84009 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Preserve existing structures from alteration, e.g. temporary protection during manufacturing; Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVING PROTECTION WALL
#2MICROMECHANICAL COMPONENT
#3DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE
#4Dielectric protection layer configured to increase performance of mems device
#5MEMS DEVICE MANUFACTURING METHOD
#6Micromechanical component for a sensor device or microphone device
#7Actuator layer patterning with polysilicon and etch stop layer
#8Gas sensor and manufacturing method thereof
#9Micro-electromechanical system and method for fabricating MEMS having protection wall
#10MANUFACTURING A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
#11Method for producing a microelectromechanical sensor and microelectromechanical sensor
#12MEMS display device with an etch-stop-layer
#13Semiconductor package structure and method for manufacturing the same
#14Semiconductor device, microphone and methods for forming a semiconductor device
#15Microelectromechanical component and method for producing same
#16Microelectromechanical systems (MEMS) structure to prevent stiction after a wet cleaning process
#17Display apparatus and method of manufacturing the same
#18Micromechanical structure having a copper circuit trace
#19MEMS method and structure
#20Micro-device having a metal-semiconductor compound layer protected against HF etching and method for making the same
#21Method for manufacturing semiconductor device
#22Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#23SEMICONDUCTOR PROCESS
#24Semiconductor device, microphone and methods for forming a semiconductor device
#25Planar processing of suspended microelectromechanical systems (MEMS) devices
#26Wafer-level package with enhanced performance
#27Display apparatus and method of manufacturing the same
#28Structure for device with integrated microelectromechanical systems
#29Electromechanical device including connector formed of dielectric material
#30Infrared sensor design using an epoxy film as an infrared absorption layer
#31MICROMECHANICAL LAYER SYSTEM
#32CMOS-MEMS integrated device with selective bond pad protection
#33MEMS structure with an etch stop layer buried within inter-dielectric layer
#34Semiconductor structure and fabrication method thereof
#35Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#36Semiconductor device and method for manufacturing the same
#37MEMS method and structure
#38Chip package and a method of producing the same
#39Microfabricated gas flow structure
#40Method for achieving good adhesion between dielectric and organic material
#41Methods and structures of integrated MEMS-CMOS devices
#42Electronic device, physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object
#43Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#44Passivated microelectromechanical structures and methods
#45Method of manufacturing a MEMS microphone
#46Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#47MEMS structure with improved shielding and method
#48MEMS pressure sensor and method of manufacturing the same
#49INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER
#50Method for structuring a layered structure from two semiconductor layers, and micromechanical component
#51Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration
#52Method of fabricating integrated structure for MEMS device and semiconductor device
#53MEMS structure with improved shielding and method
#54Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
#55Method for manufacturing a MEMS sensor
#56Electronic device, method for producing the same, and oscillator
#57MEMS method and structure
#58Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#59Semiconductor device and method for manufacturing the same
#60Methods and structures of integrated MEMS-CMOS devices
#61Micromechanical device and methods to fabricate same using hard mask resistant to structure release etch
#62Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration
#63MEMS devices and methods of forming same
#64MEMS device etch stop
#65Cavity open process to improve undercut
#66Infrared sensor design using an epoxy film as an infrared absorption layer
#67MEMS sensor and method for producing MEMS sensor, and MEMS package
#68Electronic device, electronic apparatus, and method of manufacturing electronic device
#69Spin-on protective coatings for wet-etch processing of microelectronic substrates
#70Method of making a micro-electro-mechanical-systems (MEMS) device
#71Chip, method for producing a chip and device for laser ablation
#72MEMS integrated chip with cross-area interconnection
#73MEMS integrated chip with cross-area interconnection
#74MEMS devices with multi-component sacrificial layers
#75Acid-etch resistant, protective coatings
#76Semiconductor structure, pad structure and protection structure
#77MEMS DEVICE WITH A COMPOSITE BACK PLATE ELECTRODE AND METHOD OF MAKING THE SAME
#78Dielectric etching
#79Method of etching the back side of a wafer
#80MEMS INTEGRATED CHIP WITH CROSS-AREA INTERCONNECTION
#81MEMS devices with multi-component sacrificial layers
#82MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall
#83Method of etching sacrificial layer, method of manufacturing MEMS device, MEMS device and MEMS sensor
#84Method for manufacturing an intergrated pressure sensor
#85Method for producing a structure comprising a mobile element by means of a heterogeneous sacrificial layer
#86Method of fabricating a suspension microstructure
#87Integrated structure for MEMS device and semiconductor device and method of fabricating the same
#88Method for fabricating a microstructure
#89Spin-on protective coatings for wet-etch processing of microelectronic substrates
#90MEMS DEVICES WITH PROTECTIVE COATINGS
#91Methods of making a MEMS device by monitoring a process parameter
#92Apparatus having a layer of material configured as a reservoir having an interior capable of holding a liquid
#93Method for manufacturing floating structure of microelectromechanical system
#94Silicon-rich silicon nitrides as etch stops in MEMS manufacture
#95MEMS devices with an etch stop layer
#96Aluminum fluoride films for microelectromechanical system applications
#97Structure of a micro electro mechanical system and the manufacturing method thereof
#98STRUCTURE OF A MICRO ELECTRO MECHANICAL SYSTEM AND THE MANUFACTURING METHOD THEREOF
#99Process for manufacturing an apparatus that protects features during the removal of sacrificial materials
#100Surfactant-enhanced protection of micromechanical components from galvanic degradation
#101Methods for producing MEMS with protective coatings using multi-component sacrificial layers
#102Silicon-rich silicon nitrides as etch stops in MEMS manufacture
#103Multiple stage MEMS release for isolation of similar materials
#104Utilizing a protective plug to maintain the integrity of the FTP shrink hinge
#105Method of selective etching using etch stop layer
#106MEMS device polymer film deposition process
#107Method for making a microelectromechanical system using a flexure protection layer
#108Fabrication of silicon micro-mechanical structures
#109Wafer protection device
#110Structure of a micro electro mechanical system and the manufacturing method thereof
#111Micromechanical component and method for producing same
#112Electronic device with thin film structure