Patents-Review.com
ClassID:

84182 ⎘

B81C2203/0771 - CPC Classification

Classification description:

Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure; Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure; Topology for facilitating the monolithic integration Stacking the electronic processing unit and the micromechanical structure

Recent Application in this class:
#1
20250236509
2025-07-24

MEMS MIRROR MODULE WITH STRESS-DECOUPLED VIBRATIONAL MODES

 #2
20240228264
2024-07-11

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

 #3
20240132340
2024-04-25

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

 #4
20240100565
2024-03-28

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

 #5
20230163103
2023-05-25

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

 #6
20230092132
2023-03-23

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

 #7
20220162062
2022-05-26

Heterogenous integration of complementary metal-oxide-semiconductor and MEMS sensors

 #8
20210206630
2021-07-08

Method for producing monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS

 #9
20210155472
2021-05-27

Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit

 #10
20210139320
2021-05-13

Optical electronics device

 #11
20210114060
2021-04-22

CMOS ultrasonic transducers and related apparatus and methods

 #12
20200391996
2020-12-17

MEMS device and manufacturing method thereof

 #13
20200346925
2020-11-05

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

 #14
20200299129
2020-09-24

Nano-electromechanical system (NEMS) device structure and method for forming the same

 #15
20200270121
2020-08-27

Multi-layer sealing film for high seal yield

 #16
20200140265
2020-05-07

Fence structure to prevent stiction in a MEMS motion sensor

 #17
20200115222
2020-04-16

Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices

 #18
20200083011
2020-03-12

Electrically controllable integrated switch

 #19
20200024135
2020-01-23

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

 #20
20190388935
2019-12-26

CMOS ultrasonic transducers and related apparatus and methods

 #21
20190345029
2019-11-14

Method for fabricating MEMS device integrated with a semiconductor integrated circuit

 #22
20190283081
2019-09-19

CMOS ultrasonic transducers and related apparatus and methods

 #23
20190237512
2019-08-01

Micro-structured organic sensor device and method for manufacturing same

 #24
20190210869
2019-07-11

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #25
20190177160
2019-06-13

Monolithic integration of piezoelectric micromachined ultrasonic transducers and CMOS and method for producing the same

 #26
20190164956
2019-05-30

Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods

 #27
20190152769
2019-05-23

Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit

 #28
20190092622
2019-03-28

Multi-layer sealing film for high seal yield

 #29
20190062153
2019-02-28

Fence structure to prevent stiction in a MEMS motion sensor

 #30
20190055120
2019-02-21

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

 #31
20190047850
2019-02-14

Microfabricated ultrasonic transducers and related apparatus and methods

 #32
20190016591
2019-01-17

Manufacturing method for semiconductor structure

 #33
20180334383
2018-11-22

Nano-electromechanical system (NEMS) device structure and method for forming the same

 #34
20180257930
2018-09-13

Optical electronics device

 #35
20180208460
2018-07-26

Semiconductor structure and manufacturing method for the same

 #36
20180186628
2018-07-05

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #37
20180162725
2018-06-14

MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof

 #38
20180148326
2018-05-31

Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer

 #39
20180133756
2018-05-17

CMOS ultrasonic transducers and related apparatus and methods

 #40
20180130795
2018-05-10

Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods

 #41
20180086627
2018-03-29

Integrating MEMS structures with interconnects and vias

 #42
20180044168
2018-02-15

Process for manufacturing a semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit and corresponding semiconductor device

 #43
20180029882
2018-02-01

Integration scheme for microelectromechanical systems (MEMS) devices and complementary metal-oxide-semiconductor (CMOS) devices

 #44
20180009656
2018-01-11

Strain and pressure sensing device, microphone, method for manufacturing strain and pressure sensing device, and method for manufacturing microphone

 #45
20170283254
2017-10-05

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #46
20170225196
2017-08-10

CMOS ultrasonic transducers and related apparatus and methods

 #47
20170210613
2017-07-27

Nano-electromechanical system (NEMS) device structure and method for forming the same

