ClassID:

84029

B81C1/0096 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Treatments or methods for avoiding stiction of flexible or moving parts of MEMS For avoiding stiction when the device is in use, i.e. after manufacture has been completed

Sub-classes:
Recent Application in this class:
#1
20260132019
2026-05-14

Anti-Stiction Process for Mems Device

#2
20220242724
2022-08-04

Anti-stiction process for MEMS device

#3
20220063995
2022-03-03

Method for preparing silicon wafer with rough surface and silicon wafer

#4
20200346919
2020-11-05

MEMS apparatus with anti-stiction layer

#5
20200262697
2020-08-20

Stiction reduction system and method thereof

#6
20200123003
2020-04-23

Anti-stiction process for MEMS device

#7
20190241425
2019-08-08

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#8
20190035611
2019-01-31

Systems and methods for uniform target erosion magnetic assemblies

#9
20190031503
2019-01-31

Anti-stiction process for MEMS device

#10
20180290880
2018-10-11

Isolated protrusion/recession features in a micro electro mechanical system

#11
20180134542
2018-05-17

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#12
20160167944
2016-06-16

Reducing MEMS stiction by deposition of nanoclusters

#13
20160060108
2016-03-03

Coatings for relatively movable surfaces

#14
20150360938
2015-12-17

MEMS structure, cap substrate and method of fabricating the same

#15
20150353342
2015-12-10

MEMS and method for forming the same

#16
20140329392
2014-11-06

Coatings for relatively movable surfaces

#17
20140185127
2014-07-03

Preventing glass particle injection during the oil fill process

#18
20140171108
2014-06-19

Dynamic access point based positioning

#19
20140167189
2014-06-19

Reducing MEMS stiction by deposition of nanoclusters

#20
20100127339
2010-05-27

MICROMECHANICAL COMPONENT HAVING AN ANTI-ADHESIVE LAYER

#21
20090284823
2009-11-19

Method of operating a micromechanical device that contains anti-stiction gas-phase lubricant

#22
20090278214
2009-11-12

Microelectromechanical systems encapsulation process

#23
20090267445
2009-10-29

MICRO ROCKING DEVICE AND METHOD FOR MANUFACTURING THE SAME

#24
20090200619
2009-08-13

Methods for forming metal layers for a MEMS device integrated circuit

#25
20090184728
2009-07-23

Contact device and method for producing the same

#26
20090162534
2009-06-25

Method for producing a membrane

#27
20090065928
2009-03-12

Anti-stiction technique for electromechanical systems and electromechanical device employing same

#28
20090004388
2009-01-01

Method for Depositing an Anti-Adhesion Layer

#29
20080290494
2008-11-27

Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same

#30
20080248613
2008-10-09

Method of Forming a Micromechanical Device with Microfluidic Lubricant Channel

#31
20080074771
2008-03-27

Method for providing an anti-stiction coating on a metal surface

#32
20080055703
2008-03-06

In SITU application of anti-stiction materials to micro devices

#33
20080050861
2008-02-28

Microelectromechanical systems encapsulation process with anti-stiction coating

#34
20080050845
2008-02-28

Microelectromechanical systems encapsulation process

#35
20070196945
2007-08-23

Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor

#36
20070117244
2007-05-24

Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems

#37
20070115532
2007-05-24

Method of using a preferentially deposited lubricant to prevent anti-stiction in micromechanical systems

#38
20070115531
2007-05-24

Method of operating a micromechanical device that contains anti-stiction gas-phase lubricant

#39
20070115530
2007-05-24

Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant

#40
20070114883
2007-05-24

Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems

#41
20070114882
2007-05-24

Anti-stiction gas-phase lubricant for micromechanical systems

#42
20060246631
2006-11-02

Anti-stiction technique for electromechanical systems and electromechanical device employing same

#43
20060038269
2006-02-23

Method and apparatus for lubricating microelectromechanical devices in packages

#44
20060027020
2006-02-09

Tungsten coated silicon fingers

#45
20060007515
2006-01-12

Surface lubrication in microstructures

#46
20050260783
2005-11-24

Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems

#47
20050255645
2005-11-17

Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems

#48
20050241944
2005-11-03

Membrane and method for the production of the same

#49
20050214970
2005-09-29

Packaged microelectromechanical device with lubricant

#50
20050145961
2005-07-07

MEMS passivation with transition metals

#51
20050118742
2005-06-02

Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device

#52
20050110051
2005-05-26

Surface processing method for a chip device and a chip device formed by he method

#53
20050106774
2005-05-19

Surface processes in fabrications of microstructures

#54
20050095833
2005-05-05

Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems

#55
20050037135
2005-02-17

Methods for forming composite coatings on MEMS devices

#56
20050012975
2005-01-20

AlOatomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices