84030 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Treatments or methods for avoiding stiction of flexible or moving parts of MEMS; For avoiding stiction when the device is in use, i.e. after manufacture has been completed Methods for breaking the stiction bond
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
#2CAPACITIVE SENSOR AND METHOD FOR MANUFACTURING SAME
#3SEMICONDUCTOR MEMS STRUCTURE AND METHOD OF FORMING THE SAME
#4FUNCTIONALIZED OXOACID LUBRICANTS IN MEMS DEVICES
#5SEMICONDUCTOR DEVICES, MICROELECTROMECHANICAL SYSTEM AND METHODS
#6ANTI-STICTION PATTERNING WITHIN MEMS LAYER
#7MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION
#8PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS
#9MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
#10MEMS Device and Fabrication Process with Reduced Z-Axis Stiction
#11DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
#12MEMS capacitance microphone and manufacturing method thereof
#13Piezoelectric anti-stiction structure for microelectromechanical systems
#14MEMS MICROPHONE STRUCTURE AND MANUFACTURING METHOD THEREOF
#15Roughness selectivity for MEMS movement stiction reduction
#16MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR OR MICROPHONE DEVICE
#17METHOD FOR STRUCTURAL LAYER FABRICATION IN MICROMECHANICAL DEVICES
#18Mems inertial sensor with high resistance to stiction
#19Actuator layer patterning with polysilicon and etch stop layer
#20MEMS device and method for making the same
#21Piezoelectric anti-stiction structure for microelectromechanical systems
#22Anti-stiction enhancement of ruthenium contact
#23Micro-electro mechanical system device containing a bump stopper and methods for forming the same
#24Manufacturing method of semiconductor structure
#25Roughness selectivity for MEMS movement stiction reduction
#26Method for preparing silicon wafer with rough surface and silicon wafer
#27MEMS sensor including a diaphragm and method for manufacturing a MEMS sensor
#28Method to form a rough crystalline surface
#29FORMATION OF SELF-ASSEMBLED MONOLAYER FOR ULTRASONIC TRANSDUCERS
#30Dual back-plate and diaphragm microphone
#31Micro-electro mechanical system device containing a bump stopper and methods for forming the same
#32MEMS device with reduced electric charge, cavity volume and stiction
#33Piezoelectric anti-stiction structure for microelectromechanical systems
#34Manufacturing method of semiconductor structure
#35Method for manufacturing MEMS microphone
#36Micro check valve and system with multiple micro check valves and method for the production thereof
#37Dual back-plate and diaphragm microphone
#38MEMS microphone and method of manufacturing the same
#39Semiconductor device and manufacture thereof
#40Comb MEMS Device and Method of Making a Comb MEMS Device
#41Method for manufacturing a micromechanical sensor
#42Semiconductor device and manufacture thereof
#43Semiconductor MEMS structure
#44Semiconductor MEMS structure and manufacturing method thereof
#45Rough layer for better anti-stiction deposition
#46Semi-flexible proof-mass
#47RESONANCE-ACTUATION OF MICROSHUTTER ARRAYS
#48MEMS device
#49Comb MEMS device and method of making a comb MEMS device
#50METHOD FOR FORMING ANTI STICTION COATING AND ANTI STICTION COATING THEREOF
#51Accelerometer integrity alert
#52Film induced interface roughening and method of producing the same
#53Recovery system and methods for MEMS devices
#54Active lateral force stiction self-recovery for microelectromechanical systems devices
#55Anti-stiction method in an inertial MEMS, corresponding computer program product, storage means and device
#56Microelectronic device and electronic apparatus
#57Laser generated stress waves for stiction repair
#58Control circuit for overcoming stiction
#59Systems and methods for overcoming stiction
#60Method for preparing silicon wafer with rough surface and silicon wafer