ClassID:

90112

C04B2237/74 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating Forming laminates or joined articles comprising at least two different interlayers separated by a substrate

Recent Application in this class:
#1
20260066155
2026-03-05

MONOLITHIC FUNCTIONAL CERAMIC ELEMENT AND METHOD FOR PRODUCING A CONTACT FOR A FUNCTIONAL CERAMIC

#2
20240312678
2024-09-19

POSITIVE TEMPERATURE COEFFICIENT CERAMIC THERMISTOR ELEMENT HAVING STRONG REDUCING ATMOSPHERE RESISTANCE AND PREPARATION METHOD THEREFOR

#3
20230286872
2023-09-14

PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD

#4
20230202137
2023-06-29

Bonded assembly, and ceramic circuit substrate and semiconductor device using the same

#5
20230140614
2023-05-04

Multi-layer composite ceramic plate and manufacturing method thereof

#6
20220263168
2022-08-18

Ceramic materials and seals for high temperature reactive material devices

#7
20210292246
2021-09-23

Termination feedthrough unit with ceramic insulator for vacuum and corrosive applications

#8
20210036273
2021-02-04

Ceramic materials and seals for high temperature reactive material devices

#9
20190226512
2019-07-25

Brazed joint and semiconductor processing chamber component having the same

#10
20190194078
2019-06-27

Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applications

#11
20190150298
2019-05-16

Ceramic circuit substrate and method for producing ceramic circuit substrate

#12
20190126373
2019-05-02

Ceramic-metal structure

#13
20180090726
2018-03-29

Ceramic materials and seals for high temperature reactive material devices

#14
20170200517
2017-07-13

Dispersion ceramic micro-encapsulated (DCM) nuclear fuel and related methods

#15
20170181272
2017-06-22

Ceramic circuit board and method for producing same

#16
20160358840
2016-12-08

Ceramic circuit board

#17
20160184913
2016-06-30

Method of manufacturing a ceramic metallization for ceramic metal transition

#18
20160016245
2016-01-21

Method for manufacturing power module substrate

#19
20120308839
2012-12-06

Method for assembling parts made of SiC materials by non-reactive brazing, brazing compositions, and joint and assembly obtained by said method

#20
20120285627
2012-11-15

Elastomer Bonded Item and Method for Debonding

#21
20120281362
2012-11-08

Silicon nitride substrate, circuit substrate and electronic device using the same

#22
20120135268
2012-05-31

Process for joining stainless steel part and silicon nitride ceramic part and composite articles made by same

#23
20110065973
2011-03-17

Double transition joint for the joining of ceramics to metals

#24
20100327537
2010-12-30

Hermetic sealing assembly and electrical device including the same

#25
20100035024
2010-02-11

Bonded metal and ceramic plates for thermal management of optical and electronic devices

#26
20100032143
2010-02-11

Microheat exchanger for laser diode cooling

#27
20090320605
2009-12-31

Optical interferometric pressure sensor

#28
20090214881
2009-08-27

LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME

#29
20080284059
2008-11-20

Process for applying a thermal barrier coating to a ceramic matrix composite

#30
20070042121
2007-02-22

Thermostructural composite structure with a compositional gradient, its manufacturing process

#31
20050013985
2005-01-20

Thermostructural composite structure with a compositional gradient and its manufacturing process

#32
15270233
2019-05-28

Materials, devices, and methods for producing strong magnetic-flux pinning in superconducting materials by including sites having high electronic effective mass and charge carrier density