ClassID:

99168

C08G59/308 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms

Recent Application in this class:
#1
20250129203
2025-04-24

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER

#2
20240199791
2024-06-20

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

#3
20230128079
2023-04-27

ANTIMONY FREE FLAME-RETARDED EPOXY COMPOSITIONS

#4
20230125986
2023-04-27

Novolak Resin, Epoxy Resin, Photosensitive Resin Composition, Curable Resin Composition, Cured Substance, Electronic Device, Production Method for Novolak Resin, and Production Method for Epoxy Resin

#5
20220298294
2022-09-22

COMPOSITION, CURABLE COMPOSITION, AND CURED PRODUCT

#6
20220264775
2022-08-18

Electromagnetic and thermal shields with low-dimensional materials

#7
20220081507
2022-03-17

Fluorine-containing epoxy resin for electrical materials and method for manufacturing same

#8
20210380756
2021-12-09

Thermoset epoxy resin, its preparing composition and making process thereof

#9
20210221970
2021-07-22

Thermoplastic polymer-based composite material and preparation method thereof

#10
20210214550
2021-07-15

Epoxy resin formulations

#11
20200385514
2020-12-10

EPOXY RESIN COMPOSITION

#12
20200299455
2020-09-24

Organofluorine modified epoxy resins for increasing surface flashover voltage, and preparation methods and applications thereof

#13
20200123307
2020-04-23

Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same

#14
20190382591
2019-12-19

Coatings

#15
20190345326
2019-11-14

LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME

#16
20180201776
2018-07-19

EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION OF EPOXY RESIN COMPOSITION

#17
20180072830
2018-03-15

Fluorinated compound, curable composition and cured product

#18
20170253691
2017-09-07

Thermally expandable fire resistant resin composition

#19
20170166695
2017-06-15

Process for the production of brominated polyether polyols

#20
20160215443
2016-07-28

Brominated epoxy polymers as textile-finishing flame retardant formulations

#21
20150291835
2015-10-15

Fluorine-modified epoxy acrylic resin, UV-curable varnish and method for preparing the same, and method for coating the varnish on a substrate

#22
20150291773
2015-10-15

Thermal expansion resin composition

#23
20150284525
2015-10-08

Thermally expandable resin composition

#24
20140161982
2014-06-12

Epoxy resin blend

#25
20130143046
2013-06-06

EPOXY RESIN COMPOSITION, AND PREPREG AND METAL-CLAD LAMINATE USING THE SAME

#26
20120122362
2012-05-17

Filler paste, coating painting and composite for coating wooden poles

#27
20110250459
2011-10-13

EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, AND MULTI-LAYER BOARD

#28
20110172357
2011-07-14

COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME

#29
20110065045
2011-03-17

Epoxy-functionalized perfluoropolyether polyurethanes

#30
20100317785
2010-12-16

Thermosetting resin for expediting a thermosetting process

#31
20100255740
2010-10-07

EPOXY RESIN BLEND

#32
20100159765
2010-06-24

Prepreg and resin for preparing the same

#33
20100092764
2010-04-15

Epoxy resin varnishes, laminates and printed circuit boards