabricating it
#70Etching with improved control of critical feature dimensions at the bottom of thick layers
#71Method of etching a device using a hard mask and etch stop layer
#72Method for etching a sacrificial layer for a micro-machined structure
#73Boron doped shell for MEMS device
#74Method for etching a layer on a substrate
#75Method for producing a semiconductor component and a semiconductor component produced according to the method
#76PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE
#77Process for manufacturing a microelectromechanical interaction system for a storage medium
#78Method for selective CMP of polysilicon
#79Etch-stop layer and method of use
#80New Structure for Microelectronics and Microsystem and Manufacturing Process
#81Selective etching of MEMS using gaseous halides and reactive co-etchants
#82Structure in a substrate for the manufacturing of a semiconductor device and process for manufacturing of a semiconductor device
#83Method for fabricating a three-dimensional acceleration sensor
#84Poly etch without separate oxide decap
#85Anisotropic etching agent composition used for manufacturing of micro-structures of silicon and etching method
#86Etching method and system
#87Poly etch without separate oxide decap
#88Method for creating narrow trenches in dielectric materials
#89Support structure for MEMS device and methods therefor
#90Support structure for MEMS device and methods therefor
#91Method for fabricating a three-dimensional acceleration sensor
#92Poly etch without separate oxide decap
#93Structures, materials and methods for fabrication of nanostructures
#94Selective isotropic etch for titanium-based materials
#95Selective etching of oxides from substrates
#96Method to avoid amorphous-si damage during wet stripping processes in the manufacture of MEMS devices
#97Method for manufacturing a micro-electromechanical device and micro-electromechanical device obtained therewith
#98Method for producing a semiconductor component and a semiconductor component produced according to the method
#99Micro mirror unit, optical disc drive using same, and method for producing micro mirror unit
#100Selective isotropic etch for titanium-based materials
#101Etching method in fabrications of microstructures
#102Method for manufacturing a microsystem
#103Method for nanomachining high aspect ratio structures
#104Etching method used in fabrications of microstructures
#105Selective etching of silicon carbide films
#106Wet etch patterning of an aluminum nitride film
#107Fabricating ultra-thin silicon carbide diaphragms
#108Hinged MEMS diaphragm and method of manufacture therof