POST CMP PROCESSING FOR HYBRID BONDING

MEMS cavity with non-contaminating seal

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)

Packaging of microelectromechanical system devices

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

Systems of Getters for Microelectronics and Methods for Production Thereof

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDING TWO CHAMBERS AT DIFFERENT PRESSURES AND RELATED MICRO-ELECTRO-MECHANICAL DEVICE

Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

FABRICATION OF GLASS CELLS FOR HERMETIC GAS ENCLOSURES

PLUG FOR MEMS CAVITY

MEMS cavity with non-contaminating seal

Semiconductor Device and Method of Making a MEMS Semiconductor Package

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

Micro-electromechanical system and method for producing same

Semiconductor structure and method for manufacturing thereof

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MEMS device having decreased contact resistance

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

MEMS cavity with non-contaminating seal

Method for sealing entries in a MEMS element

SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

Microelectromechanical structure including a functional element situated in a cavity of the microelectromechanical structure

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

Method of forming dielectric and metal sealing layers on capping structure of a MEMs device

Optical electronics device

MEMS cavity with non-contaminating seal

Semiconductor structure and manufacturing method for the same

Integrated packaging devices and methods with backside interconnections

Stress reduction during laser resealing through a temperature increase

Multi-layer sealing film for high seal yield

Structure and method for sealing through-hole, and transfer substrate for sealing through-hole

Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

MEMS devices and methods of forming same

Method for producing a microelectromechanical component and wafer system

Electronic component and module including the same

POST CMP PROCESSING FOR HYBRID BONDING

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES

COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION

Component with a thin-layer covering and method for its production

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Semiconductor structures provided within a cavity and related design structures

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Method for sealing an access opening to a cavity and MEMS component comprising a sealing element

Method for producing a micromechanical element

Multi-layer sealing film for high seal yield

Hermetically sealed molecular spectroscopy cell with buried ground plane

Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure

Physical quantity sensor, physical quantity sensor device, portable electronic device, electronic device, and mobile body

Physical quantity sensor, complex sensor, inertial measurement unit, portable electronic device, electronic device, and vehicle

MEMS devices and methods of forming same

System and method for maintaining a smoothed and anti-stiction surface on a MEMS device

Manufacturing method of MEMS sensor

System and method for maintaining a smoothed surface on a MEMS device

Sensor element having laser-activated getter material

MEMS component having two different internal pressures

Device including micromechanical components in cavities having different pressures and method for its manufacture

Semiconductor structures provided within a cavity and related design structures

Method for manufacturing a micromechanical inertial sensor

Substance detection device

Optical electronics device

MEMS cavity with non-contaminating seal

Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Multi-layer sealing film for high seal yield

Integrated packaging devices and methods with backside interconnections

Micromechanical z-acceleration sensor

Method of manufacturing MEMS switches with reduced switching voltage

Method of manufacturing MEMS switches with reduced switching voltage

CAPACITIVE TRANSDUCER

Methods of manufacturing for MEMS switches with reduced switching voltage

Methods of manufacture for MEMS switches with reduced switching voltage

MEMS component having a high integration density

Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

Method of manufacturing a switch

Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices

SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE

Microelectromechanical systems (MEMS) devices at different pressures

Micromechanical component including a diffusion stop channel

Method for manufacturing a micromechanical component

Methods for mounting a MEMS sensor for in-stream measurements

Laser beam deflection for targeted energy deposition

Targeted control of the absorption behavior during laser resealing

Laser reseal including a protective structure

Laser reseal including an additional layer and alloy formation

LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS

LASER RESEAL INCLUDING STRESS COMPENSATION LAYER

MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACE

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING A MICROELECTRONIC PACKAGE

Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Wafer level MEMS package including dual seal ring

Semiconductor structure and method for fabricating the same

Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity

Laser resealing with stress-reducing prestructuring

Structures for reducing and avoiding stresses on the seal bottom side during laser reseal

Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface

Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser

MICROMECHANICAL LAYER SYSTEM

Method for providing a MEMS device with a plurality of sealed enclosures having uneven standoff structures and MEMS device thereof

SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE

Mechanically isolated MEMS device

MEMS devices and methods of forming same

Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer

Optical electronic device and method of fabrication

Electronic apparatus, manufacturing method thereof, oscillator, electronic appliance, and mobile unit

Method of increasing MEMS enclosure pressure using outgassing material

Wafer level MEMS package including dual seal ring

Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof

Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices

Recess with tapered sidewalls for hermetic seal in MEMS devices

Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

Methods of forming sensor integrated packages and structures formed thereby

Sealed Infrared Imagers and Sensors

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-Electro-Mechanical System (MEMS) structures and design structures

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Multi-pressure MEMS package

Method of wafer-level hermetic packaging with vertical feedthroughs

Semiconductor device and method of forming MEMS package

Thin capping for MEMS devices

Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure

Microelectronic packages having hermetic cavities and methods for the production thereof

Method for hermetically sealing with reduced stress

Method of manufacturing a switch

Package structure including a cavity coupled to an injection gas channel composed of a permeable material

Microelectromechanical systems (MEMS) devices at different pressures

Method of forming a resonator

Lid and method for sealing a non-magnetic package

MEMS die and methods with multiple-pressure sealing

Physical quantity sensor, electronic device, and mobile body

Integrated CMOS/MEMS microphone die components

Method to package multiple mems sensors and actuators at different gases and cavity pressures

Method to package multiple MEMS sensors and actuators at different gases and cavity pressures

Method of manufacture MEMS switches with reduced voltage

Method of manufacturing MEMS switches with reduced voltage

Method of manufacturing MEMS switches with reduced switching voltage

Method of manufacturing MEMS switches with reduced switching volume

Encapsulated micro-electromechanical system switch and method of manufacturing the same

Miniaturized Component and Method for the Production Thereof

Micro-electro-mechanical system (MEMS) structures and design structures

Method of increasing MEMS enclosure pressure using outgassing material

Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component

Structure with several cavities provided with access channels of different heights

Electronic device, manufacturing method thereof, and electronic apparatus

Sequential wafer bonding

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

MEMS device and method of manufacturing the same

MEMS device

Semiconductor structures provided within a cavity and related design structures

Method of sealing and shielding for dual pressure MEMs devices

Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit

Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof

MEMS device with release aperture

Method of hermetically sealing a hole with a fuse material

MEMS device with sealed cavity and release chamber and related double release method

Electronic device and electronic apparatus

Capacitive transducer and method of manufacturing the same

Micromechanical sensor unit and method for manufacturing micromechanical sensor units

Vibrator, manufacturing method of vibrator, electronic device, electronic apparatus, and moving object

Wafer level sealing methods with different vacuum levels for MEMS sensors

METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

Thin film capping

Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas

MEMS package structure

Method for forming micro-electro-mechanical system (MEMS) beam structure

MEMS device with release aperture

Microelectromechanical resonators

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit

Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region

Electronic device, method of manufacturing the same, and oscillator

Semiconductor structures provided within a cavity and related design structures

Integrated circuit with MEMS element and manufacturing method thereof

Method of encapsulating a microelectronic device

Fabrication of a floating rocker MEMS device for light modulation

Integrated circuit switches, design structure and methods of fabricating the same

Methods for forming a sealed liquid metal drop

MEMS die and methods with multiple-pressure sealing

Method for manufacturing MEMS device

Method for MEMS device fabrication and device formed

Component with encapsulated active element and implantable medical advice incorporating such a component

MEMS inertial sensor and method for manufacturing the same

Electronic device and manufacturing method thereof, electronic apparatus, and moving body

Process for making a structure with hermetically closed cavity under controlled atmosphere

Electronic device, method for manufacturing thereof, and electronic apparatus

MEMS devices and methods of forming same

SENSING DEVICE AND FABRICATING METHOD THEREOF

ENCAPSULATED ARRAYS OF ELECTROMECHANICAL SYSTEMS DEVICES

METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES

METHOD OF IMPROVING THIN-FILM ENCAPSULATION FOR AN ELECTROMECHANICAL SYSTEMS ASSEMBLY

Process for encapsulating a micro-device by attaching a cap and depositing getter through the cap

