B81C1/00785 - CPC Classification Index

ClassID:

84007 ⎘

B81C1/00785 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Preserve existing structures from alteration, e.g. temporary protection during manufacturing Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching

Sub-classes:

B81C1/00793 » {Avoid contamination, e.g. absorption of impurities or oxidation} 29
B81C1/00801 » {Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer } 112
B81C1/00809 » {Methods to avoid chemical alteration not provided for in groups to } 3

Recent Application in this class:

20200223690

2020-07-16

Selective wafer removal process for wafer bonding applications

20190310153

2019-10-10

Methods for fabricating pressure sensors with non-silicon diaphragms

20180201498

2018-07-19

Micro-electro-mechanical system structure and method for forming the same

20180175161

2018-06-21

Method for providing a low-k spacer

20170115175

2017-04-27

Pressure sensor with support structure for non-silicon diaphragm

20170113927

2017-04-27

Methods for fabricating pressure sensors with non-silicon diaphragms