84161 ⎘
Forming microstructural systems; Bonding two components; Thermal bonding Soldering
Anti-Stiction Process for Mems Device
#2SILICON MEMS GYROSCOPES WITH UPPER AND LOWER SENSE PLATES
#3SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#5MEMS DEVICE MANUFACTURING
#6METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#7PACKAGE FOR MULTIPLE LOUDSPEAKERS
#8Method for Fabricating a Hermetically Sealed Contact and Hermetically Sealed Contact
#9BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
#10MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
#11METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#12MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT
#13BONDED STRUCTURES
#14METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
#15MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
#16INTERPOSER FOR DAMPING MEMS MICROPHONES
#17ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
#18METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#19METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
#20MEMS SENSOR AND MANUFACTURING METHOD THEREOF
#21MEMS DEVICE MANUFACTURING
#22Bonding process for forming semiconductor device structure
#23Bonded structures
#24PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
#25MEMS with cover drive and method of operating the same
#26METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE
#27PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#28PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#29PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#30STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
#31Sensor with dimple features and improved out-of-plane stiction
#32Methods including panel bonding acts and electronic devices including cavities
#33Silicon MEMS gyroscopes with upper and lower sense plates
#34PROTECTIVE BONDLINE CONTROL STRUCTURE
#35METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIVE PRESSURE SENSOR AND AN INERTIAL SENSOR, AND INTEGRATED SYSTEM
#36METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
#37Method and system for fabricating a MEMS device
#38Method and system for fabricating a MEMS device
#39Process for manufacturing microelectromechanical devices, in particular electroacoustic modules
#40Sensor with dimple features and improved out-of-plane stiction
#41Anti-stiction process for MEMS device
#42Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#43Semiconductor package and method for manufacturing the same
#44Bonding process for forming semiconductor device structure
#45Packaging method and associated packaging structure
#46Multilayer fluidic devices and methods for their fabrication
#47Electronic assembly and pressure measurement device with improved durability
#48Method for producing a wafer connection
#49Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#50Packaged die and assembling method
#51Bonded structures
#52Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#53Capping plate for panel scale packaging of MEMS products
#54BOND STRUCTURES ON MEMS ELEMENT AND ASIC ELEMENT
#55MEMS assembly and manufacturing method thereof
#56Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#57Methods including panel bonding acts and electronic devices including cavities
#58Semiconductor manufacturing method and structure thereof
#59Bonding process for forming semiconductor device structure
#60Apparatus having a bondline structure and a diffusion barrier with a deformable aperture
#61Protective wafer including inclined optical windows and device
#62Method for forming hermetic seals in MEMS devices
#63CMOS-MEMS structure and method of forming the same
#64Fence structure to prevent stiction in a MEMS motion sensor
#65Bonded structures
#66Anti-stiction process for MEMS device
#67Semiconductor package and method for manufacturing the same
#68Methods for fabricating silicon MEMS gyroscopes with upper and lower sense plates
#69Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#70Microphone package
#71MEMS devices and methods of forming same
#72Eutectic bonding with AlGe
#73Process for manufacturing microelectromechanical devices, in particular electroacoustic modules
#74Semiconductor device packages and methods of manufacturing the same
#75MEMS package and method of manufacturing the same
#76CMOS-MEMS integrated device without standoff in MEMS
#77Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#78Microfluidic component package
#79Method for forming micro-electro-mechanical system (MEMS) structure
#80ASSEMBLY AND PACKAGING OF MEMS DEVICE
#81Semiconductor device and manufacture thereof
#82Eutectic bonding with ALGe
#83Method for producing a stress-decoupled micromechanical pressure sensor
#84Device comprising a micro-electro-mechanical system substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor substrate
#85Method for forming hermetic seals in MEMS devices
#86Bonding process for forming semiconductor device structure
#87Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#88Method for bonding wafers eutectically, and a wafer composite
#89Semiconductor apparatus having flexible connecting members and method for manufacturing the same
#90Pressure sensor assembly mounted to a ceramic substrate
#91REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD
#92Analyte sensor package with dispense chemistry and microfluidic cap
#93Packaging method and associated packaging structure
#94Method for self-aligning solder-attached mems die to a mounting surface
#95Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface
#96Sensor system, sensor arrangement, and assembly method using solder for sealing
#97Fence structure to prevent stiction in a MEMS motion sensor
#98Tilted chip assembly for optical devices
#99MEMS devices and methods of forming same
#100Systems and methods for uniform target erosion magnetic assemblies
#101Anti-stiction process for MEMS device
#102Addressable vertical nanowire probe arrays and fabrication methods
#103Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the same
#104Multilayer fluidic devices and methods for their fabrication
#105Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
#106Substrate treatment method for semiconductor device fabrication
#107CMOS-MEMS structure and method of forming the same
#108Manufacturing method of semiconductor structure including heater
#109Device including micromechanical components in cavities having different pressures and method for its manufacture
#110Method and structure of attachment layer for reducing stress transmission to attached MEMS die
#111Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
#112Multi-layer, stress-isolation platform for a MEMS die
#113Eutectic bonding with AlGe
#114Semiconductor device and manufacture thereof
#115Semiconductor device
#116Wafer level package solder barrier used as vacuum getter
#117Semiconductive structure and manufacturing method thereof
#118Multilayer fluidic devices and methods for their fabrication
#119Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process
#120Hermetically sealed MEMS device and its fabrication
#121Method for self-aligning solder-attached MEMS die to a mounting surface
#122MEMS device and method for producing same
#123Method for manufacturing a protective wafer including inclined optical windows and device
#124Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
#125Two-port SRAM connection structure
#126Two different conductive bump stops on CMOS-MEMS bonded structure
#127METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM
#128Dual cavity pressure structures
#129Semiconductor structure and manufacturing method thereof
#130Method for bonding wafers
#131Packaging method and associated packaging structure
#132CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
#133Manufacturing method of micro-electro-mechanical system sensor capable of preventing diffusion phenomenon and reflow phenomenon
#134Hermetically sealed MEMS device and its fabrication
#135Semiconductor structure and manufacturing method thereof
#136Electronic device having a bonding wire connected to a terminal at an alloyed portion
#137Semiconductor sensing structure
#138Electric device, in particular a microphone having re-adjustable sensitivity, and adjustment method
#139Bonding pad structure, bonding ring structure, and MEMS device packaging method
#140Micromechanical component
#141SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE
#142Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
#143MEMS-CMOS device that minimizes outgassing and methods of manufacture
#144MEMS devices and methods of forming same
#145MEMS and CMOS integration with low-temperature bonding
#146Assembly and packaging of MEMS device
#147Wafer level package solder barrier used as vacuum getter
#148Method of increasing MEMS enclosure pressure using outgassing material
#149MEMS device with electrodes permeable to outgassing species
#150Two-port SRAM connection structure
#151Method of lower profile MEMS package with stress isolations
#152Package formation method and MEMS package
#153PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE HAVING HOLLOW CHAMBER
#154Dual cavity pressure structures
#155Method of wafer-level hermetic packaging with vertical feedthroughs
#156MEMS-CMOS device that minimizes outgassing and methods of manufacture
#157SENSOR PACKAGE STRUCTURE AND METHOD
#158Method and apparatus for a seal ring structure
#159Hermetically sealed package having stress reducing layer
#160Environment-resistant module, micropackage and methods of manufacturing same
#161MEMS device having a getter
#162MEMS and CMOS integration with low-temperature bonding
#163MEMS device with a capping substrate
#164Microelectromechanical system device with internal direct electric coupling
#165Capacitive sensing structure with embedded acoustic channels
#166Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
#167Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type
#168Glass wafer assembly
#169CMOS-MEMS integration by sequential bonding method
#170Wafer level package solder barrier used as vacuum getter
#171Dual layer microelectromechanical systems device and method of manufacturing same
#172Bonded stacked wafers and methods of electroplating bonded stacked wafers
#173Wafer level package solder barrier used as vacuum getter
#174Method and device for producing a microfluidic analysis cartridge
#175Microchip with blocking apparatus
#176Wafer level packaging bond
#177Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
#178Process for manufacturing a lid for an electronic device package, and lid for an electronic device package
#179Micromechanical component
#180Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#181Disposable bond gap control structures
#182Eutectic bonding of thin chips on a carrier substrate
#183Methods for bonding material layers to one another and resultant apparatus
#184Electronic device and fabrication method thereof
#185MEMS devices and methods of forming same
#186Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates
#187BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#188METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
#189Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloy
#190Method of bonding semiconductor substrate and MEMS device
#191Bonded stacked wafers and methods of electroplating bonded stacked wafers
#192Vacuum wafer level packaging method for micro electro mechanical system device
#193Microelectromechanical transducer and corresponding assembly process
#194Methods for embedding conducting material and devices resulting from said methods
#195Disposable bond gap control structures
#196Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom
#197Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device
#198Objects assembly through a sealing bead including intermetallic compounds
#199Micromechanical component and method for producing a micromechanical component
#200Sensor module
#201Wafer level packaging bond
#202ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE
#203Manufacturing method of combined sensor
#204Microelectromechanical systems embedded in a substrate
#205Dual substrate MEMS plate switch and method of manufacture
#206COMPOSITE OBJECT AND METHOD FOR THE PRODUCTION THEREOF
#207Method of forming a micro-electromechanical system (MEMS) having a gap stop
#208Acoustic device with low acoustic loss packaging
#209DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
#210MEMS device package with vacuum cavity by two-step solder reflow method
#211Vertical sensor assembly method
#212Electronic component with mechanically decoupled ball connections
#213Bump Structure With Multiple Layers And Method Of Manufacture
#214Microphone package with minimum footprint size and thickness
#215Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method
#216Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
#217Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component
#218Housed active microstructures with direct contacting to a substrate
#219Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom
#220Method And Apparatus For Localized Bonding
#221Mounting assembly for semiconductor devices
#222MEMS PERFORMANCE IMPROVEMENT USING HIGH GRAVITY FORCE CONDITIONING
#223Method of soldering or brazing articles having surfaces that are difficult to bond
#224Method for mounting semiconductor chips on a substrate and corresponding assembly
#225Reactive nano-layer material for MEMS packaging
#226Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
#227IMPROVED DECAL SOLDER TRANSFER METHOD
#228Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#229Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
#230Methods of manufacture of microisolators and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
#231MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone
#232Semiconductor structure and manufacturing method thereof