B81C2203/057 - CPC Classification Index

ClassID:

84170 ⎘

B81C2203/057 - CPC Classification

Classification description:

Forming microstructural systems; Aligning components to be assembled; Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus Passive alignment techniques not provided for in -

Recent Application in this class:

20190391386

2019-12-26

Coupling a magnet with a MEMS device

20190008479

2019-01-10

Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus

20180244518

2018-08-30

METHOD OF ASSEMBLING NANOSCALE AND MICROSCALE OBJECTS INTO THREE-DIMENSIONAL STRUCTURES

20170297019

2017-10-19

Microscale fluidic devices and components having a fluid retention groove

20150022872

2015-01-22

Method of manufacturing a MEMS micro-mirror assembly

20150009549

2015-01-08

MEMS micro-mirror assembly

20140123461

2014-05-08

Three dimensional assembly of diamagnetic materials using magnetic levitation

20120217286

2012-08-30

Method for mounting a three-axis MEMS device with precise orientation

20100219156

2010-09-02

THREE-DIMENSIONAL MAGNETIC STRUCTURE FOR MICROASSEMBLY

#10

20090324904

2009-12-31

Massively parallel assembly of composite structures using depletion attraction

#11

20090173931

2009-07-09

Methods of Making, Positioning and Orienting Nanostructures, Nanostructure Arrays and Nanostructure Devices

#12

20080293244

2008-11-27

Methods of positioning and/or orienting nanostructures

#13

20080200028

2008-08-21

Methods of positioning and/or orienting nanostructures

#14

20050230356

2005-10-20

Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices