Wafer-level MEMS package and manufacturing method thereof

Device comprising an encapsulated microsystem and production method thereof

Functional device, semiconductor device, and electronic device

Encapsulated microcomponent equipped with at least one getter

Microcomponent comprising a hermetically-sealed microcavity and method for production of such a microcomponent

Structure and method of making sealed capped chips

Apparatus for housing a micromechanical structure

Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method

Micro-Electro-mechanical (MEMS) encapsulation using buried porous silicon

Method for forming a hermetically sealed cavity

System and method for hermetically sealing a package

Packaging a MEMS device using a frame

MEMS devices and processes for packaging such devices

Self-packaging MEMS device

Encapsulation in a hermetic cavity of a microelectronic composite, particularly of a MEMS

Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Electronic component packaging

Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures

Mesoscale and microscale device fabrication methods using split structures and alignment elements

Hermetically Sealed Devices for Controlled Release or Exposure of Reservoir Contents

Method for containing a device and a corresponding device

METHOD FOR FORMING FREE STANDING MICROSTRUCTURES

Semiconductor device using MEMS technology

MEMS packaging structure and methods

Method of forming a MEMS device

Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale

Optical element housing package

Method and system for packaging a display

Method and device for packaging a substrate

Integrated lid formed on MEMS device

Encapsulated microstructure and method of producing one such microstructure

Method for stripping sacrificial layer in MEMS assembly

Processes for hermetically packaging wafer level microscopic structures

Sensor with at least one micromechanical structure, and method for producing it

Methods for hermetic sealing of post media-filled MEMS package

Processes for hermetically packaging wafer level microscopic structures

System and methods for hermetic sealing of post media-filled MEMS package

Apparatus for housing a micromechanical structure and method for producing the same

Episeal pressure sensor

Semiconductor pressure sensor and pressure sensing device

Method of forming a seal for a semiconductor device

Sealing openings in micro-electromechanical systems

Structure and method of making capped chips having vertical interconnects

System and method for hermetically sealing a package

Back-face and edge interconnects for lidded package

Structure and method of making capped chips using sacrificial layer

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Low temperature methods for hermetically sealing reservoir devices

Method for generating a protective cover for a device

Gap tuning for surface micromachined structures in an epitaxial reactor

Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer

Semiconductor device and package and manufacturing method thereof

Semiconductor device and method for fabricating the same