84154 ⎘
Forming microstructural systems; Packaging MEMS Seals
Sub-classes:MEMS ELECTROSTATIC ACTUATOR BLADE CONFIGURATIONS AND METHODS OF MANUFACTURE
#2MICROMECHANICAL DEVICE AND METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A MEMS SUBSTRATE AND A CAP SUBSTRATE AND A CAVERN ENCLOSED BY MEMS SUBSTRATE AND CAP SUBSTRATE
#3MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
#4MEMS RESONATOR AND METHOD FOR PRODUCING THE SAME
#5METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY HAVING A MELT SEAL
#6METHODS FOR SEALING CAVITIES IN MICRO-FABRICATED DEVICES AND MICRO-FABRICATED DEVICES FABRICATED IN ACCORDANCE WITH SAME
#7METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
#8FABRICATION OF GLASS CELLS FOR HERMETIC GAS ENCLOSURES
#9MEMS STRUCTURE
#10SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#11Inertial sensor and method for manufacturing the same
#12MEMS device, manufacturing method of the same, and integrated MEMS module using the same
#13THROUGH-SUBSTRATE CONDUCTOR SUPPORT
#14Methods for packaging a microelectromechanical systems device
#15Micromechanical device and method for manufacturing a micromechanical device
#16Microelectromechanical systems packages and methods for packaging a microelectromechanical systems device
#17Planar cavity MEMS and related structures, methods of manufacture and design structures
#18Planar cavity MEMS and related structures, methods of manufacture and design structures
#19Planar cavity mems and related structures, methods of manufacture and design structures
#20Through-substrate conductor support
#21MICROFLUIDIC CELL AND METHOD FOR THE PRODUCTION THEREOF
#22Microfluidic component package
#23Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite
#24Planar cavity MEMS and related structures, methods of manufacture and design structures
#25Planar cavity MEMS and related structures, methods of manufacture and design structures
#26Planar cavity MEMS and related structures, methods of manufacture and design structures
#27Planar cavity MEMS and related structures, methods of manufacture and design structures
#28Planar cavity MEMS and related structures, methods of manufacture and design structures
#29Planar cavity MEMS and related structures, methods of manufacture and design structures
#30SYSTEMS AND METHODS FOR MULTI-SENSOR INTEGRATED SENSOR DEVICES
#31Planar cavity MEMS and related structures, methods of manufacture and design structures
#32Planar cavity MEMS and related structures, methods of manufacture and design structures
#33Planar cavity MEMS and related structures, methods of manufacture and design structures
#34Methods for fabricating an apparatus having a hermetic seal
#35MEMS devices and methods of forming the same
#36Through-substrate conductor support
#37Planar cavity MEMS and related structures, methods of manufacture and design structures
#38Planar cavity MEMS and related structures, methods of manufacture and design structures
#39Planar cavity MEMS and related structures, methods of manufacture and design structures
#40Planar cavity MEMS and related structures, methods of manufacture and design structures
#41Planar cavity MEMS and related structures, methods of manufacture and design structures
#42Planar cavity MEMS and related structures, methods of manufacture and design structures
#43Low cost wafer level process for packaging MEMS three dimensional devices
#44Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object
#45MEMS devices and methods of forming the same
#46ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND PHYSICAL-QUANTITY SENSOR
#47Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#48LASER RESEAL HAVING SPECIAL DIAPHRAGM STRUCTURE
#49Pressure sensor
#50Semiconductor structure and method for fabricating the same
#51Planar cavity MEMS and related structures, methods of manufacture and design structures
#52SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
#53Planar cavity MEMS and related structures, methods of manufacture and design structures
#54Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#55Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
#56Planar cavity MEMS and related structures, methods of manufacture and design structures
#57Planar cavity MEMS and related structures, methods of manufacture and design structures
#58Planar cavity MEMS and related structures, methods of manufacture and design structures
#59Planar cavity MEMS and related structures, methods of manufacture and design structures
#60Thin Film Encapsulation of Electrodes
#61Electromechanical device including a suspended structure and method of fabricating the same
#62Semiconductor pressure sensor and method of fabricating same
#63Planar cavity MEMS and related structures, methods of manufacture and design structures
#64Integration of pressure sensors into integrated circuit fabrication and packaging
#65Planar cavity MEMS and related structures, methods of manufacture and design structures
#66Planar cavity MEMS and related structures, methods of manufacture and design structures
#67INTERNAL BARRIER FOR ENCLOSED MEMS DEVICES
#68Planar cavity MEMS and related structures, methods of manufacture and design structures
#69Planar cavity MEMS and related structures, methods of manufacture and design structures
#70Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
#71Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#72Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#73Pressure sensor and manufacture method thereof
#74Device comprising a fluid channel provided with at least one micro or nanoelectronic system and method for carrying out such a device
#75MEMS device and method of manufacturing the same
#76Method for producing a micromechanical component, and micromechanical component
#77Magnet placement for integrated sensor packages
#78Integration of pressure or inertial sensors into integrated circuit fabrication and packaging
#79MEMS encapsulation by multilayer film lamination
#80MEMS device with sealed cavity and release chamber and related double release method
#81MEMS devices, packaged MEMS devices, and methods of manufacture thereof
#82Single silicon wafer micromachined thermal conduction sensor
#83Planar cavity MEMS and related structures, methods of manufacture and design structures
#84MEMS devices, packaged MEMS devices, and methods of manufacture thereof
#85Planar cavity MEMS and related structures, methods of manufacture and design structures
#86Planar cavity MEMS and related structures, methods of manufacture and design structures
#87Planar cavity MEMS and related structures, methods of manufacture and design structures
#88Planar cavity MEMS and related structures, methods of manufacture and design structures
#89Planar cavity MEMS and related structures, methods of manufacture and design structures
#90Methods of manufacture for micro-electro-mechanical system (MEMS)
#91Planar cavity MEMS and related structures, methods of manufacture and design structures
#92Planar cavity MEMS and related structures, methods of manufacture and design structures
#93Method of manufacturing a micro-electro-mechanical system (MEMS)
#94Structure and formation method of semiconductor device structure
#95MEMS sensor with electronics integration
#96Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite