84168 ⎘
Forming microstructural systems; Aligning components to be assembled; Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#2METHODS OF FABRICATING MICRO ELECTRO-MECHANICAL SYSTEMS STRUCTURES
#3WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
#4DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
#5DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
#6HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
#7Anchor Structure
#8METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE
#9PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#10PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#11PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
#12Modular 3-D printed devices for sample delivery and method
#13SEMICONDUCTOR DEVICE
#14Laser-assisted material phase-change and expulsion micro-machining process
#15MEMS package with roughend interface
#16Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same
#17Alignment mark and semiconductor device, and fabrication methods thereof
#18Transfer head and method for transferring micro devices
#19Method for bonding wafers eutectically, and a wafer composite
#20Methods of achieving universal interfacing using suspended and/or freestanding structures
#21MEMS package with roughend interface
#22Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing device
#23Method and apparatus for a seal ring structure
#24Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type
#25Method for manufacturing substrate gap supporter
#26Die bond design for medium pressure sensor
#27Microfluidic device
#28Method of manufacturing a MEMS micro-mirror assembly
#29MEMS micro-mirror assembly
#30Method and device for producing a microfluidic analysis cartridge
#31Three dimensional assembly of diamagnetic materials using magnetic levitation
#32METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY
#33Method and system for improving alignment precision of parts in MEMS
#34Angle control of multi-cavity molded components for MEMS and NEMS group assembly
#35Display device
#36MEMS anchor and spacer structure
#37Package structure having MEMS elements and fabrication method thereof
#38STRUCTURE INCLUDING HOLDER UNIT AND DEVICE UNIT AND FIXING METHOD FOR THE SAME
#39Method of fabricating a micro-mechanical component
#40Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite
#41Semiconductor device and manufacturing method thereof
#42Method and system for improving alignment precision of parts in MEMS
#43ANGLE CONTROL OF MULTI-CAVITY MOLDED COMPONENTS FOR MEMS AND NEMS GROUP ASSEMBLY
#44Semiconductor device and manufacturing method thereof
#45Edge construction on optical devices