 #48
20170153158
2017-06-01

Micro feedback-chamber sensor and method of manufacturing such sensor

 #49
20170097270
2017-04-06

Pressure sensor and method for producing the pressure sensor

 #50
20170056926
2017-03-02

CMOS ultrasonic transducers and related apparatus and methods

 #51
20170044009
2017-02-16

Optical electronic device and method of fabrication

 #52
20170029271
2017-02-02

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #53
20160379973
2016-12-29

Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods

 #54
20160377497
2016-12-29

Integrated circuit with a pressure sensor

 #55
20160368764
2016-12-22

Integration of active devices with passive components and MEMS devices

 #56
20160264409
2016-09-15

MEMS device and fabrication method

 #57
20160264400
2016-09-15

CMOS ultrasonic transducers and related apparatus and methods

 #58
20160236931
2016-08-18

MEMS PRESSURE SENSOR AND METHOD FOR FORMING THE SAME

 #59
20160214855
2016-07-28

Device and method for protecting FEOL element and BEOL element

 #60
20160167957
2016-06-16

Method of manufacturing an integrated circuit comprising a pressure sensor

 #61
20160148880
2016-05-26

Electronic device with stacked chips

 #62
20160133546
2016-05-12

Method of making a semiconductor device package with dummy gate

 #63
20160115013
2016-04-28

CMOS integrated moving-gate transducer with silicon as a functional layer

 #64
20160107886
2016-04-21

Electrically controllable integrated switch

 #65
20160075551
2016-03-17

Backside bulk silicon MEMS

 #66
20160002027
2016-01-07

Semiconductor device with through molding vias and method of making the same

 #67
20150353344
2015-12-10

Cavity structures for MEMS devices

 #68
20150298170
2015-10-22

Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods

 #69
20150251896
2015-09-10

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #70
20150137303
2015-05-21

Mechanisms for forming micro-electro mechanical device

 #71
20150118779
2015-04-30

Strain and pressure sensing device, microphone, method for manufacturing strain and pressure sensing device, and method for manufacturing microphone

 #72
20150014794
2015-01-15

Integrated circuit provided with a device for detecting its spatial orientation and/or a modification of this orientation

 #73
20150001632
2015-01-01

MEMS device and fabrication method

 #74
20140363968
2014-12-11

Method of making a semiconductor device package

 #75
20140264660
2014-09-18

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #76
20140252422
2014-09-11

Cavity structures for MEMS devices

 #77
20140219062
2014-08-07

CMOS ultrasonic transducers and related apparatus and methods

 #78
20140175525
2014-06-26

CMOS integrated moving-gate transducer with silicon as a functional layer

 #79
20140162393
2014-06-12

Multi-axis integrated MEMS devices with CMOS circuits and method therefor

 #80
20140162392
2014-06-12

Method of forming a suspended structure and a transistor co-integrated on a same substrate

 #81
20140154841
2014-06-05

Hermetic wafer level packaging

 #82
20140117475
2014-05-01

Hybrid integrated component

 #83
20140117470
2014-05-01

Backside bulk silicon MEMS

 #84
20140035071
2014-02-06

Substrate with multiple encapsulated devices

 #85
20140021515
2014-01-23

Micromechanical structure, in particular sensor arrangement, and corresponding operating method

 #86
20130334621
2013-12-19

Hybrid integrated component and method for the manufacture thereof

 #87
20130328142
2013-12-12

Integrated circuit with pressure sensor having a pair of electrodes

 #88
20130285166
2013-10-31

Hybrid integrated component and method for the manufacture thereof

 #89
20130285165
2013-10-31

Method for manufacturing a hybrid integrated component

 #90
20130285122
2013-10-31

Electronic device

 #91
20130170669
2013-07-04

Strain and pressure sensing device, microphone, method for manufacturing strain and pressure sensing device, and method for manufacturing microphone

 #92
20130161702
2013-06-27

INTEGRATED MEMS DEVICE

 #93
20130144542
2013-06-06

Analysis device including a MEMS and/or NEMS network

 #94
20130099292
2013-04-25

Semiconductor device and method for manufacturing same

 #95
20130001550
2013-01-03

HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS

 #96
20120223613
2012-09-06

Electrical bypass structure for MEMS device

 #97
20120211805
2012-08-23

CAVITY STRUCTURES FOR MEMS DEVICES

 #98
20120126433
2012-05-24

METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES IN LOWER NODE DESIGNS

 #99
20120098122
2012-04-26

Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates

 #100
20120025389
2012-02-02

Hermetic wafer level packaging

 #101
20110291167
2011-12-01

SEMICONDUCTOR DEVICE

 #102
20110241137
2011-10-06

Integrated circuit and fabricating method thereof

 #103
20110163399
2011-07-07

Method for Manufacturing Microelectronic Devices and Devices According to Such Methods

 #104
20110140210
2011-06-16

MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME

 #105
20110121416
2011-05-26

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

 #106
20110121415
2011-05-26

Planar microshells for vacuum encapsulated devices and damascene method of manufacture

 #107
20110121412
2011-05-26

Microshells with integrated getter layer

 #108
20110101533
2011-05-05

Integrated (multilayer) circuits and process of producing the same

 #109
20100295138
2010-11-25

METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES

 #110
20090194768
2009-08-06

Vertical system integration

 #111
20090134513
2009-05-28

Method and structures for fabricating MEMS devices on compliant layers

 #112
20090134492
2009-05-28

Devices for fabricating tri-layer beams

 #113
20080318356
2008-12-25

Semiconductor apparatus and method for manufacturing the same

 #114
20080284611
2008-11-20

Vertical system integration

 #115
20080254572
2008-10-16

Vertical system integration

 #116
20080251941
2008-10-16

Vertical system integration

 #117
20080237591
2008-10-02

Vertical system integration

 #118
20080218844
2008-09-11

MEMS devices with an etch stop layer

 #119
20070273018
2007-11-29

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

 #120
20050023656
2005-02-03

Vertical system integration