84147 ⎘
Forming microstructural systems; Packaging MEMS Bonding an individual cap on the substrate
MEMS PRESSURE TRANSDUCER WAFER-LEVEL CHIP-SCALE PACKAGE AND METHOD FOR PRODUCING THE SAME
#2MEMS ELECTROSTATIC ACTUATOR BLADE CONFIGURATIONS AND METHODS OF MANUFACTURE
#3MEMS DEVICE AND MANUFACTURING METHOD FOR MEMS DEVICE
#4Transducer
#5METHODS AND SYSTEMS FOR STACKED MICROELECTROMECHANICAL SYSTEM DEVICES
#6CAPACITIVE SENSOR AND METHOD FOR MANUFACTURING SAME
#7Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature
#8METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#9SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#10SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
#11MICROMECHANICAL DEVICE AND METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A MEMS SUBSTRATE AND A CAP SUBSTRATE AND A CAVERN ENCLOSED BY MEMS SUBSTRATE AND CAP SUBSTRATE
#12SEMICONDUCTOR DEVICES AND RELATED METHODS
#13INTEGRATED MEMS MICROPHONE PERFORMANCE ENHANCEMENT WITH A MEMBRANE
#14TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
#15MICROELECTROMECHANICAL SENSOR WITH IMPROVED EXTERNAL FLUIDIC COUPLING AND MANUFACTURING PROCESS THEREOF
#16OVERMOULDED PRESSURE SENSOR WITH ENCAPSULATING GEL AND METAL COVER ON SUBSTRATE
#17Inertial Sensor And Electronic Component
#18MEMS DEVICE AND MANUFACTURING METHOD THEREOF
#19MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
#20METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#21MICROELECTROMECHANICAL SENSING DEVICE AND MANUFACTURING METHOD THEREOF
#22MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT
#23METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#24INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
#25ENCLOSURE
#26MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURING A MEMS DEVICE
#27OVER-THE-SINK DRYING ELEMENT
#28TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
#29DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
#30MEMS DEVICE AND MANUFACTURING METHOD THEREOF
#31MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
#32MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
#33PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
#34WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
#35SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#36MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
#37Reduced light reflection package
#38MEMS PRESSURE SENSOR
#39PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRESPONDING MICROMECHANICAL SENSOR APPARATUS
#40Ingress protection mechanism
#41INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
#42PRESSURE SENSING IMPLANT
#43MEMS STRUCTURE
#44Hermetically sealed MEMS mirror and method of manufacture
#45SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
#46Top notch slit profile for MEMS device
#47METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELEMENT
#48MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
#49PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
#50Sensing module and manufacturing method thereof
#51PROTECTIVE BONDLINE CONTROL STRUCTURE
#52METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#53Method and system for fabricating a MEMS device
#54Method and system for fabricating a MEMS device
#55MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
#56SEMICONDUCTOR DEVICES AND RELATED METHODS
#57MICROELECTROMECHANICAL DEVICE WITH OUT-OF-PLANE STOPPER STRUCTURE
#58INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
#59Integrated digital force sensors and related methods of manufacture
#60Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method
#61HERMETICALLY SEALED GLASS PACKAGE
#62MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion
#63Reduced light reflection package
#64Method for producing a microelectromechanical sensor and microelectromechanical sensor
#65Electronic device and corresponding method
#66Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling
#67Sound producing package structure and method for packaging sound producing package structure
#68Capacitive micromachined ultrasonic transducer (CMUT) devices and methods of manufacturing
#69Enclosed cavity structures
#70ENCLOSED CAVITY STRUCTURES
#71Packaged die and assembling method
#72METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
#73Enclosed cavity structures
#74MEMS pressure sensor
#75Optical electronics device
#76MEMs using outgassing material to adjust the pressure level in a cavity
#77MEMS device with particle filter and method of manufacture
#78MEMS package comprising multi-depth trenches
#79Enclosed cavity structures
#80Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package
#81Hermetically sealed optically transparent wafer-level packages and methods for making the same
#82Enclosed cavity structures
#83Semiconductor devices and related methods
#84Enclosed cavity structures
#85SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
#86Micromechanical device and corresponding production method
#87Packaging structure and packaging method for retinal prosthesis implanted chip
#88Multi-depth MEMS package
#89Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package
#90Microphone package
#91MEMS pressure sensor
#92Selective wafer removal process for wafer bonding applications
#93Micromechanical device including a covering bond frame
#94Apparatus having a bondline structure and a diffusion barrier with a deformable aperture
#95MEMS mirror arrangement for detecting a large angular range
#96SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#97Method for forming multi-depth MEMS package
#98MEMS device
#99MEMS devices and methods of forming same
#100Hermetically sealed MEMS mirror and method of manufacture
#101Integrated digital force sensors and related methods of manufacture
#102MICROMECHANICAL DEVICE HAVING A DECOUPLED MICROMECHANICAL STRUCTURE
#103Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
#104PROTECTIVE BONDLINE CONTROL STRUCTURE
#105Pressure sensing implant
#106PACKAGE SUBSTRATE INTEGRATED DEVICES
#107Method for forming multi-depth MEMS package
#108Vertical stopper for capping MEMS devices
#109Semiconductor sensor device and method for fabricating the same
#110Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
#111Resonator and resonance device
#112Physical quantity sensor, physical quantity sensor device, portable electronic device, electronic device, and mobile body
#113Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures
#114MEMS devices and methods of forming same
#115Microphone package
#116Heater design for MEMS chamber pressure control
#117Micromechanical component
#118Inter-poly connection for parasitic capacitor and die size improvement
#119Protective environmental barrier for a die
#120Trench-based microelectromechanical transducer and method for manufacturing the microelectromechanical transducer
#121MEMS package
#122MEMS pressure gauge sensor and manufacturing method
#123Optical electronics device
#124Bond rings in semiconductor devices and methods of forming same
#125Micro-electro-mechanical system (MEMS) structures and design structures
#126Micro-electro-mechanical system (MEMS) structures and design structures
#127MEMS devices and methods of forming the same
#128Micro-electro-mechanical system (MEMS) structures and design structures
#129TRANSDUCER PACKAGING
#130Hermetically sealed MEMS device and its fabrication
#131Vertical stopper for capping MEMS devices
#132Filter including bulk acoustic wave resonator
#133Semiconductor device package including cover including tilted inner sidewall
#134Packaging structure of integrated sensor
#135Hermetically sealed MEMS mirror and method of manufacture
#136Two different conductive bump stops on CMOS-MEMS bonded structure
#137Low cost small force sensor
#138Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate
#139Micromechanical device having a decoupled micromechanical structure
#140Corrugated package for microelectromechanical system (MEMS) device
#141Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device
#142Scanning mirror device and a method for manufacturing it
#143Multi-pressure MEMS package
#144Die with integrated microphone device using through-silicon vias (TSVs)
#145Low cost wafer level process for packaging MEMS three dimensional devices
#146Integrated MEMS transducers
#147Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object
#148MEMS devices and methods of forming the same
#149Micromechanical component including a diffusion stop channel
#150ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND PHYSICAL-QUANTITY SENSOR
#151Metalized microphone lid with integrated wire bonding shelf
#152Method for making a seam-sealable non-magnetic lid and package
#153MEMS sensor with side port and method of fabricating same
#154MEMS sensor cap with multiple isolated electrodes
#155Targeted control of the absorption behavior during laser resealing
#156Laser reseal including a protective structure
#157LASER RESEAL HAVING SPECIAL DIAPHRAGM STRUCTURE
#158ADDITIONAL SURFACE FOR STABILIZING THE INTERNAL CAVITY PRESSURE OVER THE LIFETIME
#159Hermetically sealed MEMS device and its fabrication
#160Microphone and method of manufacturing a microphone
#161MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACE
#162Wafer level MEMS package including dual seal ring
#163Semiconductor device package for reducing parasitic light and method of manufacturing the same
#164Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
#165Heater design for MEMS chamber pressure control
#166Inter-poly connection for parasitic capacitor and die size improvement
#167Bonding pad structure, bonding ring structure, and MEMS device packaging method
#168Micromechanical component
#169MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#170MEMS devices and methods of forming same
#171MEMS CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#172Hermetically-sealed MEMS device and its fabrication
#173Optical electronic device and method of fabrication
#174Microelectronic packages having split gyroscope structures and methods for the fabrication thereof
#175MEMS PRESSURE SENSOR
#176Aluminum nitride (AlN) devices with infrared absorption structural layer
#177Hermetic encapsulation for microelectromechanical systems (MEMS) devices
#178Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
#179Wafer level MEMS package including dual seal ring
#180METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
#181Method of forming capacitive MEMS sensor devices
#182Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices
#183Movement microelectromechanical systems (MEMS) package
#184System and method for a packaged MEMS device
#185Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof
#186Semiconductor device including a cavity lid
#187MEMS having a cutout section on a concave portion between a substrate and a stationary member
#188Monolithic MEMS platform for integrated pressure, temperature, and gas sensor
#189Micro-electro-mechanical system (MEMS) structures and design structures
#190MEMS device and fabrication method
#191Micro-electro-mechanical system (MEMS) structures and design structures
#192Micro-Electro-Mechanical System (MEMS) structures and design structures
#193Method of fabricating MEMS devices using plasma etching and device therefor
#194Multi-pressure MEMS package
#195CHIP PACKAGE AND FABRICATION METHOD THEREOF
#196Metalized microphone lid with integrated wire bonding shelf
#197Thin capping for MEMS devices
#198Method of selectively removing an anti-stiction layer on a eutectic bonding area
#199SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
#200Stress isolated differential pressure sensor
#201Microelectronic packages having hermetic cavities and methods for the production thereof
#202MEMS capping method
