99166 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
Solvent-less ionic liquid epoxy resin
#2Phenylphosphine oxide and oxygen stable epoxy polymers and methods of synthesis
#3Thermoset epoxy resin, its preparing composition and making process thereof
#4Solvent-less ionic liquid epoxy resin
#5Flame retardant levulinic acid-based compounds
#6Phosphorous containing epoxy resins and process for synthesis
#7Levoglucosan-based flame retardant compounds
#8Resveratrol-based flame retardant materials
#9Solvent-less ionic liquid epoxy resin
#10Pinene-based flame retardant compounds
#11Levoglucosan-based flame retardant compounds
#12Flame retardant levulinic acid-based compounds
#13Resveratrol-based flame retardant materials
#14Resveratrol-based flame retardant materials
#15EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION OF EPOXY RESIN COMPOSITION
#16High-CTI and halogen-free epoxy resin composition for copper-clad plates and use thereof
#17PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF
#18Phosphorus containing epoxy compounds and compositions therefrom
#19Epoxy resin blend
#20Epoxy resin composition for fiber-reinforced composite material
#21Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#22Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#23Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
#24Coating/sealant systems, aqueous resinous dispersions, and methods of electrocoating
#25PHOSPHORUS-CONTAINING EPOXY RESIN
#26COATING COMPOSITIONS FOR CONTAINERS
#27Coating compositions with improved adhesion to containers
#28Curable phosphorus-containing flame retardant epoxy resin
#29Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#30Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#31Oligomeric phosphonates and compositions including the same
#32Hyperbranched oligomeric phosphonates and compositions including the same
#33Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#34Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#35Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#36Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same
#37EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL
#38Adhesive resin compositions, and laminates and flexible printed wiring boards using same
#39ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME
#40Phosphorus-containing benzoxazine-based bisphenols, derivatives thereof, and preparing method for the same
#41Phosphorus-containing epoxy resin and method for synthesizing the same
#42Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
#43Phosphorus-containing compounds useful for making halogen-free ignition-resistant polymers
#44Reacting compound having H-P=O, P-H or P-OH group with functional group-containing organic compound
#45Electrodeposition coatings including a lanthanide series element for use over aluminum substrates
#46SOLID POWDER FORMULATIONS FOR THE PREPARATION OF RESIN-COATED FOILS AND THEIR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS
#47EPOXY RESIN FORMULATIONS
#48Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same
#49RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
#50EPOXY RESIN BLEND
#51Electrocoat composition and process replacing phosphate pretreatment
#52Coating composition with phosphorous-containing resins and organometallic compounds
#53Electrocoat composition and process replacing phosphate pretreatment
#54High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
#55Resin composition for forming insulating layer of printed wiring board
#56Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition
#57Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications
#58Resin composition and application thereof
#59Electrodeposition coatings for use over aluminum substrates
#60Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
#61Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent
#62Phosphorus Containing Compounds Useful for Making Halogen-Free, Ignition-Resistant Polymer
#63Aqueous composition of reaction product of epoxy and phosphorus materials with curing agent
#641, 4-Hydroquinone functionalized phosphinates and phosphonates
#65Curing agents for epoxy resins, use thereof and epoxy resin cured therewith
#66Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition
#67Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
#68Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
#69Phosphorous containing compounds and process for synthesis