B81C2201/05 - CPC Classification Index

ClassID:

84138 ⎘

B81C2201/05 - CPC Classification

Classification description:

Manufacture or treatment of microstructural devices or systems Temporary protection of devices or parts of the devices during manufacturing

Sub-classes:

DROP TEST DEVICE FOR A MICROMECHANICAL COMPONENT

Method for manufacturing a micro electro-mechanical system

Panel level packaging for MEMS application

Semiconductor structure and fabrication method thereof

Chip package and a method of producing the same

Methods and structures of integrated MEMS-CMOS devices

COMPONENT INCLUDING MEANS FOR REDUCING ASSEMBLY-RELATED MECHANICAL STRESSES AND METHODS FOR MANUFACTURING SAME