84144 ⎘
Manufacture or treatment of microstructural devices or systems; Treatments for avoiding stiction of elastic or moving parts of MEMS Using supercritical fluid, e.g. carbon dioxide, for removing sacrificial layers
Method and apparatus for etching the silicon oxide layer of a semiconductor substrate
#2Method for Depositing an Anti-Adhesion Layer
#3Method for stripping sacrificial layer in MEMS assembly
#4Process for producing structural body and etchant for silicon oxide film
#5Method for removing a sacrificial material with a compressed fluid
#6Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#7Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
#8Etching process
#9Etching method