84160 ⎘
Forming microstructural systems; Bonding two components Thermal bonding
Sub-classes:INERTIA MEASUREMENT UNIT AND METHOD FOR FORMING THE SAME
#2SENSING ELEMENT AND RELATED METHODS
#3Support Device for One or More MEMS Components
#4SENSING ELEMENT AND RELATED METHODS
#5METHOD FOR PRODUCING AT LEAST ONE FIRST AND ONE SECOND MICROMIRROR DEVICE
#6MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
#7Hybrid ultrasonic transducer and method of forming the same
#8Hybrid ultrasonic transducer and method of forming the same
#9Method for producing optical components using functional elements
#10Semiconductor structure for MEMS Device
#11Method for bonding wafers
#12Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof