ClassID:

84025

B81C1/00928 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Treatments or methods for avoiding stiction of flexible or moving parts of MEMS; For avoiding stiction during the manufacturing process of the device, e.g. during wet etching Eliminating or avoiding remaining moisture after the wet etch release of the movable structure

Recent Application in this class:
#1
20260132019
2026-05-14

Anti-Stiction Process for Mems Device

#2
20250066188
2025-02-27

MEMS GRATING AND FABRICATION METHOD

#3
20220242724
2022-08-04

Anti-stiction process for MEMS device

#4
20200148534
2020-05-14

METHOD FOR ACHIEVING STICTION-FREE HIGH-ASPECT-RATIO MICROSTRUCTURES AFTER WET CHEMICAL PROCESSING

#5
20200123003
2020-04-23

Anti-stiction process for MEMS device

#6
20190071308
2019-03-07

Semiconductor device with patterned contact area

#7
20190035611
2019-01-31

Systems and methods for uniform target erosion magnetic assemblies

#8
20190031503
2019-01-31

Anti-stiction process for MEMS device

#9
20180261449
2018-09-13

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#10
20180047582
2018-02-15

Semiconductor Device and Method of Manufacturing the Semiconductor Device

#11
20170301564
2017-10-19

Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chip

#12
20160365238
2016-12-15

Substrate processing method and substrate processing apparatus

#13
20150244289
2015-08-27

VIBRATOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPLIANCE

#14
20150147841
2015-05-28

Method to release diaphragm in MEMS device

#15
20140042563
2014-02-13

Integrated circuit with MEMS element and manufacturing method thereof

#16
20130292647
2013-11-07

Methods of forming hydrophobic surfaces on semiconductor device structures, methods of forming semiconductor device structures, and semiconductor device structures

#17
20120196445
2012-08-02

Method and apparatus for etching the silicon oxide layer of a semiconductor substrate

#18
20120135604
2012-05-31

Processing liquid for suppressing pattern collapse of fine metal structure, and method for producing fine metal structure using same

#19
20070134927
2007-06-14

Method for removing residues formed during the manufacture of MEMS devices

#20
20070105385
2007-05-10

Method of fabricating suspended structure

#21
20060207968
2006-09-21

Selective etching of oxides from substrates

#22
20050074913
2005-04-07

Stiction resistant release process

#23
20050051930
2005-03-10

Fine structure composite and drying method of fine structure using the same