ClassID:

84024

B81C1/0092 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Treatments or methods for avoiding stiction of flexible or moving parts of MEMS For avoiding stiction during the manufacturing process of the device, e.g. during wet etching

Sub-classes:
Recent Application in this class:
#1
20260132019
2026-05-14

Anti-Stiction Process for Mems Device

#2
20230264949
2023-08-24

EXTENDED ACID ETCH FOR OXIDE REMOVAL

#3
20220242724
2022-08-04

Anti-stiction process for MEMS device

#4
20220153574
2022-05-19

Extended acid etch for oxide removal

#5
20200262697
2020-08-20

Stiction reduction system and method thereof

#6
20200123003
2020-04-23

Anti-stiction process for MEMS device

#7
20190241425
2019-08-08

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#8
20190035611
2019-01-31

Systems and methods for uniform target erosion magnetic assemblies

#9
20190031503
2019-01-31

Anti-stiction process for MEMS device

#10
20180230001
2018-08-16

Semiconductor device

#11
20180134542
2018-05-17

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#12
20160167256
2016-06-16

Method for producing nanoimprint mold

#13
20150368099
2015-12-24

Etch release residue removal using anhydrous solution

#14
20120181249
2012-07-19

Processing liquid for suppressing pattern collapse of fine metal structure and method for producing fine metal structure using same

#15
20090002804
2009-01-01

Electromechanical device treatment with water vapor

#16
20060234412
2006-10-19

MEMS release methods

#17
20060207968
2006-09-21

Selective etching of oxides from substrates

#18
20060166393
2006-07-27

Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel

#19
20050132798
2005-06-23

Method for fabricating a gyroscope

#20
20050051930
2005-03-10

Fine structure composite and drying method of fine structure using the same