#203MEMS device having a getter
#204Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same
#205Package structure including a cavity coupled to an injection gas channel composed of a permeable material
#206Environmental sensor structure
#207Lid and method for sealing a non-magnetic package
#208Physical quantity sensor, electronic device, and mobile body
#209Physical quantity sensor, electronic apparatus, and moving body
#210Method to package multiple mems sensors and actuators at different gases and cavity pressures
#211Method to package multiple MEMS sensors and actuators at different gases and cavity pressures
#212Optical electronic device and method of fabrication
#213Thin film structure for hermetic sealing
#214Methods of fabricating micro electro mechanical system structures
#215Micro-electro-mechanical system (MEMS) structures and design structures
#216Glass wafer assembly
#217Top port MEMS cavity package and method of manufacture thereof
#218Mems having a cutout section on concave portion of a substrate
#219MEMS structures and methods for forming the same
#220Devices with thinned wafer
#221Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting
#222Method of sealing and shielding for dual pressure MEMs devices
#223MEMS device with a bonding layer embedded in the cap
#224Micro-electro-mechanical-system device with guard ring and method for making same
#225Micro electromechanical system sensor and method of forming the same
#226MEMS package and a method for manufacturing the same
#227Method and structure of MEMS WLCSP fabrication
#228Hybridly integrated module having a sealing structure
#229Method for manufacturing a micromechanical component
#230Semiconductor package with air gap
#231MEMS device with integrated temperature stabilization
#232Integrated circuit package including in-situ formed cavity
#233Cavity-type semiconductor package and method of packaging same
#234Manufacturing method of micro-electro-mechanical system device and micro-electro-mechanical system device made thereby
#235MEMS device and fabrication method
#236Chip package including a microphone structure and a method of manufacturing the same
#237Crystal resonation device and production method therefor
#238Method for forming micro-electro-mechanical system (MEMS) beam structure
#239Capacitive MEMS sensor devices
#240Packages and methods for packaging MEMS microphone devices
#241Microchip with blocking apparatus
#242Socket type MEMS bonding
#243Hermetic wafer level packaging
#244Process for manufacturing a lid for an electronic device package, and lid for an electronic device package
#245Chip package and manufacturing method thereof
#246MEMS packaging scheme using dielectric fence
#247Hermetic plastic molded MEMS device package and method of fabrication
#248Cavity-type semiconductor package and method of packaging same
#249Composite wafer semiconductor
#250Hybridly integrated component and method for the production thereof
#251Component with encapsulated active element and implantable medical advice incorporating such a component
#252Glass frit wafer bond protective structure
#253Multiple bonding in wafer level packaging
#254Hybrid integrated component and method for the manufacture thereof
#255Moisture-resistant package
#256Component and method for producing a component
#257Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
#258Micro electro mechanical system structures
#259MEMS devices and methods of forming same
#260Hermetic Semiconductor Package Structure and Method for Manufacturing the same
#261GLASS-ENCAPSULATED PRESSURE SENSOR
#262MEMS structures and methods for forming the same
#263GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#264PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT
#265PLANARIZED SPACER FOR COVER PLATE OVER ELECTROMECHANICAL SYSTEMS DEVICE ARRAY
#266MICROSYSTEM
#267Compression and cold weld sealing method for an electrical via connection
#268SEAL ANCHOR STRUCTURES
#269Treatment of a self-assembled monolayer on a dielectric layer for improved epoxy adhesion
#270Component support and assembly having a MEMS component on such a component support
#271MEMS device with integral packaging
#272Method to prevent metal pad damage in wafer level package
#273Electronic component
#274METHOD AND SYSTEM FOR PACKAGING A DISPLAY
#275Methods for embedding conducting material and devices resulting from said methods
#276AIRTIGHT ASSEMBLY OF TWO COMPONENTS AND METHOD FOR PRODUCING SUCH AN ASSEMBLY
#277Simplified copper-copper bonding
#278Multiple bonding in wafer level packaging
#279Substrate bonding with metal germanium silicon material
#280Objects assembly through a sealing bead including intermetallic compounds
#281Composite wafer semiconductor
#282Hermetic wafer level packaging
#283Method of forming suspension object on monolithic substrate
#284Electronic component device and method for producing the same
#285Arrangement of two substrates having an SLID bond and method for producing such an arrangement
#286MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
#287SENSOR AND METHOD FOR MANUFACTURING A SENSOR
#288Semiconductor device with hollow structure
#289Micro-optical device packaging system
#290Integrated circuit package with enlarged die paddle
#291Packages and methods for packaging MEMS microphone devices
#292Encapsulation, MEMS and encapsulation method
#293Microelectromechanical system (MEMS) device and methods for fabricating the same
#294Chip package and manufacturing method thereof
#295Encapsulation, MEMS and method of selective encapsulation
#296DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
#297System and method of manufacturing an electromechanical device by printing raised conductive contours
#298MEMS DEVICE
#299Light-based sealing and device packaging
#300Manufacturing method for electronic component, electronic component, and electronic equipment