84177 ⎘
Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure; Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
#2SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#3HIGHLY SENSITIVE THERMOELECTRIC-BASED INFRARED DETECTOR WITH HIGH CMOS INTEGRATION
#4CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
#5MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
#6Bottom electrode via structures for micromachined ultrasonic transducer devices
#7Method and structure for CMOS-MEMS thin film encapsulation
#8Bottom electrode via structures for micromachined ultrasonic transducer devices
#9Device for protecting FEOL element and BEOL element
#10Micro-electro mechanical system and manufacturing method thereof
#11ANTENNA APPARATUS
#12Heterogenous integration of complementary metal-oxide-semiconductor and MEMS sensors
#13INTERCONNECTION FOR MONOLITHICALLY INTEGRATED STACKED DEVICES AND METHODS OF FORMING THEREOF
#14Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS
#15Optical electronics device
#16CMOS ultrasonic transducers and related apparatus and methods
#17Integrated structure of mems microphone and air pressure sensor and fabrication method thereof
#18Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
#19MEMS package with roughend interface
#20Bottom electrode via structures for micromachined ultrasonic transducer devices
#21Method and structure for CMOS-MEMS thin film encapsulation
#22Multi-layer sealing film for high seal yield
#23Microelectromechanical component and method for producing same
#24Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof
#25Fence structure to prevent stiction in a MEMS motion sensor
#26Device for protecting FEOL element and BEOL element
#27Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices
#28Electrically controllable integrated switch
#29Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
#30CMOS ultrasonic transducers and related apparatus and methods
#31Antenna apparatus
#32Method for fabricating MEMS device integrated with a semiconductor integrated circuit
#33CMOS ultrasonic transducers and related apparatus and methods
#34Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#35Monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS and method for producing the same
#36Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#37Device for protecting FEOL element and BEOL element
#38Multi-layer sealing film for high seal yield
#39Fence structure to prevent stiction in a MEMS motion sensor
#40Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
#41Manufacturing method for semiconductor structure
#42Heater design for MEMS chamber pressure control
#43Microelectromechanical system structure and method for fabricating the same
#44Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#45Device arrangement
#46Optical electronics device
#47Semiconductor structure and manufacturing method for the same
#48Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#49MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof
#50MEMS package with roughend interface
#51Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer
#52CMOS ultrasonic transducers and related apparatus and methods
#53Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#54MEMS structure with bilayer stopper and method for forming the same
#55Method and structure for CMOS-MEMS thin film encapsulation
#56Protection schemes for MEMS switch devices
#57Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices
#58Support pillar
#59Microelectromechanical system structure including thermal stability layer whose material has higher growth temperature, and method for fabricating the same
#60Support pillar
#61Support pillar
#62Display element, display device, or electronic device
#63Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#64INTEGRATED MEMS TRANSDUCER AND CIRCUITRY
#65CMOS ultrasonic transducers and related apparatus and methods
#66Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#67METHOD OF ADDRESSING FILM LIFTOFF IN MEMS FABRICATION
#68INTEGRATED MEMS-CMOS DEVICES AND INTEGRATED CIRCUITS WITH MEMS DEVICES AND CMOS DEVICES
#69Heater design for MEMS chamber pressure control
#70CMOS ultrasonic transducers and related apparatus and methods
#71Double-side process silicon MOS and passive devices for RF front-end modules
#72Optical electronic device and method of fabrication
#73MEMS structure with an etch stop layer buried within inter-dielectric layer
#74Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#75Release chemical protection for integrated complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) devices
#76Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#77Integrated circuit with a pressure sensor
#78Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#79Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
#80Chip structure
#81Support pillar
#82Semiconductor pressure sensor and method of fabricating same
#83MEMS device and fabrication method
#84CMOS ultrasonic transducers and related apparatus and methods
#85MEMS microphone and method for forming the same
#86Device and method for protecting FEOL element and BEOL element
#87Methods and structures of integrated MEMS-CMOS devices
#88Method of manufacturing an integrated circuit comprising a pressure sensor
#89Electrically controllable integrated switch
#90Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
#91Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
#92Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
#93DOUBLE-SIDE PROCESS SILICON MOS AND PASSIVE DEVICES FOR RF FRONT-END MODULES
#94Cavity structures for MEMS devices
#95Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
#96Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#97Devices with thinned wafer
#98Method for producing a microelectromechanical device and microelectromechanical device
#99Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices
#100Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit
#101Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices
#102Mechanisms for forming micro-electro mechanical device
#103Low temperature ceramic Microelectromechanical structures
#104Technique for forming a MEMS device
#105MEMS device and fabrication method
#106Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
#107MEMS package structure
#108Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same
