83999 ⎘
Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device; Mechanical properties Treatments for controlling internal stress or strain in MEMS structures
MEMS DEVICE WITH COMPENSATION OF THE MECHANICAL STRESS AND RELATED MANUFACTURING PROCESS
#2PIEZOELECTRIC MICROELECTROMECHANICAL DEVICE WITH ANCHOR REINFORCEMENT
#3MEMS MICROPHONE AND METHOD FOR PREPARING MEMS MICROPHONE
#4SYSTEM AND METHOD FOR MEMS DEVICES
#5DRIVE ELEMENT AND OPTICAL DEFLECTION ELEMENT
#6SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#7NANO ELECTROMECHANICAL DEVICE AND MANUFACTURING METHOD THEREOF
#8MANUFACTURING METHOD FOR MICRO-ELECTRO-MECHANICAL MICROPHONE
#9MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
#10SEALED MICROELECTROMECHANICAL MEMBRANE DEVICE
#11INTEGRATED SENSOR DEVICE
#12CURVED CANTILEVER DESIGN TO REDUCE STRESS IN MEMS ACTUATOR
#13MEMS SOUND TRANSDUCER AND METHOD FOR PRODUCING SAME
#14MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
#15DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
#16MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRENCHES
#17DOUBLE LAYER MEMS DEVICES
#18DAMASCENE INTERCONNECT STRUCTURE, ACTUATOR DEVICE, AND METHOD OF MANUFACTURING DAMASCENE INTERCONNECT STRUCTURE
#19DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#20Curved cantilever design to reduce stress in MEMS actuator
#21FAILURE DETECTION METHOD, FAILURE DETECTION SYSTEM, AND ELECTROSPRAY ION SOURCE
#22MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME
#23DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#24Support Device for One or More MEMS Components
#25METHODS AND APPARATUS FOR MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) DEVICES
#26METHOD FOR MANUFACTURING MIRROR DEVICE
#27MEMS PROCESS POWER
#28Semiconductor Device
#29SYSTEM AND METHOD FOR MEMS DEVICES
#30METHOD OF MAKING MEMS MICROPHONE WITH AN ANCHOR
#31STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION
#32SEMICONDUCTOR DEVICES HAVING A MEMBRANE LAYER WITH SMOOTH STRESS-RELIEVING CORRUGATIONS AND METHODS OF FABRICATION THEREOF
#33Curved cantilever design to reduce stress in MEMS actuator
#34MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
#35FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS
#36Microelectromechanical infrared sensing device and fabrication method thereof
#37Microelectromechanical systems device
#38BACKSIDE COATING OF SUSPENDED MEMS MIRROR ACTUATORS FOR STRESS MATCHING AND THERMAL STABILITY
#39MEMS process power
#40Manufacturing method of semiconductor structure
#41Damascene interconnect structure, actuator device, and method of manufacturing damascene interconnect structure
#42Integrated circuit packages having stress-relieving features
#43MEMS devices with support structures and associated production methods
#44MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE WITH BACKSIDE PINHOLE RELEASE AND RE-SEAL
#45DEVICE AND METHOD OF FABRICATING SUCH A DEVICE
#46Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package
#47MEMS device manufacturing method, MEMS device, and shutter apparatus using the same
#48Manufacturing method of semiconductor structure
#49Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package
#50Silicon carbide microelectromechanical structure, device, and method
#51Thin film material transfer method
#52Micromechanical sensor that includes a stress decoupling structure
#53Planar cavity MEMS and related structures, methods of manufacture and design structures
#54Planar cavity MEMS and related structures, methods of manufacture and design structures
#55Planar cavity mems and related structures, methods of manufacture and design structures
#56MEMS device with suspension structure and method of making a MEMS device
#57Planar cavity MEMS and related structures, methods of manufacture and design structures
#58Actuator, liquid discharge head, liquid discharge device, and liquid discharge apparatus
#59Planar cavity MEMS and related structures, methods of manufacture and design structures
#60Planar cavity MEMS and related structures, methods of manufacture and design structures
#61Devices with localized strain and stress tuning
#62Planar cavity MEMS and related structures, methods of manufacture and design structures
#63Planar cavity MEMS and related structures, methods of manufacture and design structures
#64Micromechanical z-inertial sensor
#65Method for producing a MEMS sensor, and MEMS sensor
#66Polycrystalline material having low mechanical strain; method for producing a polycrystalline material
#67Planar cavity MEMS and related structures, methods of manufacture and design structures
#68Planar cavity MEMS and related structures, methods of manufacture and design structures
#69Bonded substrate body, method for manufacturing bonded substrate body, liquid discharge head, and method for manufacturing liquid discharge head
#70Planar cavity MEMS and related structures, methods of manufacture and design structures
#71PRESSURE SENSOR, PRESSURE SENSOR MODULE, ELECTRONIC APPARATUS, AND VEHICLE
#72Differential pressure detection element, flow rate measurement device, and method of manufacturing differential pressure detection element
#73Planar cavity MEMS and related structures, methods of manufacture and design structures
#74Micromechanical system including a sensitive element and associated manufacturing method
#75MEMS process power
#76Semiconductor differential pressure sensor and manufacturing method of the same
#77Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device
#78Temporary mechanical stabilization of semiconductor cavities
#79Silicon carbide microelectromechanical structure, device, and method
#80Microscale metallic CNT templated devices and related methods
#81Planar cavity MEMS and related structures, methods of manufacture and design structures
#82Planar cavity MEMS and related structures, methods of manufacture and design structures
#83Planar cavity MEMS and related structures, methods of manufacture and design structures
#84Planar cavity MEMS and related structures, methods of manufacture and design structures
#85Semiconductor package and manufacturing method thereof
#86Planar cavity MEMS and related structures, methods of manufacture and design structures
#87MEMS device and process
#88Planar cavity MEMS and related structures, methods of manufacture and design structures
#89MEMS devices and processes
#90MEMS device and process
#91MEMS transducer having stress diffusing structures provided in a flexible membrane
#92MEMS devices and processes
#93Semiconductor pressure sensor
#94Semiconductor package and manufacturing method thereof
#95PRESSURE SENSOR, PRODUCTION METHOD FOR PRESSURE SENSOR, ALTIMETER, ELECTRONIC APPARATUS, AND MOVING OBJECT
#96Wafer level packaging of MEMS
#97Planar cavity MEMS and related structures, methods of manufacture and design structures
#98ADDITIONAL SURFACE FOR STABILIZING THE INTERNAL CAVITY PRESSURE OVER THE LIFETIME
#99Wafer handler and methods of manufacture
#100Planar cavity MEMS and related structures, methods of manufacture and design structures
#101Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
#102Pressure sensor including deformable pressure vessel(s)
#103Physical quantity sensor, manufacturing method of physical quantity sensor, sensor device, electronic apparatus, and moving object
#104Planar cavity MEMS and related structures, methods of manufacture and design structures
#105Use of metal native oxide to control stress gradient and bending moment of a released MEMS structure
#106Planar cavity MEMS and related structures, methods of manufacture and design structures
#107Low-stress low-hydrogen LPCVD silicon nitride
#108Planar cavity MEMS and related structures, methods of manufacture and design structures
#109Planar cavity MEMS and related structures, methods of manufacture and design structures
#110Planar cavity MEMS and related structures, methods of manufacture and design structures
#111Method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure
#112Method of making a MEMS die having a MEMS device on a suspended structure
#113Planar cavity MEMS and related structures, methods of manufacture and design structures
#114Method for producing a microelectromechanical transducer
#115Microelectronic packages having hermetic cavities and methods for the production thereof
#116Substrate for diaphragm-type resonant MEMS devices, diaphragm-type resonant MEMS device and method for manufacturing same
#117Planar cavity MEMS and related structures, methods of manufacture and design structures
#118Planar cavity MEMS and related structures, methods of manufacture and design structures
#119Planar cavity MEMS and related structures, methods of manufacture and design structures
#120Planar cavity MEMS and related structures, methods of manufacture and design structures
#121Wafer level packaging of MEMS
#122Methods of forming microstructure and electronic device having moveable component
#123Micromechanical sensor device
#124Method of manufacturing a temperature-compensated micro-electromechanical device
#125MEMS device with a stress-isolation structure
#126Stress buffer layer for integrated microelectromechanical systems (MEMS)
#127Sensor and method for manufacturing a sensor
#128SUPPORT FOR MEMS COVER
#129Planar cavity MEMS and related structures, methods of manufacture and design structures
#130MEMS device having a microphone structure, and method for the production thereof
#131Low temperature ceramic Microelectromechanical structures
#132Micro-electro-mechanical system (MEMS) structures and design structures
#133MEMS scanning micromirror
#134MEMS device with stress isolation and method of fabrication
#135ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
#136Methods of forming three-dimensional structures having reduced stress and/or curvature
#137Thin film device and method for manufacturing thin film device
#138METHOD OF FABRICATING AN INERTIAL SENSOR
#139Wafer level MEMS force dies
#140Ruggedized MEMS force die
#141Microscale metallic CNT templated devices and related methods
#142Method of manufacturing resonant transducer
#143Silicide micromechanical device and methods to fabricate same
#144Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of features using local oxidation regions
#145Methods to fabricate silicide micromechanical device
#146ELECTROMECHANICAL DEVICE CONFIGURED TO MINIMIZE STRESS-RELATED DEFORMATION AND METHODS FOR FABRICATING SAME
#147Method of forming membranes with modified stress characteristics
#148Flat back plate
#149Methods of forming three-dimensional structures having reduced stress and/or curvature
#150Microstructure and electronic device
#151Condenser microphone array chip
#152Method of forming an electromechanical transducer device
#153Micro-machined structure production using encapsulation
#154Method for reducing chip warpage
#155Planar cavity MEMS and related structures, methods of manufacture and design structures
#156Planar cavity MEMS and related structures, methods of manufacture and design structures
#157Planar cavity MEMS and related structures, methods of manufacture and design structures
#158Planar cavity MEMS and related structures, methods of manufacture and design structures
#159Planar cavity MEMS and related structures, methods of manufacture and design structures
#160Methods of manufacture for micro-electro-mechanical system (MEMS)
#161Planar cavity MEMS and related structures, methods of manufacture and design structures
#162Planar cavity MEMS and related structures, methods of manufacture and design structures
#163Method of manufacturing a micro-electro-mechanical system (MEMS)
#164Method for manufacturing a micromachined device and the micromachined device made thereof
#165Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature
#166Low temperature ceramic microelectromechanical structures
#167Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
#168METHODS FOR FORMING LAYERS WITHIN A MEMS DEVICE USING LIFTOFF PROCESSES
#169Electromechanical device configured to minimize stress-related deformation and methods for fabricating same
#170MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
#171Methods for forming layers within a MEMS device using liftoff processes
#172Micro-machined structure production using encapsulation
#173Method for reducing chip warpage
#174Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device
#175Method for forming silicon germanium layers at low temperatures, layers formed therewith and structures comprising such layers
#176Membrane structure element and method for manufacturing same
#177Micro-Electromechanical System Memory Device and Method of Making the Same
#178Polysilicon deposition and anneal process enabling thick polysilicon films for MEMS applications
#179Method of controlling film stress in MEMS devices
#180Methods for etching layers within a MEMS device to achieve a tapered edge
#181Nanocomposite films
#182Micromechanical device comprising a mobile beam
#183Micro-machined structure production using encapsulation
#184Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature
#185Patterning of mechanical layer in MEMS to reduce stresses at supports
#186Doping of SiC structures and methods associated with same
#187Isolation scheme for reducing film stress in a MEMS device
#188Vertically spaced plural microsprings
#189Method for manufacturing a micro-electro-mechanical device
#190MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
#191Methods for forming layers within a MEMS device using liftoff processes to achieve a tapered edge
#192MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same
#193Infrared radiation detector
#194High reflector tunable stress coating, such as for a MEMS mirror
#195High reflector tunable stress coating, such as for a MEMS mirror
#196Electroplating pcb components
#197Fabrication of advanced silicon-based MEMS devices
#198Process for forming microstructures
#199Process for forming MEMS
#200Method of fabricating silicon-based MEMS devices
#201Micro-machined structure production using encapsulation
#202Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device
#203Method of fabricating silicon-based MEMS devices
#204Method to control residual stress in a film structure and a system thereof
#205Process of forming a capacitative audio transducer
#206Methods and structure for improving wafer bow control
#207Method of fabrication of an infrared radiation detector and infrared detector device
#208MEMS device with a diaphragm having a slotted layer
#209Microscale metallic CNT templated devices and related methods
#210MEMS device with reduced dynamic stress and methods
#211Method of improving MEMS microphone mechanical stability