C08G59/30 - CPC Classification Index

ClassID:

99164 ⎘

C08G59/30 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen

Sub-classes:

C08G59/302 » {containing sulfur} 48
C08G59/304 » {containing phosphorus} 68
C08G59/306 » {containing silicon} 122
C08G59/308 » {containing halogen atoms} 32

Recent Application in this class:

20210095128

2021-04-01

High-refractive-index composition, high-refractive-index film, and method for manufacturing high-refractive-index film

20200385515

2020-12-10

Curable epoxy system

20200123309

2020-04-23

Antimony free flame-retarded epoxy compositions

20180162989

2018-06-14

Low temperature curing composition, cured film formed therefrom, and electronic device having cured film

20180094098

2018-04-05

Curable composition for lens, lens and optical device

20170327630

2017-11-16

RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

20160311968

2016-10-27

Curable composition for lens, lens and optical device

20160237202

2016-08-18

Silicone-modified epoxy resin and composition and cured article thereof

20140048316

2014-02-20

Epoxy resin compound and radiant heat circuit board using the same

#10

20130012088

2013-01-10

MOLDING MATERIAL HAVING VIBRATION-DAMPING PROPERTY AND MOLDED ARTICLE

#11

20120256354

2012-10-11

Methods and materials for fabricating microfluidic devices

#12

20100324164

2010-12-23

Photocurable resin composition and optical component using the same

#13

20100311936

2010-12-09

High thermal conductivity materials with grafted surface functional groups

#14

20100311867

2010-12-09

Resin composition for manufacturing marble chips, method for manufacturing marble chips, and artificial marble made from marble chips

#15

20100255312

2010-10-07

X-Ray Opaque Coating

#16

20100164368

2010-07-01

Radiation or thermally curable barrier sealants

#17

20100092764

2010-04-15

Epoxy resin varnishes, laminates and printed circuit boards

#18

20100044640

2010-02-25

High refractive index materials and composites

#19

20100025094

2010-02-04

Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board

#20