Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates

Targeted control of the absorption behavior during laser resealing

Laser reseal including a protective structure

Microelectromechanical device packages with integral heaters

Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device

Microelectromechanical device packages with integral heaters

Microstructure sealing tool and methods of using the same

Method for attaching chips in a flip-chip arrangement

Microelectromechanical device packages with integral heaters

Microelectromechanical device packages with integral heaters