83992 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate; Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity Processes for the planarisation of structures
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
#2Method for manufacturing semiconductor structure and planarization process thereof
#3Laser-assisted material phase-change and expulsion micro-machining process
#4Superstrate and methods of using the same
#5Process for forming inkjet nozzle devices
#6Process for filling etched holes using first and second polymers
#7Method for forming a planarization structure
#8Method of fabricating a MEMS and/or NEMS structure comprising at least two elements suspended from a support at different distances from said support
#9Process for filling etched holes using photoimageable thermoplastic polymer
#10Production method for composite substrate
#11Method of reverse tone patterning
#12Process for filling etched holes
#13Method of forming planar sacrificial material in a MEMS device
#14Main pole layer with at least two sacrificial layers and a gap layer
#15Device with electrode connected to through wire, and method for manufacturing the same
#16Ultrasonic transducer, method of producing same, and ultrasonic probe using same
#17PROBE AND METHOD FOR MANUFACTURING THE PROBE
#18Method of manufacturing a MEMS structure and use of the method
#19Method of manufacturing a MEMS structure
#20Methods of polishing sapphire surfaces
#21Processing for overcoming extreme topography
#22Self-leveling planarization materials for microelectronic topography
#23Process for reconditioning semiconductor surface to facilitate bonding
#24MEMS and method of manufacturing the same
#25ULTRASONIC TRANSDUCER, METHOD OF PRODUCING SAME, AND ULTRASONIC PROBE USING SAME
#26CMP process flow for MEMS
#27Processing for overcoming extreme topography
#28Method for manufacturing micromechanical components
#29Planarity of pixel mirrors
#30Polysilicon Planarization Solution for Planarizing Low Temperature Poly-Silicon Thin Film Panels
#31Processing for overcoming extreme topography
#32Microelectromechanical device having a common ground plane and method for making aspects thereof
#33Method for manufacturing micromechanical components
#34Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#35Method of Fabricating a Silicon-On-Insulator Structure
#36Process for wafer bonding
#37System and method for filling vias
#38Method for selective CMP of polysilicon
#39Method for the production of planar structures
#40Method of fabricating submicron suspended objects and application to the mechanical characterization of said objects
#41Method of producing a device with a movable portion
#42Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
#43Microelectromechanical device having a common ground plane layer and a set of contact teeth and method for making aspects thereof
#44Glass-type planar substrate, use thereof, and method for the production thereof
#45Manufacturing method
#46Processing for overcoming extreme topography
#47Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#48Method of fabricating semiconductor devices employing at least one modulation doped quantum well structure and one or more etch stop layers for accurate contact formation
#49Head electrode region for a reliable metal-to-metal contact micro-relay MEMS switch
#50Manufacturing methods of MEMS device
#51Method for registering a deposited material with channel plate channels
#52Forming tool for forming a contoured microelectronic spring mold
#53Micromachine production method