84140 ⎘
Manufacture or treatment of microstructural devices or systems; Temporary protection of devices or parts of the devices during manufacturing Releasing structures at the end of the manufacturing process
Method for singulating a wafer and suitable device
#2DEVICE ENCAPSULATION USING PHYSICAL VAPOR DEPOSITION
#3METHOD FOR PRODUCING A MEMS MIRROR ARRAY, AND MEMS MIRROR ARRAY
#4TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
#5TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
#6DOUBLE NOTCH ETCH TO REDUCE UNDER CUT OF MICRO ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICES
#7MICROMECHANICAL DIAPHRAGM SYSTEM
#8Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
#9MEMS DEVICE MANUFACTURING METHOD
#10Top notch slit profile for MEMS device
#11Semiconductor removing apparatus and operation method thereof
#12Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
#13Electrically functional polymer microneedle array
#14Semiconductor device, microphone and methods for forming a semiconductor device
#15Method and apparatus for reducing in-process and in-use stiction for MEMS devices
#16Method for producing thin MEMS wafers
#17Semiconductor device, microphone and methods for forming a semiconductor device
#18System and method for wafer-scale fabrication of free standing mechanical and photonic structures by ion beam etching
#19Method and apparatus for reducing in-process and in-use stiction for MEMS devices
#20Method of strain gauge fabrication using a transfer substrate
#21Flexible disposable MEMS pressure sensor
#22Structure for device with integrated microelectromechanical systems
#23Simplified MEMS device fabrication process
#24Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#25Method for encapsulating a microelectronic device with a release hole of variable dimension
#26Method of encapsulating a microelectronic component
#27Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#28Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
#29Integrated MEMS device
#30Integration of pressure sensors into integrated circuit fabrication and packaging
#31Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#32Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#33Magnet placement for integrated sensor packages
#34Method of manufacturing a semiconductor integrated circuit device having a MEMS element
#35Method of manufacturing a semiconductor integrated circuit device having a MEMS element
#36Method for releasing the suspended structure of a NEMS and/or NEMS component
#37Method of fabricating an integrated CMOS-MEMS device
#38Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained
#39METHOD AND SYSTEM FOR XENON FLUORIDE ETCHING WITH ENHANCED EFFICIENCY
#40Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
#41MEMS device
#42Electromechanical element, electric circuit device and production method of those
#43Method and system for xenon fluoride etching with enhanced efficiency
#44MEMS device polymer film deposition process
#45Method for stripping sacrificial layer in MEMS assembly
#46Method for making a microelectromechanical system using a flexure protection layer
#47Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
#48MEMS structure and manufacturing method thereof
#49Integration of electromechanical and CMOS devices in front-end-of-line using replacement metal gate process flow