84163 ⎘
Forming microstructural systems; Bonding two components; Thermal bonding Thermal bonding techniques not provided for in -
GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
#2Electronic Structure, Inertial Measurement Unit, Electronic Apparatus, And Moving Object
#3METHODS AND SYSTEMS FOR STACKED MICROELECTROMECHANICAL SYSTEM DEVICES
#4CARTRIDGE WITH INTERNAL PILLAR
#5Inertial Sensor And Electronic Component
#6METHOD FOR MANUFACTURING A PACKAGING STRUCTURE
#7MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CONTROLLER DEVICE
#8INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
#9CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE
#10MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
#11MICROMECHANICAL STRUCTURE WITH BONDED COVER
#12INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
#13A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE
#14Method of bonding substrates and separating a portion of the bonded substrates through the bond, such as to manufacture an array of liquid lenses and separate the array into individual liquid lenses
#15Method for bonding wafers, and a wafer
#16Conductive bond structure to increase membrane sensitivity in MEMS device
#17HERMETICALLY SEALED GLASS PACKAGE
#18Sensor Arrangement and Method for Producing a Sensor Arrangement
#19Resonance device and resonance device manufacturing method
#20Micro-acoustic wafer-level package and method of manufacture
#21Method for manufacturing a MEMS sensor
#22Microelectromechanical structure with bonded cover
#23Microelectronics package with vertically stacked MEMS device and controller device
#24Conductive bond structure to increase membrane sensitivity in MEMS device
#25GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
#26Package moisture control and leak mitigation for high vacuum sealed devices
#27Protective wafer including inclined optical windows and device
#28Method for forming hermetic seals in MEMS devices
#29MEMS device formed by at least two bonded structural layers and manufacturing process thereof
#30Encapsulated microelectromechanical structure
#31Semiconductive structure and manufacturing method thereof
#32Wafer level integrated MEMS device enabled by silicon pillar and smart cap
#33Wafer level integrated MEMS device enabled by silicon pillar and smart cap
#34MEMS device formed by at least two bonded structural layers and manufacturing process thereof
#35Method for forming hermetic seals in MEMS devices
#36Wafer level integrated MEMS device enabled by silicon pillar and smart cap
#37Rough anti-stiction layer for MEMS device
#38Encapsulated microelectromechanical structure
#39SEAL RING FOR AL-Ge BONDING
#40Heater design for MEMS chamber pressure control
#41Inter-poly connection for parasitic capacitor and die size improvement
#42Combined ambient pressure and acoustic MEMS sensor
#43Microfluidic circuit element comprising microfluidic channel with nano interstices and fabrication method thereof
#44Semiconductive structure and manufacturing method thereof
#45Rough anti-stiction layer for MEMS device
#46Method for manufacturing a protective wafer including inclined optical windows and device
#47Through silicon via (TSV) formation in integrated circuits
#48MEMS device formed by at least two bonded structural layers and manufacturing process thereof
#49Pattenred film for forming fluid-filled blister, microfluidic blister, and kit and method of forming
#50Preconditioning to enhance hydrophilic fusion bonding
#51Rough anti-stiction layer for MEMS device
#52Method for making a seam-sealable non-magnetic lid and package
#53WIRING STRUCTURE, MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE, METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTING APPARATUS
#54Inter-poly connection for parasitic capacitor and die size improvement
#55MEMS and CMOS integration with low-temperature bonding
#56Wafer-level bonding packaging method and wafer structure
#57Component arrangement with at least two components and method for producing a component arrangement
#58Silicon-on-sapphire device with minimal thermal strain preload and enhanced stability at high temperature
#59THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE
#60Encapsulated microelectromechanical structure
#61MEMS microphone packaging method
#62MONOLITHIC INTEGRATION OF STRESS ISOLATION FEAUTURES IN A MICROELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE
#63Microfluidic circuit element comprising microfluidic channel with nano interstices and fabrication method thereof
#64Forming semiconductor structure with device layers and TRL
#65Method and device for thermocompression bonding
#66Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer
#67Method of manufacturing a switch system
#68Method and device for thermocompression bonding
#69METHOD FOR THE PRODUCTION OF MICRO/NANOFLUIDIC DEVICES FOR FLOW CONTROL AND RESULTING DEVICE
#70Wafer encapsulated microelectromechanical structure and method of manufacturing same
#71Wafer encapsulated microelectromechanical structure and method of manufacturing same
#72Wafer encapsulated microelectromechanical structure and method of manufacturing same
#73Wafer encapsulated microelectromechanical structure and method of manufacturing same
#74Wafer encapsulated microelectromechanical structure and method of manufacturing same
#75Wafer encapsulated microelectromechanical structure and method of manufacturing same
#76Wafer encapsulated microelectromechanical structure and method of manufacturing same
#77Wafer encapsulated microelectromechanical structure and method of manufacturing same
#78Wafer encapsulated microelectromechanical structure and method of manufacturing same
#79Wafer encapsulated microelectromechanical structure and method of manufacturing same