WAFER LEVEL HERMETICALLY SEALED MEMS DEVICE

MEMS device package with vacuum cavity by two-step solder reflow method

Method and system for MEMS devices

Microsystem

MEMS packaging scheme using dielectric fence

Membrane, especially for an optical device having a deformable membrane

Socket type MEMS device with stand-off portion

MEMS package and method for the production thereof

MICROMECHANICAL ACCELERATION SENSOR AND METHOD FOR MANUFACTURING AN ACCELERATION SENSOR

In-situ cavity integrated circuit package

MEMS device including a chip carrier

Micro-electro-mechanical-system device with guard ring and method for making same

Method of Fabricating High Aspect Ratio Transducer Using Metal Compression Bonding

Substrate bonding with metal germanium silicon material

Micro-passage chip

Microelectromechanical apparatus and method for producing the same

Semiconductor package

Micro-optical device packaging system

MICROMECHANICAL COMPONENT HAVING AN ANTI-ADHESIVE LAYER

ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME

Microphone package with minimum footprint size and thickness

SILICON-BASED MICROPHONE PACKAGE

Semiconductor device and manufacturing method thereof

Housing for micro-mechanical and micro-optical components used in mobile applications

Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME

Wide band and radio frequency waveguide and hybrid integration in a silicon package

FRAME AND METHOD OF MANUFACTURING ASSEMBLY

Method for capping a MEMS wafer

HERMETIC SEALING OF MICRO DEVICES

Wafer level package structure, and sensor device obtained from the same package structure

Electronic device packages and methods of formation

Microwave Cure of Semiconductor Devices

Package of MEMS device and method for fabricating the same

Method for chemical sensor fabrication and related sensor

Wafer level package structure and production method therefor

Sensor device and production method therefor

Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production

SEMICONDUCTOR APPARATUS

MEMS package structure

Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing

MICROELECTROMECHANICAL SYSTEMS DESIGN FEATURE

PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE

Lid structure for microdevice and method of manufacture

MEMS device with integral packaging

Fabricating tall micro structures

System and method for sealing a MEMS device

Microphone System with Silicon Microphone Secured to Package Lid

Cap package for micro electro-mechanical system

Semiconductor device with hollow structure

Manufacturing method for electronic component with sealing film

HIGH FREQUENCY CIRCUIT APPARATUS

Package of MEMS device and method for fabricating the same

MEMS device having a recessed cavity and methods therefor

Wafer bonding material with embedded conductive particles

Backages with buried electrical feedthroughs

Method of fabricating MEMS device

Micro device encapsulation

Wafer bonding material with embedded rigid particles

MEMS device wafer-level package

Encapsulation in a hermetic cavity of a microelectronic composite, particularly of a MEMS

Waferscale package system

Semiconductor device and manufacturing method thereof

Microstructure sealing tool and methods of using the same

Manufacture of mountable capped chips

Micromechanical component having an anodically bonded cap and a manufacturing method

Pressure sensors and methods of making the same

Micro mirror unit and method of making the same

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device and method of manufacturing the same

MEMS release methods

MEMS packaging structure and methods

Optical microelectromechantical structure

Micro-device packaging

Reactive nano-layer material for MEMS packaging

Getter deposition for vacuum packaging

Method of manufacturing a wiring board

Acceleration sensor and method of manufacturing acceleration sensor

Hermetic MEMS package and method of manufacture

Manufacturing method for electronic component, electronic component, and electronic equipment

Wafer level hermetically sealed MEMS device

Hermetically sealing using a cold welded tongue and groove structure

Hermetically sealed product and related methods of manufacture

Optical element housing package

Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void

System and method for display device with integrated desiccant

Method and system for packaging a display

Hermetically sealing a container with crushable material and reactive multilayer material

Acceleration sensor and method of manufacturing acceleration sensor

Bonding method, bonding apparatus and sealing means

Getter deposition for vacuum packaging

Method of forming an assembly to house one or more micro components

MEMS device wafer-level package

Capped sensor

MEMS device with integral packaging

Acceleration sensor and method of manufacturing acceleration sensor

Optical fiber terminator package

Micro-electromechanical system

Glass frit bond and process therefor

Method of manufacturing wafer level package type FBAR device

Micro mirror unit and method of making the same

Acceleration sensor

Method of fabricating an array of wafer scale polymeric caps

Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances

Manufacture of mountable capped chips

Multi-layer single chip MEMS WLCSP fabrication

Structure and formation method of semiconductor device structure

Multi-pressure MEMS package

Integrated MEMS pressure sensor and MEMS inertial sensor

Metal mesh lid MEMS package and method