C04B2237/86 - CPC Classification Index

ClassID:

90119 ⎘

C04B2237/86 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate

Recent Application in this class:

20260049038

2026-02-19

APPARATUS AND METHOD FOR SUBSTRATE-BACKED PORCELAIN

20250034049

2025-01-30

APPARATUS AND METHOD FOR SUBSTRATE-BACKED PORCELAIN

20210257270

2021-08-19

Cover lid with selective and edge metallization and methods of making

20200231508

2020-07-23

Compound Monolithic 3-D Fused FHD/S Products and Method

20200170118

2020-05-28

Method for manufacturing ceramic circuit board

20200006213

2020-01-02

Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board

20190390566

2019-12-26

Article having ceramic wall with flow turbulators

20190350078

2019-11-14

METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

20190126373

2019-05-02

Ceramic-metal structure

#10

20190074416

2019-03-07

Silica glass member, process for producing the same, and process for bonding ceramic and silica glass

#11

20190002359

2019-01-03

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

#12

20190002358

2019-01-03

Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate

#13

20180334914

2018-11-22

Local two-layer thermal barrier coating

#14

20180213639

2018-07-26

Method for producing a composite material

#15

20180190568

2018-07-05

Ceramic metal circuit board and semiconductor device using the same

#16

20180135457

2018-05-17

Article having ceramic wall with flow turbulators

#17

20180093927

2018-04-05

Method for producing a metal-ceramic substrate

#18

20180009043

2018-01-11

Ceramic milling cutter

#19

20180002239

2018-01-04

Method of Joining Metal-Ceramic Substrates to Metal Bodies

#20

20180002237

2018-01-04

High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same

#21

20170229361

2017-08-10

Cover lid with selective and edge metallization

#22

20170226020

2017-08-10

Method for producing a ceramic component composed of a plurality of joined preforms and component obtained by the method

#23

20170141011

2017-05-18

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

#24

20170053852

2017-02-23

Power-module substrate unit and power module

#25

20160358801

2016-12-08

Joined body manufacturing method and joined body

#26

20160304405

2016-10-20

Method for producing a metal-ceramic substrate

#27

20160236995

2016-08-18

Patterned abradable coating and methods for the manufacture thereof

#28

20160230568

2016-08-11

Ceramic matrix composite gas turbine engine blade

#29

20160219693

2016-07-28

Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

#30

20160176162

2016-06-23

Graphene and polymer-free method for transferring CVD grown graphene onto hydrophobic substrates

#31

20160163617

2016-06-09

Ceramic circuit board and electronic device

#32

20160159066

2016-06-09

Method of making a ceramic matrix composite (CMC) component including a protective ceramic layer

#33

20160053619

2016-02-25

CMC blade with integral 3D woven platform

#34

20160052830

2016-02-25

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

#35

20160001388

2016-01-07

Manufacturing method of power-module substrate

#36

20150354936

2015-12-10

Component including structures for determinant loading

#37

20150328706

2015-11-19

Power-module substrate and manufacturing method thereof

#38

20150270026

2015-09-24

Composite body, honeycomb structural body, and method for manufacturing composite body

#39

20150257252

2015-09-10

Semiconductor circuit board, semiconductor device using the same, and method for manufacturing semiconductor circuit board

#40

20150230334

2015-08-13

Metal-ceramic substrate and method for producing a metal-ceramic substrate

#41

20150219114

2015-08-06

Tension device graphite component used in molten metal

#42

20150219113

2015-08-06

Tension device with internal passage

#43

20150219112

2015-08-06

Threaded tensioning device

#44

20150219111

2015-08-06

Tensioning device extending beyond component

#45

20150203412

2015-07-23

Method for brazing parts made from a composite material, with anchoring of the brazed joint

#46

20150174703

2015-06-25

Method for the brazing of parts made from a composite material, incorporating a slug in the bond

#47

20150144385

2015-05-28

Circuit board and electronic apparatus including the same

#48

20150083305

2015-03-26

Method for applying heat resistant protection components onto a surface of a heat exposed component

#49

20150055303

2015-02-26

Power module substrate with heat sink, and method for producing power module substrate with heat sink

#50

20150049442

2015-02-19

Ceramic circuit board and electronic device

#51

20140345914

2014-11-27

Metal-ceramic substrate

#52

20140342107

2014-11-20

Heat shield with outer fiber winding and high-temperature furnace and gas converter having a heat shield

#53

20140294692

2014-10-02

Honeycomb structure and manufacturing method of the same

#54

20140291699

2014-10-02

Ceramic/copper circuit board and semiconductor device

#55

20140287227

2014-09-25

Joint material, and jointed body

#56

20140192486

2014-07-10

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

#57

20140186102

2014-07-03

Compositions for joining and assembling parts made of SiC-based materials

#58

20130335921

2013-12-19

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

#59

20130334742

2013-12-19

Method and system for fabricating dome shaped LTCC substrates

#60

20130251939

2013-09-26

Process for producing ceramic composite components

#61

20130247349

2013-09-26

Method for manufacturing plate for cement industry tube mill

#62

20130232783

2013-09-12

Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

#63

20130196780

2013-08-01

Shaft and post tensioning device

#64

20130098867

2013-04-25

Method for Selective Metallization on a Ceramic Substrate

#65

20130064602

2013-03-14

Method for assembling, joining parts made of SiC-based materials by non-reactive brazing with addition of a reinforcement, brazing compositions and joint and assembly obtained by said method

#66

20130048214

2013-02-28

Method for the siliceous bonding of coated and uncoated optical bodies

#67

20130004326

2013-01-03

CMC blade with integral 3D woven platform

#68

20130004235

2013-01-03

Method for joining, assembling parts made of SiC-based materials by non-reactive brazing, brazing compositions, and joint and assembly obtained by said method

#69