ClassID:

83991

B81C1/00603 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity Aligning features and geometries on both sides of a substrate, e.g. when double side etching

Recent Application in this class:
#1
20240111148
2024-04-04

MICRO-ELECTRO-MECHANICAL SYSTEMS MICROMIRRORS AND MICROMIRROR ARRAYS

#2
20230126293
2023-04-27

Micro-electro-mechanical systems micromirrors and micromirror arrays

#3
20200150416
2020-05-14

Micro-electro-mechanical systems micromirrors and micromirror arrays

#4
20200015017
2020-01-09

Method for manufacturing an opening structure and opening structure

#5
20190333773
2019-10-31

Method of etching microelectronic mechanical system features in a silicon wafer

#6
20190287810
2019-09-19

Method of etching microelectronic mechanical system features in a silicon wafer

#7
20180143591
2018-05-24

Flexible strip for horology and method for manufacturing the same

#8
20160332872
2016-11-17

Manufacturing method of a multi-level micromechanical structure on a single layer of homogenous material

#9
20160230751
2016-08-11

Microfabricated gas flow structure

#10
20160202473
2016-07-14

Semiconductor device

#11
20160200569
2016-07-14

Method for manufacturing electronic component

#12
20150341726
2015-11-26

Method for manufacturing an opening structure and opening structure

#13
20140153074
2014-06-05

MOEMS apparatus and a method for manufacturing same

#14
20140126031
2014-05-08

Method for fabricating a self-aligned vertical comb drive structure

#15
20130221439
2013-08-29

SOI wafer and method of manufacturing the same

#16
20130050793
2013-02-28

MOEMS apparatus and a method for manufacturing same

#17
20120062973
2012-03-15

MOEMS apparatus and a method for manufacturing same

#18
20080248600
2008-10-09

Method and device for wafer backside alignment overlay accuracy

#19
20070298582
2007-12-27

Method of performing a double-sided process

#20
20070249137
2007-10-25

Method and system for wafer backside alignment

#21
20070111472
2007-05-17

Method of performing a double-sided process

#22
20060030120
2006-02-09

METHOD OF PERFORMING DOUBLE-SIDED PROCESSES UPON A WAFER