84139 ⎘
Manufacture or treatment of microstructural devices or systems; Temporary protection of devices or parts of the devices during manufacturing Depositing a protective layers
METHODS FOR POST-PROCESSING AND FOR HANDLING OF MEMS CHIPS
#2METHOD FOR PRODUCING A MEMS MIRROR ARRAY, AND MEMS MIRROR ARRAY
#3METHOD FOR PROCESSING SILICON SUBSTRATE AND METHOD FOR PROCESSING LIQUID EJECTION HEAD SUBSTRATE
#4DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE
#5PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF
#6MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) VIBRATION SENSOR AND FABRICATING METHOD THEREOF
#7Dielectric protection layer configured to increase performance of mems device
#8Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
#9Microfluidic chip and fabrication method
#10Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
#11Method for etching gaps of unequal width
#12Manufacturing method of semiconductor structure
#13Protective member forming apparatus
#14Method and structure for sensors on glass
#15Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device
#16Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
#17Method with mechanical dicing process for producing MEMS components
#18Method for manufacturing an etch stop layer and MEMS sensor comprising an etch stop layer
#19Semiconductor package structure and method for manufacturing the same
#20Semiconductor device, microphone and methods for forming a semiconductor device
#21Method for manufacturing micromechanical structures in a device wafer
#22Structure for integrated microphone
#23Manufacturing method of semiconductor structure
#24ELEVATED MEMS DEVICE IN A MICROPHONE WITH INGRESS PROTECTION
#25Method for manufacturing MEMS microphone
#26Microelectromechanical system cavity packaging
#27Light module
#28Method for manufacturing a MEMS unit for a micromechanical pressure sensor
#29MEMS device and method of manufacturing a MEMS device
#30Microelectromechanical system cavity packaging
#31Elevated MEMS device in a microphone with ingress protection
#32Method for manufacturing micromechanical structures in a device wafer
#33Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#34MEMS-device manufacturing method, MEMS device, and MEMS module
#35SEMICONDUCTOR PROCESS
#36Method for manufacturing a microphone
#37MANUFACTURING METHOD FOR A MICROMECHANICAL DEVICE INCLUDING AN OBLIQUE SURFACE AND CORRESPONDING MICROMECHANICAL DEVICE
#38Semiconductor device, microphone and methods for forming a semiconductor device
#39MEMS device and method of manufacturing a MEMS device
#40Peeling method of cover member and manufacturing method of liquid ejecting head
#41Process for producing an electromechanical device
#42Hermetically sealed MEMS device and its fabrication
#43Semiconductor structure and manufacturing method thereof
#44Wafer-level package with enhanced performance
#45Protective coating on trench features of a wafer and method of fabrication thereof
#46Field emission devices and methods of making thereof
#47Support pillar
#48Support pillar
#49Support pillar
#50Electronic device using MEMS technology
#51Electromechanical device including connector formed of dielectric material
#52Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer
#53Hermetically sealed MEMS device and its fabrication
#54Manufacturing method of MEMS chip
#55INTEGRATED MEMS-CMOS DEVICES AND INTEGRATED CIRCUITS WITH MEMS DEVICES AND CMOS DEVICES
#56Microelectronic component arrangement and production method for a microelectronic component arrangement
#57Manufacturing method of electronic device, electronic device, electronic apparatus, and moving body
#58CMOS-MEMS integrated device with selective bond pad protection
#59Method for transferring graphene by attaching removable frame to protective layer applied on a sample containing graphene monolayer
#60SENSOR ELEMENT, METHOD FOR MANUFACTURING SENSOR ELEMENT, DETECTION DEVICE, AND METHOD FOR MANUFACTURING DETECTION DEVICE
#61Composite cavity and forming method thereof
#62Semiconductor structure and manufacturing method thereof
#63Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#64DEVICES WITH THINNED WAFER
#65Support pillar
#66MEMS device and method of manufacturing a MEMS device
#67Chip package and a method of producing the same
#68Method for applying a structured coating to a component
#69Integrated MEMS device
#70Method for achieving good adhesion between dielectric and organic material
#71Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure
#72Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)
#73Method for manufacturing a microphone
#74Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#75Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body