#109Cavity structures for MEMS devices
#110CMOS ultrasonic transducers and related apparatus and methods
#111Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit
#112Micromechanical structure, in particular sensor arrangement, and corresponding operating method
#113Hybrid integrated component and method for the manufacture thereof
#114Integrated circuit with pressure sensor having a pair of electrodes
#115Hybrid integrated component and method for the manufacture thereof
#116Method for manufacturing a hybrid integrated component
#117Electronic device
#118Fully embedded micromechanical device, system on chip and method for manufacturing the same
#119Method for producing a microelectromechanical device and microelectromechanical device
#120INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME
#121Method for integrating MEMS microswitches on GaN substrates comprising electronic power components
#122Method of making a microfluidic device
#123CMOS compatible MEMS microphone and method for manufacturing the same
#124LOW TEMPERATURE BI-CMOS COMPATIBLE PROCESS FOR MEMS RF RESONATORS AND FILTERS
#125MEMS package structure
#126MEMS sensing device and method for making same
#127Method and structure of monolithetically integrated inertial sensor using IC foundry-compatible processes
#128CAVITY STRUCTURES FOR MEMS DEVICES
#129Semiconductor device and wafer structure
#130Method of fabricating sensors having functionalized resonating beams
#131Micromechanical component
#132METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES IN LOWER NODE DESIGNS
#133Making of a microelectronic device including a monocrystalline silicon NEMS component and a transistor the gate of which is made in the same layer as the mobile structure of this component
#134Method for manufacturing semiconductor device including microstructure
#135Method of forming suspension object on monolithic substrate
#136SEMICONDUCTOR DEVICE
#137Method for manufacturing a micro-electromechanical structure
#138Thin film wafer level package
#139Method for Manufacturing Microelectronic Devices and Devices According to Such Methods
#140CMOS-MEMS cantilever structure
#141MEMS integrated chip and method for making same
#142Planar microshells for vacuum encapsulated devices and damascene method of manufacture
#143Planar microshells for vacuum encapsulated devices and damascene method of manufacture
#144Microshells with integrated getter layer
#145Low temperature ceramic microelectromechanical structures
#146Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
#147Method for fabricating micro-electro-mechanical system (MEMS) device
#148Electronic device and method for manufacturing thereof
#149MEMS DEVICE WITH A COMPOSITE BACK PLATE ELECTRODE AND METHOD OF MAKING THE SAME
#150Sub-threshold forced plate FET sensor for sensing inertial displacements, a method and system thereof
#151Method and system for MEMS devices
#152Electric component and method of manufacturing the electric component
#153MEMS package structure and method for fabricating the same
#154Method for fabricating a multilayer microstructure with balancing residual stress capability
#155Method for forming MEMS devices having low contact resistance and devices obtained thereof
#156MEMS device and method of fabricating the same
#157Electronic device and method for manufacturing thereof
#158MICROFABRICATION METHODS FOR FORMING ROBUST ISOLATION AND PACKAGING
#159Method for fabricating micro-electro-mechanical system (MEMS) device
#160METHOD FOR MANUFACTURING A MICROMACHINED DEVICE
#161MEMS based RF components with vertical motion and parallel-plate structure and manufacture thereof using standard CMOS technologies
#162Semiconductor device
#163Adjustable solubility in sacrificial layers for microfabrication
#164Micromechanical component and method for its production
#165Method for manufacturing a sensor device
#166Micro-electro-mechanical systems (MEMS) device
#167Micro-electro-mechanical systems (MEMS) device and process for fabricating the same
#168Low temperature ceramic microelectromechanical structures
#169METHODS FOR MANUFACTURING CMOS COMPATIBLE BIO-SENSORS
#170Sensor device and production method therefor
#171Semiconductor device with integrated circuit electrically connected to a MEMS sensor by a through-electrode
#172Micro-electro-mechanical system device and method for making same
#173Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
#174Forming a cantilever assembly for vertical and lateral movement
#175MEMS devices with an etch stop layer
#176MEMS ELEMENT FABRICATION METHOD AND MEMS ELEMENT
#177Electronic device and method for manufacturing thereof
#178Methods of and Apparatus for Forming Three-Dimensional Structures Integral with Semiconductor Based Circuitry
#179SEMICONDUCTOR ARRAY AND METHOD FOR MANUFACTURING A SEMICONDUCTOR ARRAY
#180Method for monolithically integrating silicon carbide microelectromechanical devices with electronic circuitry
#181Controlling stress in MEMS structures
#182Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#183Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#184Method of forming an acceleration sensor
#185Integrated CMOS-MEMS technology for wired implantable sensors
#186Switch, semiconductor device, and manufacturing method thereof
#187MEMS pressure sensing device
#188Semiconductor device
#189Monolithic vertical integration of an acoustic resonator and electronic circuitry
#190Fabrication of advanced silicon-based MEMS devices
#191Method of manufacturing an electronic device and electronic device
#192Microelectromechanical system microphone fabrication including signal processing circuitry on common substrate
#193Method of manufacturing a semiconductor device having MEMS
#194CMOS-MEMS process
#195Light modulator with integrated drive and control circuitry
#196Microelectronic mechanical system and methods
#197Method of fabricating micro-electromechanical systems
#198Systems and methods for integration of heterogeneous circuit devices
#199MEMS devices monolithically integrated with drive and control circuitry
#200Hybrid CMOS-MEMS devices adapted for high-temperature operation and method for their manufacture
#201Monolithic integration of MEMS and IC devices
#202Structure and formation method of semiconductor device structure
#203Integrated MEMS-CMOS devices and methods for fabricating MEMS devices and CMOS devices