B81C2203/052 - CPC Classification Index

ClassID:

84167 ⎘

B81C2203/052 - CPC Classification

Classification description:

Forming microstructural systems; Aligning components to be assembled Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus

Sub-classes:

B81C2203/054 » using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls 39
B81C2203/055 » using the surface tension of fluid solder to align the elements 6
B81C2203/057 » Passive alignment techniques not provided for in to 14

Recent Application in this class:

20150315014

2015-11-05

Top port MEMS cavity package and method of manufacture thereof