#76Sensor protective coating
#77Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#78Method of fabricating nano-scale structures and nano-scale structures fabricated using the method
#79MEMS structure with improved shielding and method
#80Method of manufacturing apparatus for harvesting and storing piezoelectric energy
#81Method for manufacturing an integrated MEMS device
#82MEMS structures and methods for forming the same
#83LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT
#84MEMS chip and manufacturing method therefor
#85MEMS-microphone with reduced parasitic capacitance
#86ELECTRONIC DEVICE
#87Encapsulation structure including a mechanically reinforced cap and with a getter effect
#88MEMS structure with improved shielding and method
#89Method for manufacturing a MEMS sensor
#90Method for manufacturing a protective layer against HF etching, semiconductor device provided with the protective layer and method for manufacturing the semiconductor device
#91Low-voltage MEMS shutter assemblies
#92Fabrication method for a chip package
#93MEMS device and method of manufacturing a MEMS device
#94Field emission devices and methods of making thereof
#95MEMS structures and methods for forming the same
#96Apparatus for harvesting and storing piezoelectric energy and manufacturing method thereof
#97Base surface processing method and MEMS device
#98Method to prevent metal pad damage in wafer level package
#99MEMS sensor and method for producing MEMS sensor, and MEMS package
#100Electronic device, electronic apparatus, and method of manufacturing electronic device
#101Method of making a micro-electro-mechanical-systems (MEMS) device
#102Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures
#103Acoustic sensor and method of manufacturing the same
#104Constrained oxidation of suspended micro- and nano-structures
#105Acid-etch resistant, protective coatings
#106Chip package and fabrication method thereof
#107Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
#108MEMS component, method for producing a MEMS component, and method for handling a MEMS component
#109Method of etching the back side of a wafer
#110Controlling electromechanical behavior of structures within a microelectromechanical systems device
#111Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device Fabrication
#112Method for producing a plurality of chips and a chip produced accordingly
#113Method of etching sacrificial layer, method of manufacturing MEMS device, MEMS device and MEMS sensor
#114Method for producing a structure comprising a mobile element by means of a heterogeneous sacrificial layer
#115Protection of cavities opening onto a face of a microstructured element
#116Micromechanical diaphragm sensor having a double diaphragm
#117Method of producing mechanical components of MEMS or NEMS structures made of monocrystalline silicon
#118Wafer level sensing package and manufacturing process thereof
#119Wafer level sensing package and manufacturing process thereof
#120Dicing method using volatile protective agent
#121Surfactant-enhanced protection of micromechanical components from galvanic degradation
#122Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures
#123Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#124Optical modulator
#125Method of protecting wafer front pattern and method of performing double-sided process
#126Microelectromechanical structure and a method for making the same
#127Utilizing a protective plug to maintain the integrity of the FTP shrink hinge
#128Processing method for protection of backside of a wafer
#129Method for producing a MEMS device
#130Methods and apparatus having wafer level chip scale package for sensing elements
#131Method and apparatus for preventing metal/silicon spiking in MEMS devices
#132Wafer dividing method
#133Methods for dicing a released CMOS-MEMS multi-project wafer
#134METHOD OF PERFORMING DOUBLE-SIDED PROCESSES UPON A WAFER
#135MEMS device polymer film deposition process
#136Apparatus and method of wafer level package
#137Controlling electromechanical behavior of structures within a microelectromechanical systems device
#138Method for making a microelectromechanical system using a flexure protection layer
#139Microdevice with movable microplatform and process for making thereof
#140Micromechanical device recoat methods
#141Enhancement of fabrication yields of nanomechanical devices by thin film deposition
#142Semiconductor sensor
#143Barrier layers for microelectromechanical systems
#144CMOS and pressure sensor integrated on a chip and fabrication method
#145Integrated MEMS-CMOS devices and methods for fabricating MEMS devices and CMOS devices