84128 ⎘
Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing; Transfer of a layer from a carrier wafer to a device wafer by cleaving the carrier wafer
MICROFLUIDIC DEVICES AND METHODS OF PRODUCING
#2MEMBRANE TRANSFER METHOD
#3ACTUATOR LAYER DEPOSITION AND TRANSFER
#4MEMBRANE TRANSFER METHOD
#5METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE PRODUCED BY SAID METHOD, AND USE OF SUCH A SUBSTRATE
#6Method of treating a solid layer bonded to a carrier substrate
#7Method for preparing the remainder of a donor substrate, substrate produced by said method, and use of such a substrate
#8METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES FILLED WITH A SACRIFICIAL MATERIAL
#9Method for processing a monocrystalline substrate and micromechanical structure
#10METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE
#11Method for the material-saving production of wafers and processing of wafers
#12Method for processing a monocrystalline substrate and micromechanical structure
#13Methods of fabricating semiconductor structures including cavities filled with a sacrificial material
#14Systems and methods for laser splitting and device layer transfer
#15CONTROLLED PROCESS AND RESULTING DEVICE
#16Controlled process and resulting device
#17Method for manufacturing capped MEMS components
#18Method and structure of monolithically integrated pressure sensor using IC foundry-compatible processes
#19Method and device for controlled cleaving process
#20Controlled process and resulting device
#21Controlled cleaving process
#22Method and device for controlled cleaving process
#23Controlled process and resulting device
#24Controlled process and resulting device
#25Process for cutting out a block of material and formation of a thin film
#26Controlled cleaving process
#27Controlled cleaving process
#28Method and device for controlled cleaving process