ClassID:

84008

B81C1/00793 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Preserve existing structures from alteration, e.g. temporary protection during manufacturing; Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching Avoid contamination, e.g. absorption of impurities or oxidation

Recent Application in this class:
#1
20250373966
2025-12-04

MEMS DEVICE AND METHOD FOR FABRICATING A MEMS DEVICE

#2
20250333294
2025-10-30

DEVICE INCLUDING MEMS SENSOR AND METHOD OF MANUFACTURING THE SAME

#3
20250157998
2025-05-15

MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD

#4
20250109016
2025-04-03

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRESPONDING MICROMECHANICAL SENSOR COMPONENT

#5
20240409397
2024-12-12

MEMS SWITCH UTILIZING CONDUCTIVE BARRIER LAYER

#6
20240359975
2024-10-31

METHOD FOR PRODUCING A PARTICLE PROTECTION ELEMENT, IN PARTICULAR A PARTICLE FILTER, FOR A MEMBRANE OF A PRESSURE SENSOR, PARTICLE PROTECTION ELEMENT, METHOD FOR PRODUCING A PRESSURE SENSOR, AND PRESSURE SENSOR

#7
20210225637
2021-07-22

Freezing a sacrificial material in forming a semiconductor

#8
20200331749
2020-10-22

MEMS device and fabrication method thereof

#9
20200189910
2020-06-18

Microelectromechanical system cavity packaging

#10
20190271894
2019-09-05

Display apparatus and method of manufacturing the same

#11
20190189427
2019-06-20

Freezing a sacrificial material in forming a semiconductor

#12
20190185320
2019-06-20

Microelectromechanical system cavity packaging

#13
20190077656
2019-03-14

Methods for depositing a measured amount of a species in a sealed cavity

#14
20180011385
2018-01-11

Display apparatus and method of manufacturing the same

#15
20170197821
2017-07-13

Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer

#16
20170115177
2017-04-27

Humidity resistant sensors and methods of making same

#17
20150292973
2015-10-15

Humidity resistant sensors and methods of making same

#18
20150266722
2015-09-24

MEMS structures and methods for forming the same

#19
20150097215
2015-04-09

Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate

#20
20150076626
2015-03-19

ELECTRONIC DEVICE

#21
20150040368
2015-02-12

Method for producing structured optical components

#22
20140239423
2014-08-28

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof

#23
20130099355
2013-04-25

MEMS structures and methods for forming the same

#24
20120086998
2012-04-12

DIFFUSION BARRIER LAYER FOR MEMS DEVICES

#25
20100046058
2010-02-25

Diffusion barrier layer for MEMS devices

#26
20090124074
2009-05-14

Wafer level sensing package and manufacturing process thereof

#27
20090121299
2009-05-14

Wafer level sensing package and manufacturing process thereof

#28
20070146859
2007-06-28

Optical modulator

#29
20070096300
2007-05-03

Diffusion barrier layer for MEMS devices

#30
20060266730
2006-11-30

Microelectromechanical structure and a method for making the same

#31
20060066932
2006-03-30

Method of selective etching using etch stop layer

#32
20050054135
2005-03-10

Barrier layers for microelectromechanical systems