Structure for encapsulating an electronic device

Electronic device, manufacturing method thereof, and electronic apparatus

RELEASE ACTIVATED THIN FILM GETTER

Method for plugging a hole

Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method

PROCESS FOR A SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT

Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures

Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

MEMS package structure

Method for Sealing a Micro-Cavity

Method and structure of monolithetically integrated inertial sensor using IC foundry-compatible processes

Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

MEMS DEVICE AND METHOD FOR FORMING THE SAME

Method for MEMS device fabrication and device formed

Encapsulated micro-electromechanical system switch and method of manufacturing the same

Vacuum wafer level packaging method for micro electro mechanical system device

METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE

SEALED MEMS CAVITY AND METHOD OF FORMING SAME

MEMS switches and fabrication methods

METHOD AND SYSTEM FOR PACKAGING A DISPLAY

Sealed cavity and method for producing such a sealed cavity

Electronic device covered by multiple layers and method for manufacturing electronic device

MEMS device with release aperture

Electrical component and method of manufacturing the same

Package structure

Method and device for packaging a substrate

Sealed cavity

Semiconductor device with a controlled cavity and method of formation

Method for manufacturing 3-dimensional structures using thin film with columnar nano pores and manufacture thereof

MEMS devices

MEMS devices

Method for encapsulating a microcomponent using a mechanically reinforced cap

Device with microstructure and method of forming such a device

Microscopic structure packaging method and device with packaged microscopic structure

Method for Manufacturing Microelectronic Devices and Devices According to Such Methods

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

Microshells with integrated getter layer

MEMS DEVICE

Method of fabricating and encapsulating MEMS devices

Integrated circuit switches, design structure and methods of fabricating the same

Fabrication of a floating rocker MEMS device for light modulation

Microelectronic device and fabricating method thereof and MEMS package structure and fabricating method thereof

MEMS package structure and method for fabricating the same

Microcavity structure and encapsulation structure for a microelectronic device

Methods and apparatuses for integrated packaging of microelectromechanical devices

METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES

Encapsulated electromechanical devices

Semiconductor device and method of manufacturing the same

Mesoscale and microscale device fabrication methods using split structures and alignment elements

PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for Encapsulating a Device in a Microcavity

Cavity closure process for at least one microelectronic device

Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures

Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (MEMS) produced therewith

Sealing structure and method of manufacturing the same

Thin-film lid MEMS devices and methods

Method of fabricating a MEMS/NEMS electromechanical component

Micromechanical device which has cavities having different internal atmospheric pressures

Encapsulation methods for interferometric modulator and MEMS devices

Microscopic structure packaging method and device with packaged microscopic structure

Method for producing a micromechanical component having a thin-layer capping

Method of encapsulating a microelectronic device by a getter material

System and method of encapsulation

Device and method for hermetically sealing a cavity in an electronic component

MEMS switches with reduced switching voltage and methods of manufacture

PACKAGING METHOD OF MICRO ELECTRO MECHANICAL SYSTEM DEVICE AND PACKAGE THEREOF

Method of sealing a cavity

Laser processing of glass frit for sealing applications

Piezoelectric device with irradiation damage preventing seal

Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistance

Method for sealing an opening

Vacuum package and manufacturing process thereof

Micro-electro-mechanical-system package and method for manufacturing the same

Micromechanical device and method of manufacturing micromechanical device

Method for manufacturing semiconductor device

MEMS SWITCH AND METHOD OF FABRICATING THE SAME

Method and device for packaging a substrate

MEMS apparatus and method of manufacturing the same

Electric component

HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE

Micromechanical component having thin-layer encapsulation and production method

Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same

Electronic Device Comprising a Mems Element

Method for low-temperature sealing of a cavity under vacuum or under controlled atmosphere

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS AND SYSTEMS FOR WAFER LEVEL PACKAGING OF MEMS STRUCTURES

Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale

Packaging of Micro Devices

Micromechanical component having multiple caverns, and manufacturing method

Method for encapsulating a device in a microcavity

Microelectromechanical devices and fabrication methods

Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering

Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures

Self sealed MEMS device